ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME

Abstract: disclosed are an electrostatic chuck capable of precisely controlling the temperature of a peripheral area of a substrate and a plasma processing apparatus including the same. the electrostatic chuck configured to support a substrate in a plasma processing apparatus includes a plate configured to support the substrate using electrostatic force and having a disc shape, a first partition wall formed in an annular shape on a peripheral portion of the plate, a second partition wall formed in an annular shape at a position farther inward than the first partition wall on the peripheral portion of the plate, and a connection partition wall configured to interconnect the first partition wall and the second partition wall to partition the peripheral portion of the plate into a plurality of peripheral areas.

Inventor(s): Jong Joon JEON, Hyung Joon KIM, Jong Gun LEE, Jun Seok PARK

CPC Classification: H01J37/32724 (Gas-filled discharge tubes (heating by discharge ))

Search for rejections for patent application number 20250183013