17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)

INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION

Organization Name

Intel Corporation

Inventor(s)

Srinivasan Raman of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Jason Scott Steill of Phoenix AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Yi Yang of Gilbert AZ (US)

INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17957590 titled 'INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION

Simplified Explanation

The patent application describes semiconductor assemblies with embedded components in glass core layers. Here is a simplified explanation of the abstract:

• Glass core layers in semiconductor assemblies have embedded components.
• The components are embedded in one or more cavities in the glass core.
• The embedded components are at least partially embedded in the glass core.
• A semiconductor die is attached to the substrate.

Potential Applications

The technology could be used in:

• Advanced semiconductor devices
• High-performance electronics
• Aerospace and defense systems

Problems Solved

This technology addresses:

• Enhanced integration of components
• Improved thermal management
• Increased reliability of semiconductor assemblies

Benefits

The benefits of this technology include:

• Higher performance and efficiency
• Reduced size and weight of electronic devices
• Enhanced durability and longevity

Potential Commercial Applications

Potential commercial applications include:

• Consumer electronics
• Automotive systems
• Medical devices

Possible Prior Art

One possible prior art could be the use of traditional substrate materials in semiconductor assemblies, which may not offer the same level of integration and thermal management as glass core layers with embedded components.

Unanswered Questions

How does the embedded component affect the overall performance of the semiconductor assembly?

The article does not delve into specific performance metrics or comparisons with traditional semiconductor assemblies.

What are the limitations of embedding components in glass core layers?

The article does not discuss any potential drawbacks or challenges associated with this technology.

Original Abstract Submitted

Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.