US Patent Application 17737670. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER simplified abstract

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CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER

Organization Name

Applied Materials, Inc.


Inventor(s)

David Coumou of Webster NY (US)

Zhi Wang of Sunnyvale CA (US)

Tao Zhang of San Ramon CA (US)

David Peterson of San Jose CA (US)

CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17737670 titled 'CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER

Simplified Explanation

The abstract describes a process power controller for a plasma processing tool.

  • The process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller.
  • The source predictor is connected to both the process power source optimizer and the process uniformity controller.
  • The process power controller is designed to optimize the power source for the plasma processing tool.
  • The source predictor helps in predicting the power requirements for the process.
  • The process uniformity controller ensures that the process is carried out uniformly.
  • The process power controller improves the efficiency and effectiveness of the plasma processing tool.


Original Abstract Submitted

Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.