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Category:H01L21/68
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This category has the following 79 subcategories, out of 79 total.
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Pages in category "H01L21/68"
The following 167 pages are in this category, out of 167 total.
1
- 17383849. METHOD FOR CALIBRATING ALIGNMENT OF WAFER AND LITHOGRAPHY SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17525729. LAYER FORMING SYSTEM INCLUDING COVER WITH SUPPORT PADS, A POSITIONING SYSTEM WITH THE COVER AND SUPPORT PADS, AND A METHOD OF LOADING A PLATE simplified abstract (CANON KABUSHIKI KAISHA)
- 17541946. SILICON HANDLER WITH LASER-RELEASE LAYERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17708301. SEMICONDUCTOR DEVICE TRANSFER STRUCTURE, DISPLAY APPARATUS, AND METHOD OF MANUFACTURING DISPLAY APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 17836199. OPTICAL ASSEMBLY FOR ALIGNMENT INSPECTION, OPTICAL APPARATUS INCLUDING THE SAME, DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18059291. SYSTEMS, DEVICES, AND METHODS FOR REGISTERING A SUPERSTRATE OF AN IMPRINT TOOL simplified abstract (CANON KABUSHIKI KAISHA)
- 18078249. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18081102. WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18086992. CHIP WET TRANSFER APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18133242. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18162182. SENSOR MODULE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18185427. DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTOR DIE PLACEMENT simplified abstract (Intel Corporation)
- 18200201. POSITION DETERMINATION APPARATUS FOR ROBOT DETECTION LASER SENSOR SYSTEM IN FOUP MOVABLE BY OHT simplified abstract (Samsung Electronics Co., Ltd.)
- 18217020. SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18255037. SUBSTRATE FOR CARRYING WAFER simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18292588. MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD, AND MASS TRANSFER EQUIPMENT (BOE TECHNOLOGY GROUP CO., LTD.)
- 18376512. SUBSTRATE TRANSFER UNIT AND SUBSTRATE TRANSFER CONTROL METHOD simplified abstract (Tokyo Electron Limited)
- 18393850. SUBSTRATE SUPPORT APPARATUS simplified abstract (SEMES CO., LTD.)
- 18397549. SEMICONDUCTOR PROCESSING APPARATUS WITH ENHANCED CHAMBER USABILITY AND THE METHOD THEREOF simplified abstract (ASM IP Holding B.V.)
- 18419219. SEMICONDUCTOR MANUFACTURING APPARATUS (SAMSUNG ELECTRONICS CO., LTD.)
- 18435175. CALIBRATION JIG AND CALIBRATION METHOD simplified abstract (Applied Materials, Inc.)
- 18437115. SEMICONDUCTOR MANUFACTURING DEVICE AND CONTROL OF THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18439287. OVERLAYING ON LOCALLY DISPOSITIONED PATTERNS BY ML BASED DYNAMIC DIGITAL CORRECTIONS (ML-DDC) simplified abstract (Applied Materials, Inc.)
- 18442522. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD simplified abstract (Tokyo Electron Limited)
- 18442908. CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE (SAMSUNG ELECTRONICS CO., LTD.)
- 18457785. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18465533. SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18465982. BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME simplified abstract (SK hynix Inc.)
- 18469684. SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18480249. SEMICONDUCTOR DEVICE MANUFACTURING METHOD, X-RAY DIFFRACTION DEVICE AND SEMICONDUCTOR PATTERN TRANSFER SYSTEM simplified abstract (Mitsubishi Electric Corporation)
- 18483994. ANNEAL CHAMBER (Applied Materials, Inc.)
- 18495368. METHOD AND SYSTEM FOR DIE BONDING (CANON KABUSHIKI KAISHA)
- 18521314. Wafer Positioning Method and Apparatus simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18531854. ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18581722. WAFER NOTCH POSITIONING DETECTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18592646. SUBSTRATE PROCESSING APPARATUS, CLEANING METHOD, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18595341. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18610612. SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18622091. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18625330. EFEM ROBOT AUTO TEACHING METHODOLOGY simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18644210. WAFER BONDING METHOD INCLUDING REMOVING TRANSPARENT OR TRANSLUCENT MATERIAL (SAMSUNG ELECTRONICS CO., LTD.)
- 18728885. HIGH-PRECISION HETEROGENEOUS INTEGRATION (BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM)
- 18730257. APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT (Lam Research Corporation)
- 18747417. INTEGRATED SUBSTRATE MEASUREMENT SYSTEM simplified abstract (Applied Materials, Inc.)
