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20250174441. Substrate Processing Ap (Tokyo Electron Limited)

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Substrate Processing Apparatus

Abstract: there is a substrate processing apparatus comprising: a processing chamber; a placing table disposed in the processing chamber and having a first contact surface, the placing table being configured to be rotatable; a freezing device having a second contact surface and configured to be raised and lowered; a rotation device configured to rotate the placing table; and a lifting device configured to raise and lower the freezing device to thermally connect or separate the second contact surface and the first contact surface. the freezing device includes: a refrigerator; a cold link having one end thermally connected to the refrigerator and the other end having the second contact surface, wherein a volume of the cold link is greater than a volume of the placing table.

Inventor(s): Naoya FUKUDA, Motoi YAMAGATA, Hiroshi SONE

CPC Classification: H01J37/32724 (Gas-filled discharge tubes (heating by discharge ))

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