17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)

IC PACKAGE WITH LEDS

Organization Name

Intel Corporation

Inventor(s)

Brandon C. Marin of Gilbert AZ (US)

Khaled Ahmed of San Jose CA (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

Paul West of Portland OR (US)

Kristof Darmawikarta of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

IC PACKAGE WITH LEDS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17949857 titled 'IC PACKAGE WITH LEDS

Simplified Explanation

The abstract describes an integrated circuit (IC) package that includes a glass substrate, a micro light emitting diode (LED), a semiconductor die, through glass vias (TGVs), and a package substrate. The micro LED is positioned over the glass substrate, with the TGVs integrated into the glass substrate connecting the micro LED to the semiconductor die. The semiconductor die is connected to the package substrate to receive external signals when connected to a motherboard.

• Glass substrate, micro LED, semiconductor die, TGVs, and package substrate are components of the IC package.
• TGVs are integrated into the glass substrate to connect the micro LED to the semiconductor die.
• The semiconductor die is connected to the package substrate to receive external signals when connected to a motherboard.

Potential Applications

The technology can be applied in:

• LED displays
• Wearable technology
• Automotive lighting systems

Problems Solved

• Improved connectivity between components in IC packages
• Enhanced signal reception for semiconductor dies

Benefits

• Higher performance and reliability in IC packages
• Increased efficiency in signal transmission

Potential Commercial Applications

1. 1. 1. Enhanced Connectivity in IC Packages: Advantages and Applications

Possible Prior Art

No prior art information is available at this time.

Unanswered Questions

How does this technology impact the overall size of IC packages?

The abstract does not provide information on the size implications of this technology.

What are the potential cost implications of implementing this technology in IC packages?

The abstract does not address the cost factors associated with this innovation.

Original Abstract Submitted

Integrated circuit (IC) packages are disclosed. In some embodiments, an IC package includes a glass substrate, a micro light emitting diode (LED), a semiconductor die, one or more through glass vias (TGVs) and a package substrate. The micro LED is positioned over the glass substrate. The TGVs are integrated into the glass substrate and connect the micro LED to the semiconductor die. The semiconductor die is connected to the package substrate to receive external signals when connected to a motherboard.