17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)

COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS

Organization Name

Intel Corporation

Inventor(s)

Brandon C. Marin of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Jeremy D. Ecton of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Hiroki Tanaka of Gilbert AZ (US)

Pooya Tadayon of Portland OR (US)

COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17943915 titled 'COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS

Simplified Explanation

The abstract describes interposers made of glass with cavities and vias for electronic applications.

• Glass substrate interposers with cavities and vias:

   * Interposers are made of glass substrates.
   * They have a cavity on one surface and a via below it.
   * A pad is located in the cavity over the via.
   * Another pad is on the opposite surface under the via.

Potential Applications

Glass substrate interposers can be used in:

• High-speed electronic devices
• Microelectronics
• Semiconductor packaging

Problems Solved

Glass substrate interposers address issues such as:

• Thermal management
• Electrical performance
• Miniaturization of electronic devices

Benefits

The benefits of glass substrate interposers include:

• Improved signal integrity
• Enhanced thermal dissipation
• Higher reliability in electronic systems

Potential Commercial Applications

Glass substrate interposers can be applied in:

• 5G communication systems
• Automotive electronics
• Internet of Things (IoT) devices

Unanswered Questions

How does the glass material affect the performance of the interposers compared to other materials?

Glass substrates offer unique properties that may impact the electrical and thermal characteristics of the interposers, but further research is needed to fully understand these effects.

What are the limitations of using glass substrate interposers in harsh environments?

The durability and reliability of glass substrate interposers in extreme conditions, such as high temperatures or mechanical stress, require investigation to determine their suitability for such applications.

Original Abstract Submitted

Embodiments disclosed herein include interposers and methods of forming interposers. In an embodiment, an interposer comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass. In an embodiment, the interposer further comprises a cavity into the first surface of the substrate, a via through the substrate below the cavity, a first pad in the cavity over the via, and a second pad on the second surface of the substrate under the via.