17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation)

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HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER

Organization Name

Intel Corporation

Inventor(s)

Hiroki Tanaka of Gilbert AZ (US)

Brandon C. Marin of Gilbert AZ (US)

Robert Alan May of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17957600 titled 'HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER

Simplified Explanation

The patent application describes a hybrid plasmonic waveguide that combines an electromagnetic wave in a high refractive index waveguide with a surface plasmon from a metal surface to create a hybrid plasmon wave in a low refractive index material separating the dielectric waveguide and metal surface.

  • Hybrid plasmonic waveguide combines electromagnetic wave and surface plasmon.
  • Can be surface-mounted or embedded in glass interposers.

Potential Applications

The technology can be applied in:

  • High-speed data transmission
  • Sensing applications

Problems Solved

The technology addresses:

  • Signal loss in traditional waveguides
  • Limited bandwidth in conventional systems

Benefits

The benefits of this technology include:

  • Increased data transmission speeds
  • Enhanced signal quality
  • Improved sensitivity in sensing applications

Potential Commercial Applications

The technology can be utilized in:

  • Telecommunications industry
  • Biomedical devices

Possible Prior Art

Prior art in plasmonic waveguides and hybrid plasmonic systems may exist, but specific examples are not provided in this patent application.

Unanswered Questions

How does this technology compare to existing plasmonic waveguides in terms of efficiency and performance?

This article does not provide a direct comparison between the hybrid plasmonic waveguide and existing plasmonic waveguides in terms of efficiency and performance.

What are the potential challenges in scaling up this technology for commercial applications?

The article does not address the potential challenges in scaling up this technology for commercial applications, such as manufacturing costs or integration with existing systems.


Original Abstract Submitted

A hybrid plasmonic waveguide and associated methods are disclosed. In one example, the electronic device includes combining an electromagnetic wave propagating in a waveguide with a high refractive index and a surface plasmon from a metal surface to create a hybrid plasmon wave in a low refractive index material separating the dielectric waveguide and metal surface. In selected examples, surface mounted hybrid plasmonic waveguides are shown. In selected examples hybrid plasmonic waveguides embedded in glass interposers are shown.