Intel corporation (20240112970). SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

Organization Name

intel corporation

Inventor(s)

Hanyu Song of Chandler AZ (US)

Vinith Bejugam of Chandler AZ (US)

Yonggang Li of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Aaron Garelick of Chandler AZ (US)

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240112970 titled 'SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

Simplified Explanation

The integrated circuit (IC) device described in the patent application comprises a glass core substrate with specific features such as a first surface, a second surface, a sidewall, and a corner region. The device also includes a build-up layer and may have a corner region with a recess or compressive stress.

• Glass core substrate with specific features:

 - The IC device includes a substrate made of a glass core with a first surface, a second surface, a sidewall, and a corner region.

• Build-up layer:

 - A first build-up layer is present on at least the first surface of the glass core substrate.

• Corner region variations:

 - The corner region may have a recess with dielectric material or a compressive stress, with the glass core having a different compressive stress in another region.

Potential Applications

The technology described in this patent application could be applied in: - Semiconductor manufacturing - Electronic devices - Communication systems

Problems Solved

This technology addresses issues related to: - Improving the performance and reliability of integrated circuits - Enhancing the durability of electronic components - Reducing signal interference in electronic devices

Benefits

The benefits of this technology include: - Increased efficiency in semiconductor manufacturing - Enhanced functionality of electronic devices - Improved signal transmission and reception in communication systems

Potential Commercial Applications

The potential commercial applications of this technology could be in: - Semiconductor industry - Consumer electronics market - Telecommunications sector

Possible Prior Art

One possible prior art related to this technology could be the use of glass substrates in semiconductor devices for improved performance and reliability.

How does the compressive stress in the corner region affect the overall performance of the IC device?

The compressive stress in the corner region could potentially impact the mechanical stability and electrical properties of the device, but the specific effects are not detailed in the patent application.

What are the specific manufacturing processes involved in creating the recess or compressive stress in the corner region of the glass core substrate?

The patent application does not provide detailed information on the manufacturing techniques used to create the recess or apply the compressive stress in the corner region of the glass core substrate.

Original Abstract Submitted

an integrated circuit (ic) device comprises a substrate comprising a glass core. the glass core includes a first surface, a second surface opposite the first surface, a sidewall between the first surface and the second surface, and a corner region where the first sidewall meets the first surface. a first build-up layer is on at least the first surface. in some embodiments, the corner region comprises a recess and a dielectric material within the recess. in other embodiments, the corner region comprises a first compressive stress and the glass core comprises a second region. the second region comprises a second compressive stress. the first compressive stress is greater than the second compressive stress.