Intel corporation (20240113000). DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract

DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING

Organization Name

intel corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Ravindranath V. Mahajan of Chandler AZ (US)

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Beomseok Choi of Chandler AZ (US)

DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113000 titled 'DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING

Simplified Explanation

The electronic device described in the patent application includes a substrate with buildup layers containing contact pads and a discrete passive electronic component. The component is integrated into the buildup layers and connected to the contact pads for electrical functionality.

• The electronic device has a substrate with a core layer.
• Buildup layers are added on the first surface of the core layer.
• The buildup layers contain first contact pads below the top surface and second contact pads on the top surface.
• A discrete passive electronic component is placed within the buildup layers.
• The discrete component has bottom contact pads on the bottom surface and top contact pads on the top surface.
• The bottom contact pads of the discrete component are bonded to the first contact pads of the buildup layers.
• The top contact pads of the discrete component are electrically connected to the second contact pads of the buildup layers.

Potential Applications

This technology could be used in various electronic devices such as smartphones, tablets, and wearables to improve circuit integration and efficiency.

Problems Solved

This innovation solves the problem of integrating discrete passive electronic components into electronic devices with limited space, providing a more compact and efficient design.

Benefits

The benefits of this technology include increased functionality in a smaller form factor, improved electrical connections, and enhanced overall performance of electronic devices.

Potential Commercial Applications

This technology could be applied in the consumer electronics industry for the development of smaller and more advanced electronic devices, leading to increased market competitiveness.

Possible Prior Art

One possible prior art for this technology could be the integration of discrete components in electronic devices using traditional methods such as wire bonding or flip-chip technology.

How does this technology impact the overall cost of electronic devices?

The cost implications of implementing this technology in electronic devices are not addressed in the article.

What are the environmental considerations of using this technology?

The environmental impact of producing electronic devices with integrated discrete components is not discussed in the article.

Original Abstract Submitted

an electronic device includes a substrate including a core layer; buildup layers on a first surface of the core layer, the buildup layers including first contact pads below the top surface of the buildup layers and second contact pads on a top surface of the buildup layers; and a discrete passive electronic component disposed in the buildup layers, the discrete component including bottom contact pads on a bottom surface of the discrete component and top contact pads on a top surface of the discrete component. the bottom contact pads of the discrete component are bonded to the first contacts pads of the buildup layers and the top contact pads of the discrete component are electrically connected to the second contact pads of the buildup layers.