FILM FORMING APPARATUS AND FILM FORMING METHOD

Organization Name

tokyo electron limited

Inventor(s)

Kensaku Narushima of Nirasaki City (JP)

Takashi Kobayashi of Nirasaki City (JP)

Shinya Okabe of Nirasaki City (JP)

Takashi Sakuma of Nirasaki City (JP)

Kunihiro Tada of Nirasaki City (JP)

Satoshi Yoshida of Nirasaki City (JP)

FILM FORMING APPARATUS AND FILM FORMING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240337022 titled 'FILM FORMING APPARATUS AND FILM FORMING METHOD

The patent application describes a film forming apparatus that includes a processing container with a depressurized interior, an electrode generating an electric field in the processing space, a radio frequency power supply providing power to the electrode, a stage for holding a substrate, and a film forming gas introduction part introducing vaporized zirconium chloride into the processing space. The film forming gas introduction part is made of metal and is grounded.

Processing container with depressurized interior
Electrode generating electric field in processing space
Radio frequency power supply for electrode
Stage for substrate placement
Film forming gas introduction part made of metal and grounded

Potential Applications: - Thin film deposition in semiconductor manufacturing - Coating processes in optics and electronics industries - Surface modification for medical devices

Problems Solved: - Precise control of film deposition - Enhanced adhesion of thin films - Improved uniformity of coatings

Benefits: - Higher quality thin films - Increased efficiency in coating processes - Cost-effective film formation

Commercial Applications: Title: Advanced Thin Film Deposition Technology for Semiconductor Manufacturing This technology can be used in semiconductor manufacturing for precise thin film deposition, improving the performance and reliability of electronic devices. It can also find applications in the optics and electronics industries for coating processes, enhancing product durability and functionality.

Prior Art: Researchers can explore prior art related to thin film deposition techniques, electrode design for film formation, and methods for introducing film forming gases into processing spaces.

Frequently Updated Research: Researchers are constantly exploring new materials and methods for thin film deposition to enhance the performance of electronic devices and improve manufacturing processes.

Questions about Film Forming Apparatus: 1. How does the film forming gas introduction part contribute to the deposition process? The film forming gas introduction part plays a crucial role in introducing vaporized zirconium chloride into the processing space, enabling precise control over the film deposition process.

2. What are the advantages of using a grounded metal film forming gas introduction part? By grounding the metal film forming gas introduction part, it helps to ensure a stable and consistent electric field in the processing space, leading to improved film quality and uniformity.

Original Abstract Submitted

a film forming apparatus, including a processing container, an interior of which is configured to be depressurized, an electrode configured to generate an electric field in a processing space inside the processing container, a radio frequency power supply configured to supply radio frequency power to the electrode, a stage arranged in the processing container to place a substrate thereon, and a film forming gas introduction part configured to introduce vaporized zirconium chloride into the processing space. the film forming gas introduction part is made of a metal and is grounded.