17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

Organization Name

Intel Corporation

Inventor(s)

Jason Scott Steill of Phoenix AZ (US)

Shayan Kaviani of Phoenix AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Srinivasan Raman of Chandler AZ (US)

Yi Yang of Gilbert AZ (US)

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17957257 titled 'EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

Simplified Explanation

The abstract describes a semiconductor assembly with embedded components in glass core layers, including cavities for embedding components and attaching semiconductor dies.

• Glass core layers in semiconductor assemblies can have embedded components.
• Components are embedded into the glass core at cavities.
• The components are at least partially embedded in the glass core.
• Semiconductor dies are attached to the substrate.

Potential Applications

The technology of embedding components in glass core layers for semiconductor assemblies can be applied in various industries such as electronics, telecommunications, and automotive for advanced and compact electronic devices.

Problems Solved

This technology solves the problem of integrating components into semiconductor assemblies in a more efficient and compact manner, reducing the overall size of electronic devices while maintaining functionality.

Benefits

The benefits of this technology include increased integration density, improved thermal performance, enhanced reliability, and reduced manufacturing complexity in semiconductor assemblies.

Potential Commercial Applications

The potential commercial applications of this technology include the production of smaller and more efficient electronic devices, advanced sensors, communication devices, and automotive electronics.

Possible Prior Art

One possible prior art could be the use of traditional substrate materials such as silicon or ceramic for embedding components in semiconductor assemblies. Glass core layers offer advantages such as improved thermal properties and reduced manufacturing costs compared to traditional materials.

How does the embedding of components in glass core layers affect the overall performance of semiconductor assemblies?

The article does not provide specific details on how the embedding of components in glass core layers impacts the performance metrics of semiconductor assemblies, such as speed, power consumption, or reliability.

What are the potential challenges or limitations of embedding components in glass core layers for semiconductor assemblies?

The article does not address any potential challenges or limitations that may arise when embedding components in glass core layers, such as compatibility issues with certain components or manufacturing processes.

Original Abstract Submitted

Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.