17958053. METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract (Intel Corporation)

METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS

Organization Name

Intel Corporation

Inventor(s)

Jeremy D. Ecton of Gilbert AZ (US)

Gang Duan of Chandler AZ (US)

Brandon Christian Marin of Gilbert AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Srinivas V. Pietambaram of Chandler AZ (US)

METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17958053 titled 'METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS

Simplified Explanation

The patent application describes a method for forming through-glass vias (TGVs) without the need for a planarization step. After filling holes that extend through a glass layer with fill material, the fill material and glass layer are etched to create fill material stubs on which TGV pads are formed. The resulting pads may have protrusions extending away from the glass layer surface.

• Formation of through-glass vias (TGVs) without planarization step
• Filling holes in glass layer with fill material
• Etching fill material and glass layer to create fill material stubs
• Forming TGV pads on fill material stubs
• Protrusions on TGV pads extending away from glass layer surface

Potential Applications

The technology could be applied in the manufacturing of microelectronics, MEMS devices, sensors, and other miniaturized electronic components requiring through-glass vias.

Problems Solved

This method eliminates the need for a planarization step, simplifying the manufacturing process for through-glass vias and reducing production costs.

Benefits

• Cost-effective manufacturing process
• Simplified fabrication of through-glass vias
• Improved efficiency in creating TGV pads

Potential Commercial Applications

• Microelectronics industry
• MEMS device manufacturers
• Sensor technology companies

Possible Prior Art

One possible prior art could be the use of planarization steps in the formation of through-glass vias, which can be time-consuming and costly.

How does this method compare to traditional planarization techniques for through-glass vias?

The article does not provide a direct comparison between this method and traditional planarization techniques for through-glass vias. Further research or experimentation would be needed to evaluate the efficiency and effectiveness of this new approach compared to existing methods.

What are the potential challenges or limitations of this new method in practical applications?

The article does not address potential challenges or limitations that may arise when implementing this method in practical applications. It would be important to consider factors such as scalability, compatibility with existing manufacturing processes, and the reliability of the resulting through-glass vias.

Original Abstract Submitted

Through-glass vias (TGVs) are formed without the use of a planarization step to planarize the TGV fill material after filling holes that extend through a glass layer with the fill material. After the holes are filled with the fill material, the fill material is etched and the glass layer is etched. After etching of the glass is performed, the top and bottom surfaces of the glass layer are recessed relative to the top and bottom surfaces of the fill material in the holes, resulting in formation of fill material stubs. TGV pads are then formed on the fill material stubs. The resulting pads can have protrusions that extend away from a surface of the glass layer. If the TGVs are plated through-holes, a portion of the metal lining the inner wall of a TGV hole can extend past a surface of the glass layer and into a TGV pad.