Category:H01L21/768
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Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L21/00: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- Subgroup H01L21/768: Processes or apparatus for applying a liquid or other fluent material to semiconductor wafers
This classification involves processes or apparatuses specifically adapted for manufacturing semiconductor devices, focusing on the application of liquids or other fluent materials to semiconductor wafers, crucial in the production of modern electronic components.
Pages in category "H01L21/768"
The following 31 pages are in this category, out of 1,447 total.
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- US Patent Application 18365420. SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- US Patent Application 18365490. SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract
- US Patent Application 18365517. DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL simplified abstract
- US Patent Application 18366120. HIGH CAPACITANCE MIM DEVICE WITH SELF ALIGNED SPACER simplified abstract
- US Patent Application 18366274. SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- US Patent Application 18366469. CONTACT PLUG STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME simplified abstract
- US Patent Application 18366771. Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same simplified abstract
- US Patent Application 18366831. LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE simplified abstract
- US Patent Application 18446025. ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY simplified abstract
- US Patent Application 18446146. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- US Patent Application 18446183. Semiconductor Device with Air Gaps and Method of Fabrication Thereof simplified abstract
- US Patent Application 18446326. GATE CONTACT STRUCTURE simplified abstract
- US Patent Application 18446521. Integrated Circuit Package and Method simplified abstract
- US Patent Application 18446541. SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MAKING THE SAME simplified abstract
- US Patent Application 18446591. SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- US Patent Application 18446648. Semiconductor Devices Including Decoupling Capacitors simplified abstract
- US Patent Application 18446728. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract
- US Patent Application 18446753. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- US Patent Application 18446953. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract
- US Patent Application 18447053. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18447084. IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE simplified abstract
- US Patent Application 18447134. ETCH METHOD FOR INTERCONNECT STRUCTURE simplified abstract
- US Patent Application 18447212. SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- US Patent Application 18447344. SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION simplified abstract
- US Patent Application 18447549. LOCAL INTERCONNECT simplified abstract
- US Patent Application 18447557. SEMICONDUCTOR TOOL FOR COPPER DEPOSITION simplified abstract
- US Patent Application 18447769. DUAL-SIDED ROUTING IN 3D SIP STRUCTURE simplified abstract
- US Patent Application 18447869. SYSTEM AND METHOD FOR MULTIPLE STEP DIRECTIONAL PATTERNING simplified abstract
- US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract
- US Patent Application 18448284. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
