18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

Organization Name

Intel Corporation

Inventor(s)

Bai Nie of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Jesse Jones of Chandler AZ (US)

Yosuke Kanaoka of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Rahul Manepalli of Chandler AZ (US)

Sameer Paital of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Yonggang Li of Chandler AZ (US)

Meizi Jiao of Chandler AZ (US)

Chong Zhang of Chandler AZ (US)

Matthew Tingey of Hillsboro OR (US)

Jung Kyu Han of Chandler AZ (US)

Haobo Chen of Gilbert AZ (US)

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18513015 titled 'PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

Simplified Explanation

The abstract describes a die assembly that includes a die with one or more die pads on a first surface, and a die attach film with openings that expose the die pads and extend to the edges of the die.

• Die assembly with die pads on a first surface of the die
• Die attach film with openings exposing die pads and extending to edges of the die

Potential Applications

The die assembly could be used in semiconductor manufacturing, electronic packaging, and microelectronics industries.

Problems Solved

1. Improved thermal conductivity and electrical connectivity between the die and external components. 2. Enhanced reliability and performance of electronic devices.

Benefits

1. Increased efficiency in heat dissipation. 2. Enhanced electrical connections. 3. Improved overall performance and reliability of electronic devices.

Potential Commercial Applications

Enhancing Electronic Device Performance with Die Assembly Technology

Some questions that are not answered by this article:

What materials are used in the die attach film and how do they affect the performance of the die assembly?

The article does not specify the materials used in the die attach film or their impact on the overall performance of the die assembly.

Are there any limitations or drawbacks to using this die assembly technology in certain applications?

The article does not address any potential limitations or drawbacks of using this die assembly technology in specific applications.

Original Abstract Submitted

A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.