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Category:C23C14/54
Subcategories
This category has the following 29 subcategories, out of 29 total.
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Pages in category "C23C14/54"
The following 73 pages are in this category, out of 73 total.
1
- 17956281. SPUTTERING APPARATUS AND METHOD OF FABRICATING MAGNETIC MEMORY DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 18089216. Power Compensation in PVD Chambers simplified abstract (Applied Materials, Inc.)
- 18091552. Methods and Apparatus for Processing a Substrate simplified abstract (Applied Materials, Inc.)
- 18093138. Programmable Electrostatic Chuck to Enhance Aluminum Film Morphology simplified abstract (Applied Materials, Inc.)
- 18093141. Programmable ESC to Enhance Aluminum Film Morphology simplified abstract (Applied Materials, Inc.)
- 18162274. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18237934. METHODS AND APPARATUS FOR CONTROLLING ION FRACTION IN PHYSICAL VAPOR DEPOSITION PROCESSES simplified abstract (Applied Materials, Inc.)
- 18244197. HEAT TRANSFER MANAGEMENT IN SUBSTRATE SUPPORT SYSTEMS (Applied Materials, Inc.)
- 18244199. HEAT TRANSFER MANAGEMENT IN SUBSTRATE SUPPORT SYSTEMS (Applied Materials, Inc.)
- 18454702. METHOD OF PHYSICAL VAPOR DEPOSITION WITH INTERMIXING REDUCTION (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18512324. CONSUMABLE COMPONENT TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SEMES CO., LTD.)
- 18515610. FILM FORMING METHOD AND FILM FORMING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18519545. CONTROL SYSTEM OF DEPOSITION SOURCE simplified abstract (Samsung Display Co., LTD.)
- 18540331. SUBSTRATE PROCESSING DEVICE AND METHOD FOR MANUFACTURING SAME simplified abstract (LG DISPLAY CO., LTD.)
- 18541164. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18666251. REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract (Applied Materials, Inc.)
- 18748650. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18753697. METHOD FOR ION IMPLANTATION THAT ADJUSTS A TARGET'S TILT ANGLE BASED ON A DISTRIBUTION OF EJECTED IONS FROM A TARGET simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18832126. CALIBRATION ASSEMBLY FOR A LITHIUM DEPOSITION PROCESS, LITHIUM DEPOSITION APPARATUS, AND METHOD OF DETERMINING A LITHIUM DEPOSITION RATE IN A LITHIUM DEPOSITION PROCESS (Applied Materials, Inc.)
- 18911171. Substrate Processing Apparatus (TOKYO ELECTRON LIMITED)
- 18917730. METHOD TO IMPROVE WAFER EDGE UNIFORMITY (Applied Materials, Inc.)
- 18939732. FILM FORMATION APPARATUS AND FILM FORMATION METHOD OF GALLIUM NITRIDE FILM (Japan Display Inc.)
- 18957378. DEPOSITION SYSTEM AND METHOD (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18973671. MATERIAL DEPOSITION APPARATUS, METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE, AND MATERIAL DEPOSITION SYSTEM (Applied Materials, Inc.)
- 19001089. DEPOSITION SYSTEM AND METHOD (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 19017901. FILM FORMATION APPARATUS AND FILM FORMATION METHOD OF GALLIUM NITRIDE FILM (Japan Display Inc.)
- 19017907. FILM FORMATION APPARATUS (Japan Display Inc.)
A
- Applied materials, inc. (20240266186). STRESS MANAGEMENT FOR PRECISE SUBSTRATE -TO- SUBSTRATE BONDING simplified abstract
- Applied materials, inc. (20240266231). CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240266233). INFLUENCE FUNCTION-BASED MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
- Applied materials, inc. (20240304430). REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract
- Applied materials, inc. (20240410078). IN-SITU FILM GROWTH RATE MONITORING APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING
- Applied materials, inc. (20240412954). PROCESS CHAMBERS HAVING MULTIPLE COOLING PLATES
- Applied materials, inc. (20250084528). HEAT TRANSFER MANAGEMENT IN SUBSTRATE SUPPORT SYSTEMS
- Applied materials, inc. (20250084529). HEAT TRANSFER MANAGEMENT IN SUBSTRATE SUPPORT SYSTEMS
- Applied materials, inc. (20250101573). MATERIAL DEPOSITION APPARATUS, METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE, AND MATERIAL DEPOSITION SYSTEM
- Applied materials, inc. (20250109486). CALIBRATION ASSEMBLY FOR A LITHIUM DEPOSITION PROCESS, LITHIUM DEPOSITION APPARATUS, AND METHOD OF DETERMINING A LITHIUM DEPOSITION RATE IN A LITHIUM DEPOSITION PROCESS
- Applied materials, inc. (20250118539). METHOD TO IMPROVE WAFER EDGE UNIFORMITY
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on August 8th, 2024
- Applied Materials, Inc. patent applications on December 12th, 2024
- Applied Materials, Inc. patent applications on March 13th, 2025
- Applied Materials, Inc. patent applications on March 27th, 2025
- Applied Materials, Inc. patent applications on September 12th, 2024
J
S
T
- Taiwan semiconductor manufacturing co., ltd. (20240096609). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240429036). PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING
- Taiwan semiconductor manufacturing co., ltd. (20250087536). DEPOSITION SYSTEM AND METHOD
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 26th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240347327). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347341). METHOD FOR ION IMPLANTATION THAT ADJUSTS A TARGET'S TILT ANGLE BASED ON A DISTRIBUTION OF EJECTED IONS FROM A TARGET simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379400). WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062165). METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS
- Taiwan semiconductor manufacturing company, ltd. (20250066899). METHOD OF PHYSICAL VAPOR DEPOSITION WITH INTERMIXING REDUCTION
- Taiwan semiconductor manufacturing company, ltd. (20250132148). DEPOSITION SYSTEM AND METHOD
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 24th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
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- US Patent Application 18230669. IN SITU AND TUNABLE DEPOSITION OF A FILM simplified abstract
- US Patent Application 18341506. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18361729. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18447557. SEMICONDUCTOR TOOL FOR COPPER DEPOSITION simplified abstract