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Category:CPC H01J37/32724
Pages in category "CPC H01J37/32724"
The following 91 pages are in this category, out of 91 total.
1
- 18025018. PLASMA PROCESSING APPARATUS simplified abstract (HITACHI HIGH-TECH CORPORATION)
- 18074385. Heated Pedestal With Impedance Matching Radio Frequency (RF) Rod simplified abstract (Applied Materials, Inc.)
- 18093138. Programmable Electrostatic Chuck to Enhance Aluminum Film Morphology simplified abstract (Applied Materials, Inc.)
- 18122574. APPARATUS AND METHODS FOR CONTROLLING SUBSTRATE TEMPERATURE DURING PROCESSING simplified abstract (Applied Materials, Inc.)
- 18158379. BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS simplified abstract (Applied Materials, Inc.)
- 18209649. SUBSTRATE SUPPORT (Applied Materials, Inc.)
- 18236201. SUSCEPTOR HEAT TRANSFER (Applied Materials, Inc.)
- 18244180. SUBSTRATE SUPPORT ASSEMBLY WITH IMPROVED THERMAL UNIFORMITY (Applied Materials, Inc.)
- 18334038. RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKING (Applied Materials, Inc.)
- 18403982. BIASABLE ELECTROSTATIC CHUCK simplified abstract (Applied Materials, Inc.)
- 18416880. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18421988. PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18540331. SUBSTRATE PROCESSING DEVICE AND METHOD FOR MANUFACTURING SAME simplified abstract (LG DISPLAY CO., LTD.)
- 18542776. SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS simplified abstract (SEMES CO., LTD.)
- 18603584. ETCHING METHOD, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM simplified abstract (Tokyo Electron Limited)
- 18653097. FAST RESPONSE PEDESTAL ASSEMBLY FOR SELECTIVE PRECLEAN simplified abstract (Applied Materials, Inc.)
- 18675260. MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS (NGK INSULATORS, LTD.)
- 18680297. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18694088. PLASMA PROCESSING APPARATUS AND MANUFACTURING METHOD OF WAFER STAGE FOR PLASMA PROCESSING APPARATUS (HITACHI HIGH-TECH CORPORATION)
- 18748263. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18762910. SUBSTRATE PROCESSING APPARATUS (Samsung Electronics Co., Ltd.)
- 18796952. SUBSTRATE SUPPORT DEVICE AND METHOD OF CONTROLLING PREVENTION OF LEAKAGE OF TEMPERATURE CONTROL FLUID (SEMES CO., LTD.)
- 18826150. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (SEMES CO., LTD.)
- 18895491. WAFER PLACEMENT TABLE (NGK INSULATORS, LTD.)
- 18956301. SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)
- 18957942. SUBSTRATE PROCESSING APPARATUS (Tokyo Electron Limited)
- 19010578. SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK (Tokyo Electron Limited)
2
- 20250174441. Substrate Processing Ap (Tokyo Electron Limited)
- 20250174442. Substrate Support P (Tokyo Electron Limited)
- 20250183013. Electrostatic Chuck Plasma (SEMES ., .)
- 20250183014. Electrostatic Chuck Plasma (SEMES ., .)
- 20250183015. High Power Cable (Lam Research)
- 20250232962. Plasma Processin (Hitachi High-Tech)
- 20250232963. Substrate Processing Ap (Tokyo Electron Limited)
A
- Applied materials, inc. (20240249924). BIPOLAR ELECTROSTATIC CHUCK ELECTRODE DESIGNS simplified abstract
- Applied materials, inc. (20240282556). FAST RESPONSE PEDESTAL ASSEMBLY FOR SELECTIVE PRECLEAN simplified abstract
- Applied materials, inc. (20240412957). HIGH TEMPERATURE BIASABLE HEATER WITH ADVANCED FAR EDGE ELECTRODE, ELECTROSTATIC CHUCK, AND EMBEDDED GROUND ELECTRODE
- Applied materials, inc. (20240420932). SUBSTRATE SUPPORT
- Applied materials, inc. (20240420933). RESISTIVITY-CONTROLLED DIELECTRIC MATERIALS FOR SUBSTRATE SUPPORTS WITH IMPROVED HIGH TEMPERATURE CHUCKING
- Applied materials, inc. (20250069864). SUSCEPTOR HEAT TRANSFER
- Applied materials, inc. (20250087468). SUBSTRATE SUPPORT ASSEMBLY WITH IMPROVED THERMAL UNIFORMITY
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on August 22nd, 2024
- Applied Materials, Inc. patent applications on December 12th, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on February 20th, 2025
- Applied Materials, Inc. patent applications on February 27th, 2025
- Applied Materials, Inc. patent applications on July 25th, 2024
- Applied Materials, Inc. patent applications on March 13th, 2025
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- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240258084). APPARATUS AND METHOD FOR PLASMA ETCHING
- Samsung electronics co., ltd. (20240258084). APPARATUS AND METHOD FOR PLASMA ETCHING simplified abstract
- Samsung electronics co., ltd. (20240379334). COOLANT TUBE BLOCK ASSEMBLY AND SEMICONDUCTOR PROCESSING DEVICE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250022693). ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
- Samsung electronics co., ltd. (20250149311). SUBSTRATE PROCESSING APPARATUS
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
- Samsung Electronics Co., Ltd. patent applications on November 14th, 2024
- SAMSUNG ELECTRONICS CO.,LTD Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
- SEMES CO., LTD. Patent Application Trends in 2024
T
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Tokyo electron limited (20240339305). SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- Tokyo Electron Limited patent applications on October 10th, 2024