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Category:Gang Duan of Chandler AZ (US)
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Pages in category "Gang Duan of Chandler AZ (US)"
The following 37 pages are in this category, out of 37 total.
1
- 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)
- 17956757. PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (Intel Corporation)
- 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957355. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957359. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)
- 17958053. METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract (Intel Corporation)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
I
- Intel corporation (20240105571). IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS simplified abstract
- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240111092). PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract
- Intel corporation (20240112970). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240112971). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240112973). METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract
- Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113047). INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract
- Intel corporation (20240113048). INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract
- Intel corporation (20240113072). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240113075). MULTICHIP IC DEVICES WITH DIE EMBEDDED IN GLASS SUBSTRATE & A REDISTRIBUTION LAYER INTERCONNECT BRIDGE simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract