Applied Materials, Inc. patent applications published on November 9th, 2023
Summary of the patent applications from Applied Materials, Inc. on November 9th, 2023
Applied Materials, Inc. has recently filed several patents related to semiconductor processing and equipment. These patents cover various aspects of the semiconductor manufacturing process, including impedance tuning, defect correction, film deposition, etching, and substrate handling.
In terms of impedance tuning, one patent application describes a method for measuring voltage and current signals of a transmission line in a semiconductor processing tool. These analog signals are then converted into digital signals, and a u-vector is calculated from them. The real components of the u-vector are used to determine the position of a first capacitor, while the imaginary components are used to determine the position of a second capacitor.
Another patent application focuses on correcting defects in microLED structures caused by a mesa etch process. The method involves a dry etch process that incrementally removes a small outer layer of the structures, preserving their overall shape. The resulting smooth surface is suitable for the application of a dielectric layer. The dry etch process consists of two steps: the first gas reacts with the surface to form a gallium compound layer, and the second gas selectively removes that layer. This process can be plasma-based or reactive thermal etches.
Applied Materials, Inc. has also filed patents related to film deposition and etching. One patent application describes methods for depositing transition metal dichalcogenide films on a substrate, as well as converting transition metal oxide films to transition metal dichalcogenide films. The process involves exposing the substrate to metal and chalcogenide precursors to form the desired films.
In terms of etching, one patent application describes a method for etching metal-containing features using a pattern mask. The exposed portion of the feature is then etched and replaced with a filler dielectric, reducing unwanted conductivity between adjacent features.
Applied Materials, Inc. has also developed innovative equipment for semiconductor processing. One patent application describes a process chamber with coaxial lift devices, including a bottom bowl lift and a pedestal lift. These lifts can independently move and tilt to create a small and symmetric process volume, improving film uniformity on processed substrates.
In summary, Applied Materials, Inc. has recently filed patents covering various aspects of semiconductor processing, including impedance tuning, defect correction, film deposition, etching, and equipment design. These patents demonstrate the company's commitment to advancing semiconductor manufacturing processes and improving the efficiency and quality of semiconductor devices.
Notable applications:
- Impedance tuning in semiconductor processing tools.
- Defect correction in microLED structures.
- Deposition of transition metal dichalcogenide films.
- Etching of metal-containing features.
- Coaxial lift devices for process chambers.
- Semiconductor processing using carbon-containing precursors.
- Plasma etch pulse for sample etching.
- Semiconductor processing using silicon and carbon precursors.
Contents
- 1 Patent applications for Applied Materials, Inc. on November 9th, 2023
- 1.1 OZONE-BASED LOW TEMPERATURE SILICON OXIDE COATING FOR PHARMACEUTICAL APPLICATIONS (18199625)
- 1.2 CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL (18356604)
- 1.3 Carrier Head Membrane With Regions of Different Roughness (18351260)
- 1.4 COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM (17735655)
- 1.5 POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL (17735674)
- 1.6 METHODS, SYSTEMS, AND APPARATUS FOR INKJET PRINTING SELF-ASSEMBLED MONOLOAYER (SAM) STRUCTURES ON SUBSTRATES (18142305)
- 1.7 ALD CYCLE TIME REDUCTION USING PROCESS CHAMBER LID WITH TUNABLE PUMPING (18224206)