- 18748025. PICK-AND-PLACE SYSTEM WITH A STABILIZER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18754620. METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNEALING A WAFER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18760403. METHOD OF MANUFACTURING DISPLAY DEVICE (Samsung Display Co., LTD.)
- 18790371. DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18811189. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (SEMES CO., LTD.)
- 18823514. APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE (Samsung Display Co., LTD.)
- 18830572. METHOD OF TRANSFERRING TARGET OBJECT TO TARGET SUBSTRATE (InnoLux Corporation)
- 18890735. SUBSTRATE TRANSPORTING DEVICE AND SUBSTRATE PROCESSING DEVICE EQUIPPED WITH THE SAME (SCREEN Holdings Co., Ltd.)
- 18905097. Calibration Method and Substrate Processing System (TOKYO ELECTRON LIMITED)
- 18912365. LIGHT-EMITTING ELEMENT TRANSFER STAMP AND METHOD FOR MANUFACTURING THE SAME (LG Display Co., Ltd.)
- 18921430. INFORMATION PROCESSING APPARATUS, PATTERN FORMING APPARATUS, INFORMATION PROCESSING METHOD, AND ARTICLE MANUFACTURING METHOD (CANON KABUSHIKI KAISHA)
- 18921728. Teaching Method and Substrate Processing System (Tokyo Electron Limited)
- 18921771. Method for Controlling Substrate Processing System and Substrate Processing System (Tokyo Electron Limited)
- 18958317. PROCESS KIT ENCLOSURE SYSTEM (Applied Materials, Inc.)
- 19002471. MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS (Samsung Electronics Co., Ltd.)
- 19009195. CENTERING WAFER FOR PROCESSING CHAMBER (Applied Materials, Inc.)
3
A
- Applied materials, inc. (20240249062). OVERLAYING ON LOCALLY DISPOSITIONED PATTERNS BY ML BASED DYNAMIC DIGITAL CORRECTIONS (ML-DDC) simplified abstract
- Applied materials, inc. (20240258141). METHODS AND APPARATUS FOR CALIBRATION OF SUBSTRATE PROCESSING CHAMBER PLACEMENT VIA IMAGING simplified abstract
- Applied materials, inc. (20240339347). INTEGRATED SUBSTRATE MEASUREMENT SYSTEM simplified abstract
- Applied materials, inc. (20240412997). HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITION AND ORIENTATION FOR ION IMPLANT
- Applied Materials, Inc. (20250062143). SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES
- Applied materials, inc. (20250087524). PROCESS KIT ENCLOSURE SYSTEM
- Applied materials, inc. (20250118572). ANNEAL CHAMBER
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on December 12th, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on February 20th, 2025
- Applied Materials, Inc. patent applications on January 23rd, 2025
- Applied Materials, Inc. patent applications on July 25th, 2024
- Applied Materials, Inc. patent applications on March 13th, 2025
- Applied Materials, Inc. patent applications on October 10th, 2024
B
- Blockchain patent applications on February 8th, 2024
- Boe technology group co., ltd. (20240258279). OPTICAL PATH STRUCTURE, OPTICAL PATH SYSTEM, AND TRANSFER METHOD
- Boe technology group co., ltd. (20240258279). OPTICAL PATH STRUCTURE, OPTICAL PATH SYSTEM, AND TRANSFER METHOD simplified abstract
- Boe technology group co., ltd. (20250113682). MULTI-COORDINATE SYSTEM CALIBRATION AND EQUIPMENT ALIGNMENT METHOD, AND MASS TRANSFER EQUIPMENT
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on April 3rd, 2025
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on August 1st, 2024
C
- Canon kabushiki kaisha (20240178042). SYSTEMS, DEVICES, AND METHODS FOR REGISTERING A SUPERSTRATE OF AN IMPRINT TOOL simplified abstract
- Canon kabushiki kaisha (20250138427). INFORMATION PROCESSING APPARATUS, PATTERN FORMING APPARATUS, INFORMATION PROCESSING METHOD, AND ARTICLE MANUFACTURING METHOD
- Canon kabushiki kaisha (20250140592). METHOD AND SYSTEM FOR DIE BONDING
- CANON KABUSHIKI KAISHA patent applications on March 6th, 2025
- CANON KABUSHIKI KAISHA patent applications on May 1st, 2025
- CANON KABUSHIKI KAISHA patent applications on May 30th, 2024
I
- Intel corporation (20240312819). DEVICE AND METHOD FOR REAL-TIME OFFSET ADJUSTMENT OF A SEMICONDUCTOR DIE PLACEMENT simplified abstract
- Intel corporation (20240429199). METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BONDING
- Intel Corporation patent applications on December 26th, 2024
- Intel Corporation patent applications on September 19th, 2024
K
L
- Lg display co., ltd. (20240258143). SUBSTRATE SUPPORT APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE USING THE SAME
- Lg display co., ltd. (20240258143). SUBSTRATE SUPPORT APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE USING THE SAME simplified abstract
- LG DISPLAY CO., LTD. patent applications on August 1st, 2024
M
- Mitsubishi electric corporation (20240231234). SEMICONDUCTOR DEVICE MANUFACTURING METHOD, X-RAY DIFFRACTION DEVICE AND SEMICONDUCTOR PATTERN TRANSFER SYSTEM simplified abstract
- Mitsubishi Electric Corporation patent applications on February 13th, 2025
- Mitsubishi Electric Corporation patent applications on July 11th, 2024
S
- Samsung display co., ltd. (20240096679). SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME simplified abstract
- Samsung display co., ltd. (20240243228). DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung display co., ltd. (20240266199). ALIGNMENT APPARATUS AND METHOD OF ALIGNMENT USING THE SAME simplified abstract
- Samsung display co., ltd. (20250107424). APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Samsung display co., ltd. (20250132182). METHOD OF MANUFACTURING DISPLAY DEVICE
- Samsung Display Co., LTD. patent applications on April 24th, 2025
- Samsung Display Co., LTD. patent applications on August 8th, 2024
- Samsung Display Co., LTD. patent applications on July 18th, 2024
- Samsung Display Co., Ltd. patent applications on March 21st, 2024
- Samsung Display Co., LTD. patent applications on March 27th, 2025
- Samsung electronics co., ltd. (20240105524). OPTICAL DEVICE, DIE BONDING SYSTEM, AND DIE BONDING METHOD simplified abstract
- Samsung electronics co., ltd. (20240120224). SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract
- Samsung electronics co., ltd. (20240178025). SEMICONDUCTOR PROCESSING DEVICE AND SEMICONDUCTOR PROCESSING SYSTEM simplified abstract
- Samsung electronics co., ltd. (20240186278). MOUNTING DEVICE AND MOUNTING METHOD simplified abstract
- Samsung electronics co., ltd. (20240282607). POSITION DETERMINATION APPARATUS FOR ROBOT DETECTION LASER SENSOR SYSTEM IN FOUP MOVABLE BY OHT simplified abstract
- Samsung electronics co., ltd. (20240321618). SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD simplified abstract
- Samsung electronics co., ltd. (20240411235). SEMICONDUCTOR MANUFACTURING APPARATUS
- Samsung electronics co., ltd. (20240412407). SEMICONDUCTOR MANUFACTURING DEVICE AND CONTROL OF THE SAME
- Samsung electronics co., ltd. (20240429082). FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANAGEMENT SYSTEM USING SAME
- Samsung electronics co., ltd. (20250006542). CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE
- Samsung electronics co., ltd. (20250125179). MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS
- Samsung electronics co., ltd. (20250140588). DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
- Samsung electronics co., ltd. (20250140710). WAFER BONDING METHOD INCLUDING REMOVING TRANSPARENT OR TRANSLUCENT MATERIAL
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 6th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 1st, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on May 1st, 2025
- Samsung Electronics Co., Ltd. patent applications on May 30th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Sk hynix inc. (20240347470). BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME simplified abstract
- SK hynix Inc. patent applications on October 17th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096677). Wafer Positioning Method and Apparatus simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240194513). WAFER NOTCH POSITIONING DETECTION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240249961). EFEM ROBOT AUTO TEACHING METHODOLOGY simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240258142). SYSTEMS AND METHODS FOR SEMICONDUCTOR WAFER TRANSPORT
- Taiwan semiconductor manufacturing company, ltd. (20240258142). SYSTEMS AND METHODS FOR SEMICONDUCTOR WAFER TRANSPORT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339348). PICK-AND-PLACE SYSTEM WITH A STABILIZER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347355). METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNEALING A WAFER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379398). SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 13th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Tokyo electron limited (20240297061). SUBSTRATE PROCESSING APPARATUS AND CONTROL POSITION SETTING METHOD simplified abstract
- Tokyo Electron Limited patent applications on February 6th, 2025
- Tokyo Electron Limited patent applications on September 5th, 2024
U
- US Patent Application 18347971. SYSTEM FOR TRANSFERRING SUBSTRATE AND METHOD FOR TRANSFERRING SUBSTRATE USING THE SAME simplified abstract
- US Patent Application 18359416. System and Method for Bonding Semiconductor Devices simplified abstract
- US Patent Application 18448869. APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICATING DISPLAY DEVICE simplified abstract