17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

Organization Name

Intel Corporation

Inventor(s)

Whitney Bryks of Tempe AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Benjamin Duong of Phoenix AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17957349 titled 'SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

Simplified Explanation

The integrated circuit (IC) device described in the patent application comprises a glass core substrate with a build-up layer on the first surface and a plurality of regions on the sidewall, each region containing a cavity with a concave surface.

• Glass core substrate with build-up layer on first surface
• Plurality of regions on sidewall, each containing a cavity with concave surface

Potential Applications

The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, and computers where integrated circuits are essential components.

Problems Solved

This technology allows for more efficient and compact integrated circuits by utilizing the glass core substrate and the unique cavity design on the sidewall, potentially reducing the overall size and improving performance.

Benefits

The use of a glass core substrate and the cavity design on the sidewall can lead to improved thermal management, reduced power consumption, and enhanced signal integrity in integrated circuits.

Potential Commercial Applications

The technology could be applied in the semiconductor industry for the production of advanced integrated circuits with higher performance and reliability. A potential commercial application could be in the manufacturing of high-end consumer electronics.

Possible Prior Art

One possible prior art could be the use of different materials for substrates in integrated circuits, but the specific combination of a glass core substrate with a build-up layer and regions containing cavities on the sidewall may be a novel approach.

How does this technology impact the overall cost of manufacturing integrated circuits?

The patent application does not provide information on the cost implications of using a glass core substrate and the unique cavity design on the sidewall. Further research and analysis would be needed to determine the cost-effectiveness of implementing this technology in mass production.

What are the potential challenges in scaling up this technology for mass production?

The patent application does not address the scalability of this technology for mass production. It is important to consider factors such as manufacturing processes, material availability, and quality control when scaling up the production of integrated circuits using this technology.

Original Abstract Submitted

An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, and a sidewall between the first surface and the second surface. A build-up layer is on at least the first surface. A plurality of regions is on the sidewall. Each region comprises a cavity in the sidewall, wherein the cavity spans a first distance in a first direction from the first surface toward the second surface. In addition, the cavity comprises a concave surface having a first depth at the first surface and a second depth at the first distance, the second depth being less than the first depth.