US Patent Application 17862138. APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY simplified abstract

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APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY

Organization Name

Applied Materials, Inc.


Inventor(s)

Zubin Huang of Santa Clara CA (US)

Jallepally Ravi of San Ramon CA (US)

Cheng Cheng of San Jose CA (US)

Peiqi Wang of Campbell CA (US)

Kai Wu of Palo Alto CA (US)

APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 17862138 titled 'APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY

Simplified Explanation

The abstract describes a shadow ring for a processing chamber, such as a semiconductor processing chamber, that includes a feature to reduce heat transfer between its lip and the rest of the body.

  • The shadow ring is an annular member with a lip that projects inwardly.
  • It is used in processing chambers, particularly in semiconductor processing.
  • The innovation includes a feature that mitigates heat transfer between the lip and the rest of the body.
  • This feature consists of a series of apertures that extend from the upper surface to the lower surface of the shadow ring.
  • The apertures are connected by necks, creating bottlenecks that hinder conductive heat transfer.
  • The purpose of this design is to reduce the amount of heat transferred between the lip and the rest of the body.
  • By reducing heat transfer, the shadow ring can help maintain the desired temperature within the processing chamber.
  • This innovation can improve the efficiency and effectiveness of semiconductor processing.


Original Abstract Submitted

A shadow ring for a processing chamber, such as a semiconductor processing chamber, is an annular member including a body with a radially inwardly projecting lip. The shadow ring includes a feature that mitigates heat transfer between the lip and the rest of the body. In one example, the feature includes a plurality of apertures, each aperture extending from an upper opening at an upper surface of the shadow ring to a corresponding lower opening at a lower surface of the shadow ring. A neck between adjacent apertures creates a bottleneck that hinders conductive heat transfer.