Intel corporation (20240112973). METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract

METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS

Organization Name

intel corporation

Inventor(s)

Jeremy D. Ecton of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Brandon Christian Marin of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240112973 titled 'METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS

Simplified Explanation

In this patent application, through-glass vias (TGVs) are formed without the need for a planarization step. Here are some key points to explain the innovation:

• Holes are filled with a material that is then etched, along with the glass layer.
• The top and bottom surfaces of the glass layer are recessed relative to the fill material, creating fill material stubs.
• TGV pads are formed on these fill material stubs, potentially with protrusions extending away from the glass layer surface.
• If the TGVs are plated through-holes, a portion of the metal lining the inner wall of the hole can extend into the TGV pad.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as integrated circuits, sensors, and MEMS devices.

Problems Solved

This innovation eliminates the need for a planarization step in the formation of through-glass vias, simplifying the manufacturing process and potentially reducing costs.

Benefits

The benefits of this technology include improved efficiency in the production of electronic devices, as well as the potential for more reliable connections between different layers of the device.

Potential Commercial Applications

The potential commercial applications of this technology could include the production of high-performance electronic devices for various industries, such as telecommunications, automotive, and healthcare.

Possible Prior Art

One possible prior art for this technology could be the use of planarization steps in the formation of through-glass vias in electronic devices.

How does this technology compare to existing methods for forming through-glass vias without planarization steps?

This article does not provide a direct comparison with existing methods for forming through-glass vias without planarization steps. Further research or testing may be needed to determine the specific advantages of this innovation over other techniques.

What are the potential limitations or challenges of implementing this technology in large-scale manufacturing processes?

The article does not address the potential limitations or challenges of implementing this technology in large-scale manufacturing processes. Factors such as scalability, cost-effectiveness, and compatibility with existing manufacturing equipment could be important considerations that need to be explored further.

Original Abstract Submitted

through-glass vias (tgvs) are formed without the use of a planarization step to planarize the tgv fill material after filling holes that extend through a glass layer with the fill material. after the holes are filled with the fill material, the fill material is etched and the glass layer is etched. after etching of the glass is performed, the top and bottom surfaces of the glass layer are recessed relative to the top and bottom surfaces of the fill material in the holes, resulting in formation of fill material stubs. tgv pads are then formed on the fill material stubs. the resulting pads can have protrusions that extend away from a surface of the glass layer. if the tgvs are plated through-holes, a portion of the metal lining the inner wall of a tgv hole can extend past a surface of the glass layer and into a tgv pad.