US Patent Application 17737318. METHODS AND MECHANISMS FOR ADJUSTING FILM DEPOSITION PARAMETERS DURING SUBSTRATE MANUFACTURING simplified abstract
Contents
METHODS AND MECHANISMS FOR ADJUSTING FILM DEPOSITION PARAMETERS DURING SUBSTRATE MANUFACTURING
Organization Name
Inventor(s)
Mitesh Sanghvi of Dublin CA (US)
Venkatanarayana Shankarmurthy of San Jose CA (US)
Yulian Yao of Santa Clara CA (US)
Chuan Ying Wang of San Jose CA (US)
Xinhai Han of Palo Alto CA (US)
METHODS AND MECHANISMS FOR ADJUSTING FILM DEPOSITION PARAMETERS DURING SUBSTRATE MANUFACTURING - A simplified explanation of the abstract
This abstract first appeared for US patent application 17737318 titled 'METHODS AND MECHANISMS FOR ADJUSTING FILM DEPOSITION PARAMETERS DURING SUBSTRATE MANUFACTURING
Simplified Explanation
The patent application describes an electronic device manufacturing system that collects data about a deposition process performed on a substrate. This process creates multiple layers on the substrate's surface.
- The system also obtains an expected profile for the process, which includes desired thickness values for each layer.
- Using the collected data and the expected profile, the system generates a correction profile. This correction profile includes a deposition time offset value for at least one layer.
- The system then creates an updated process recipe by applying the correction profile to the original process recipe.
- Finally, the system performs a deposition step on the substrate based on the updated process recipe.
Original Abstract Submitted
An electronic device manufacturing system capable of obtaining metrology data associated with a deposition process performed on a substrate according to a process recipe, wherein the deposition process generates a plurality of layers on a surface of the substrate. The manufacturing system can further obtain an expected profile associate with the process recipe, wherein the expected profile comprises a plurality of values indicative of a desired thickness for a plurality of layers of the process recipe. The manufacturing system can further generate a correction profile based on the metrology data and the expected profile, wherein the correction profile comprises a deposition time offset value for at least one layer of the plurality of layers. The manufacturing system can further generate an updated process recipe by applying the correction profile to the process recipe and cause a deposition step to be performed on the substrate according to the updated process recipe.
