US Patent Application 18356604. CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL simplified abstract

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CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL

Organization Name

Applied Materials, Inc.


Inventor(s)

Hari Soundararajan of Sunnyvale CA (US)

Shou-Sung Chang of Mountain View CA (US)

Haosheng Wu of San Jose CA (US)

Jianshe Tang of San Jose CA (US)

CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18356604 titled 'CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL

Simplified Explanation

The patent application describes a chemical mechanical polishing apparatus that is used for polishing substrates.

  • The apparatus includes a platen with a top surface that holds a polishing pad.
  • A carrier head is used to hold the substrate against the polishing surface of the pad during the polishing process.
  • The apparatus also includes a temperature monitoring system.
  • The temperature monitoring system uses a non-contact thermal sensor positioned above the platen.
  • The sensor has a field of view that covers a portion of the polishing pad.
  • The sensor can be rotated by a motor to move the field of view across the polishing pad.
  • The purpose of the temperature monitoring system is to measure the temperature of the polishing pad during the polishing process.


Original Abstract Submitted

A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.

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