Applied materials, inc. (20250066918). MULTI ZONE SPOT HEATING IN EPI

MULTI ZONE SPOT HEATING IN EPI

Organization Name

applied materials, inc.

Inventor(s)

Shu-Kwan Lau of Sunnyvale CA (US)

Koji Nakanishi of Taito-Ku (JP)

Toshiyuki Nakagawa of Narita-Shi (JP)

Zuoming Zhu of Sunnyvale CA (US)

Zhiyuan Ye of San Jose CA (US)

Joseph M. Ranish of San Jose CA (US)

Nyi Oo Myo of San Jose CA (US)

Errol Antonio C. Sanchez of Tracy CA (US)

Schubert S. Chu of San Francisco CA (US)

MULTI ZONE SPOT HEATING IN EPI

This abstract first appeared for US patent application 20250066918 titled 'MULTI ZONE SPOT HEATING IN EPI

Original Abstract Submitted

embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. the thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. the spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.