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Category:C23C16/46
Subcategories
This category has the following 40 subcategories, out of 40 total.
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Pages in category "C23C16/46"
The following 91 pages are in this category, out of 91 total.
1
- 17837910. SEMICONDUCTOR PROCESS CHAMBER WITH IMPROVED REFLECTOR simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17839235. TAB ARRANGEMENT FOR RETAINING SUPPORT ELEMENTS OF SUBSTRATE SUPPORT simplified abstract (Applied Materials, Inc.)
- 17946947. BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT simplified abstract (Applied Materials, Inc.)
- 17954960. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17961214. LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING simplified abstract (Applied Materials, Inc.)
- 18008677. HEATER (Sumitomo Electric Industries, Ltd.)
- 18122574. APPARATUS AND METHODS FOR CONTROLLING SUBSTRATE TEMPERATURE DURING PROCESSING simplified abstract (Applied Materials, Inc.)
- 18125435. SUBSTRATE PROCESSING TUBE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18132861. SYSTEMS, APPARATUS, AND METHODS FOR MONITORING PLATE TEMPERATURE FOR SEMICONDUCTOR MANUFACTURING simplified abstract (Applied Materials, Inc.)
- 18224312. DEPOSITION APPARATUS simplified abstract (Samsung Display Co., Ltd.)
- 18377159. METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18418757. SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM simplified abstract (Tokyo Electron Limited)
- 18427992. STATE DETERMINATION METHOD AND COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Tokyo Electron Limited)
- 18432699. MIST CVD FILM FORMATION DEVICE AND FILM FORMATION METHOD simplified abstract (Murata Manufacturing Co., Ltd.)
- 18518393. SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18523394. SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION simplified abstract (Applied Materials, Inc.)
- 18536789. FILM FORMING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18536813. DEPOSITION APPARATUS AND PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18541164. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18544315. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Samsung Display Co., LTD.)
- 18547481. NON-METAL INCORPORATION IN MOLYBDENUM ON DIELECTRIC SURFACES simplified abstract (Lam Research Corporation)
- 18589845. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18591336. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18602099. CHAMBER ARCHITECTURE FOR EPITAXIAL DEPOSITION AND ADVANCED EPITAXIAL FILM APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18609067. SUBSTRATE SUPPORT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18609278. INSULATING FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM simplified abstract (Tokyo Electron Limited)
- 18615834. SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
- 18624402. FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract (Tokyo Electron Limited)
- 18665683. HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 18669753. SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18672023. SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Samsung Electronics Co., Ltd.)
- 18815687. ATOMIC LAYER DEPOSITION PART COATING CHAMBER (Applied Materials, Inc.)
- 18817577. ROTATING SUBSTRATE SUPPORT (ASM IP Holding B.V.)
- 18819298. CONNECTOR FOR SUBSTRATE SUPPORT WITH EMBEDDED TEMPERATURE SENSORS (LAM RESEARCH CORPORATION)
- 18834129. SUBSTRATE PROCESSING APPARATUS (TOKYO ELECTRON LIMITED)
- 18922507. METHODS FOR TREATMENT OF HIGH-K MATERIALS TO REDUCE LEAKAGE CURRENT AND INCREASE CAPACITANCE (Applied Materials, Inc.)
- 18928314. METHODS AND APPARATUS FOR SUSCEPTOR LEVELING (ASM IP Holding B.V.)
- 18943136. MULTI ZONE SPOT HEATING IN EPI (Applied Materials, Inc.)
- 18973635. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM (Kokusai Electric Corporation)
- 18973659. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM (Kokusai Electric Corporation)
- 19001627. SHOWER HEAD STRUCTURE AND PLASMA PROCESSING APPARATUS USING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 19018386. EPI ISOLATION PLATE AND PARALLEL BLOCK PURGE FLOW TUNING FOR GROWTH RATE AND UNIFORMITY (Applied Materials, Inc.)
A
- Applied materials, inc. (20240254624). PLATE ASSEMBLIES, PROCESS KITS, AND PROCESSING CHAMBERS FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240254654). EPI ISOLATION PLATE WITH GAP AND ANGLE ADJUSTMENT FOR PROCESS TUNING simplified abstract
- Applied materials, inc. (20240254655). EPI ISOLATION PLATE AND PARALLEL BLOCK PURGE FLOW TUNING FOR GROWTH RATE AND UNIFORMITY simplified abstract
- Applied materials, inc. (20240258153). APPARATUS AND METHODS FOR SEMICONDUCTOR PROCESSING simplified abstract
- Applied materials, inc. (20240304470). HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS simplified abstract
- Applied materials, inc. (20240337537). SYSTEMS, APPARATUS, AND METHODS FOR MONITORING PLATE TEMPERATURE FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- Applied materials, inc. (20240410078). IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING
- Applied materials, inc. (20240420926). ATOMIC LAYER DEPOSITION PART COATING CHAMBER
- Applied materials, inc. (20250003076). MODULAR HEATING JACKET WITH REMOLDABLE INSULATOR
- Applied materials, inc. (20250066918). MULTI ZONE SPOT HEATING IN EPI
- Applied materials, inc. (20250132147). METHODS FOR TREATMENT OF HIGH-K MATERIALS TO REDUCE LEAKAGE CURRENT AND INCREASE CAPACITANCE
- Applied Materials, Inc. patent applications on April 24th, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on December 12th, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on February 27th, 2025
- Applied Materials, Inc. patent applications on January 23rd, 2025
- Applied Materials, Inc. patent applications on January 2nd, 2025
- Applied Materials, Inc. patent applications on October 10th, 2024
- Applied Materials, Inc. patent applications on September 12th, 2024
B
S
- Samsung display co., ltd. (20240093369). DEPOSITION APPARATUS simplified abstract
- Samsung display co., ltd. (20240240320). PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract
- Samsung Display Co., LTD. patent applications on July 18th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung electronics co., ltd. (20240318314). SUBSTRATE SUPPORT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240376604). SUBSTRATE PROCESSING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20250092522). SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
- Samsung electronics co., ltd. (20250146133). SUBSTRATE SUPPORTING UNIT, APPARATUS FOR TREATING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
- Samsung Electronics Co., Ltd. patent applications on November 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
T
- Taiwan semiconductor manufacturing company, ltd. (20240203770). ROUNDED VERTICAL WAFER VESSEL RODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379400). WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Tokyo electron limited (20240249951). SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM simplified abstract
- Tokyo electron limited (20240337022). FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract
- Tokyo Electron Limited patent applications on February 6th, 2025
- Tokyo Electron Limited patent applications on July 25th, 2024
- Tokyo Electron Limited patent applications on October 10th, 2024