- 1.8 APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY (17862138)
- 1.9 RF MEASUREMENT FROM A TRANSMISSION LINE SENSOR (17737682)
- 1.10 METHODS AND MECHANISMS FOR ADJUSTING FILM DEPOSITION PARAMETERS DURING SUBSTRATE MANUFACTURING (17737318)
- 1.11 HIGH BANDWIDTH ARCHITECTURE FOR CENTRALIZED COHERENT CONTROL AT THE EDGE OF PROCESSING TOOL (17737659)
- 1.12 CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (17737670)
- 1.13 OPTICAL DEVICE IMPROVEMENT (18131997)
- 1.14 TEMPERATURE AND BIAS CONTROL OF EDGE RING (18356915)
- 1.15 AUTONOMOUS FREQUENCY RETRIEVAL FROM PLASMA POWER SOURCES (17737665)
- 1.16 LARGE AREA GAPFILL USING VOLUMETRIC EXPANSION (17737340)
- 1.17 SILICON-AND-CARBON-CONTAINING MATERIALS WITH LOW DIELECTRIC CONSTANTS (17737328)
- 1.18 PULSED ETCH PROCESS (17738526)
- 1.19 LOW TEMPERATURE CARBON GAPFILL (17737311)
- 1.20 WAFER FILM FRAME CARRIER (17735623)
- 1.21 COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING (18356553)
- 1.22 COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING (18356579)
- 1.23 SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS (18224861)
- 1.24 CONFORMAL METAL DICHALCOGENIDES (17739856)
- 1.25 DRY TREATMENT FOR SURFACE LOSS REMOVAL IN MICRO-LED STRUCTURES (17736843)
- 1.26 IMPEDANCE TUNING UTILITY OF VECTOR SPACE DEFINED BY TRANSMISSION LINE QUANTITIES (17737677)
Patent applications for Applied Materials, Inc. on November 9th, 2023
OZONE-BASED LOW TEMPERATURE SILICON OXIDE COATING FOR PHARMACEUTICAL APPLICATIONS (18199625)
Main Inventor
Fei Wang
CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL (18356604)
Main Inventor
Hari Soundararajan
Carrier Head Membrane With Regions of Different Roughness (18351260)
Main Inventor
Young J. Paik
COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM (17735655)
Main Inventor
Jeonghoon Oh
POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL (17735674)
Main Inventor
Jeonghoon Oh
METHODS, SYSTEMS, AND APPARATUS FOR INKJET PRINTING SELF-ASSEMBLED MONOLOAYER (SAM) STRUCTURES ON SUBSTRATES (18142305)
Main Inventor
Yingdong LUO
ALD CYCLE TIME REDUCTION USING PROCESS CHAMBER LID WITH TUNABLE PUMPING (18224206)
Main Inventor
Muhannad Mustafa
APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY (17862138)
Main Inventor
Zubin HUANG
RF MEASUREMENT FROM A TRANSMISSION LINE SENSOR (17737682)
Main Inventor
David Coumou
METHODS AND MECHANISMS FOR ADJUSTING FILM DEPOSITION PARAMETERS DURING SUBSTRATE MANUFACTURING (17737318)
Main Inventor
Mitesh Sanghvi
HIGH BANDWIDTH ARCHITECTURE FOR CENTRALIZED COHERENT CONTROL AT THE EDGE OF PROCESSING TOOL (17737659)
Main Inventor
David Coumou
CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (17737670)
Main Inventor
David Coumou
OPTICAL DEVICE IMPROVEMENT (18131997)
Main Inventor
Yue CHEN
TEMPERATURE AND BIAS CONTROL OF EDGE RING (18356915)
Main Inventor
James ROGERS
AUTONOMOUS FREQUENCY RETRIEVAL FROM PLASMA POWER SOURCES (17737665)
Main Inventor
David Coumou
LARGE AREA GAPFILL USING VOLUMETRIC EXPANSION (17737340)
Main Inventor
Supriya Ghosh
SILICON-AND-CARBON-CONTAINING MATERIALS WITH LOW DIELECTRIC CONSTANTS (17737328)
Main Inventor
Zeqing Shen
PULSED ETCH PROCESS (17738526)
Main Inventor
Yifeng Zhou
LOW TEMPERATURE CARBON GAPFILL (17737311)
Main Inventor
Supriya Ghosh
WAFER FILM FRAME CARRIER (17735623)
Main Inventor
Jason A. Rye
COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING (18356553)
Main Inventor
Jason M. SCHALLER
COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING (18356579)
Main Inventor
Jason M. SCHALLER
SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS (18224861)
Main Inventor
Suketu Arun PARIKH
CONFORMAL METAL DICHALCOGENIDES (17739856)
Main Inventor
Chandan Das
DRY TREATMENT FOR SURFACE LOSS REMOVAL IN MICRO-LED STRUCTURES (17736843)
Main Inventor
Michel Khoury
IMPEDANCE TUNING UTILITY OF VECTOR SPACE DEFINED BY TRANSMISSION LINE QUANTITIES (17737677)
Main Inventor
David Coumou