17837732. TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS simplified abstract (Intel Corporation)

TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS

Organization Name

Intel Corporation

Inventor(s)

Benjamin T. Duong of Phoenix AZ (US)

Brian P. Balch of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Darko Grujicic of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Xing Sun of Chandler AZ (US)

Marcel A. Wall of Phoenix AZ (US)

Yi Yang of Gilbert AZ (US)

TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17837732 titled 'TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS

Simplified Explanation

The patent application describes techniques for creating thin-film resistors in vias of a glass substrate interposer. The resistors are formed vertically through the vias, saving space on the interposer layer. They can be used for power dissipation, voltage control, current control, or as pull-up/pull-down resistors.

• Thin-film resistors are created in through-glass vias of a glass substrate interposer.
• The resistors are formed vertically through the vias, rather than horizontally on a layer of the interposer.
• The thin-film resistors do not occupy a significant amount of area on the interposer layer.
• The resistors can be used for various purposes such as power dissipation, voltage control, current control, or as pull-up/pull-down resistors.

Potential Applications

• Power dissipation
• Voltage control
• Current control
• Pull-up/pull-down resistors

Problems Solved

• Limited space on the interposer layer for resistors
• Need for vertical resistor placement
• Efficient power dissipation and voltage/current control

Benefits

• Saves space on the interposer layer
• Enables vertical resistor placement
• Provides flexibility for various applications
• Efficient power dissipation and voltage/current control

Original Abstract Submitted

Techniques for thin-film resistors in vias are disclosed. In the illustrative embodiment, thin-film resistors are formed in through-glass vias of a glass substrate of an interposer. The thin-film resistors do not take up a significant amount of area on a layer of the interposer, as the thin-film resistor extends vertically through a via rather than horizontally on a layer of the interposer. The thin-film resistors may be used for any suitable purpose, such as power dissipation or voltage control, current control, as a pull-up or pull-down resistor, etc.