17957355. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
Contents
- 1 SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Organization Name
Inventor(s)
Hanyu Song of Chandler AZ (US)
Vinith Bejugam of Chandler AZ (US)
Yonggang Li of Chandler AZ (US)
Aaron Garelick of Chandler AZ (US)
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17957355 titled 'SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Simplified Explanation
The integrated circuit (IC) device described in the patent application comprises a substrate with a glass core, including a first surface, a second surface, a sidewall, and a corner region. A first build-up layer is present on at least the first surface. In some embodiments, the corner region includes a recess with dielectric material, while in others, it contains a first compressive stress compared to a second compressive stress in a different region of the glass core.
- Glass core substrate with first and second surfaces, sidewall, and corner region
- First build-up layer on at least the first surface
- Corner region may have a recess with dielectric material or a first compressive stress
- Second region of glass core with a second compressive stress lower than the first
Potential Applications
The technology described in this patent application could be applied in the manufacturing of integrated circuits, particularly in the development of more robust and reliable devices.
Problems Solved
This technology addresses issues related to stress management in glass core substrates, ensuring better performance and longevity of integrated circuit devices.
Benefits
The use of this technology can lead to improved durability, stability, and overall performance of integrated circuit devices, enhancing their functionality and lifespan.
Potential Commercial Applications
This technology could find applications in various industries, including electronics, telecommunications, and computing, where integrated circuits are essential components.
Possible Prior Art
One possible prior art could be the use of stress management techniques in semiconductor manufacturing processes to enhance the performance of integrated circuits.
Unanswered Questions
How does this technology compare to existing stress management techniques in integrated circuit manufacturing?
This article does not provide a direct comparison with other stress management techniques commonly used in the industry.
What specific types of integrated circuits could benefit the most from this technology?
The article does not specify which types of integrated circuits would see the most significant improvements from the implementation of this technology.
Original Abstract Submitted
An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, a sidewall between the first surface and the second surface, and a corner region where the first sidewall meets the first surface. A first build-up layer is on at least the first surface. In some embodiments, the corner region comprises a recess and a dielectric material within the recess. In other embodiments, the corner region comprises a first compressive stress and the glass core comprises a second region. The second region comprises a second compressive stress. The first compressive stress is greater than the second compressive stress.
