17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation)

ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT

Organization Name

Intel Corporation

Inventor(s)

Jeremy Ecton of Gilbert AZ (US)

Robert Alan May of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Brandon C. Marin of Gilbert AZ (US)

ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17937894 titled 'ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT

Simplified Explanation

The patent application describes a package substrate with a core made of insulative material, first conductive traces on the core's surface, and buildup layers with second conductive traces in an organic dielectric material. The first conductive traces consist of a first metal and a second metal, with varying concentrations of the metals in different regions of the traces.

• The package substrate includes a core made of insulative material.
• First conductive traces are in contact with the core's surface.
• Buildup layers contain second conductive traces in an organic dielectric material.
• The first conductive traces consist of a first metal and a second metal.
• The concentration of the metals varies between different regions of the traces.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as integrated circuits, sensors, and other semiconductor components.

Problems Solved

This innovation helps improve the performance and reliability of electronic devices by providing a more efficient and reliable package substrate design.

Benefits

The benefits of this technology include enhanced electrical conductivity, improved signal transmission, and overall better functionality of electronic devices.

Potential Commercial Applications

This technology could be used in the production of consumer electronics, telecommunications equipment, automotive electronics, and industrial machinery.

Possible Prior Art

One possible prior art could be the use of multilayer printed circuit boards in electronic devices to provide electrical connections between components.

How does this technology compare to existing package substrate designs in terms of cost-effectiveness?

This article does not provide information on the cost implications of implementing this technology compared to traditional package substrate designs. Further research or analysis would be needed to determine the cost-effectiveness of this innovation.

What impact does the non-uniform variation of metal concentrations in the conductive traces have on the overall performance of electronic devices?

The article does not delve into the specific effects of the non-uniform variation of metal concentrations on the performance of electronic devices. Additional studies or experiments may be required to understand the implications of this aspect of the technology.

Original Abstract Submitted

Embodiments provides for a package substrate, including: a core comprising insulative material; first conductive traces in contact with a surface of the core; and buildup layers in contact with the first conductive traces and the surface of the core, the buildup layers comprising second conductive traces in an organic dielectric material. The first conductive traces comprise at least a first metal and a second metal, the first conductive traces comprise a first region proximate to and in contact with the core and a second region distant from the core, parallel and opposite to the first region, a relative concentration of the first metal to the second metal is higher in the first region than in the second region, and the relative concentration of the first metal to the second metal between the first region and the second region varies non-uniformly.