US Patent Application 17735655. COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM simplified abstract
Contents
COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM
Organization Name
Inventor(s)
Jeonghoon Oh of Saratoga CA (US)
Andrew Nagengast of Sunnyvale CA (US)
Steven M. Zuniga of Soquel CA (US)
Eric L. Lau of Santa Clara CA (US)
Hari Prasath Rajendran of Coimbatore (IN)
Satish Radhakrishnan of San Jose CA (US)
Kuen-Hsiang Chen of Sunnyvale CA (US)
Ekaterina A. Mikhaylichenko of San Jose CA (US)
COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 17735655 titled 'COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM
Simplified Explanation
- The patent application describes carrier heads for a chemical mechanical polishing apparatus. - The carrier heads have a carrier body and a substrate mounting surface. - The carrier heads have an inner ring that surrounds the edge of a substrate. - The inner ring can be moved radially. - The carrier heads also have an outer ring that is in contact with the inner ring.
Original Abstract Submitted
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that is sized and shaped to circumferentially surround a peripheral edge of a substrate positioned against the substrate mounting surface. The inner ring may be characterized by a first end having a first surface that faces the carrier body and a second end having a second surface opposite the first surface. The second end of the inner ring may be radially displaceable. The carrier heads may include an outer ring having an inner surface that is disposed against an outer surface of the inner ring.
