19009195. CENTERING WAFER FOR PROCESSING CHAMBER (Applied Materials, Inc.)
CENTERING WAFER FOR PROCESSING CHAMBER
Organization Name
Inventor(s)
Muhannad Mustafa of Milpitas CA US
Sanjeev Baluja of Campbell CA US
CENTERING WAFER FOR PROCESSING CHAMBER
This abstract first appeared for US patent application 19009195 titled 'CENTERING WAFER FOR PROCESSING CHAMBER
Original Abstract Submitted
Processing chambers, substrate supports, centering wafers and methods of center calibrating wafer hand-off are described. A centering wafer comprises a disc-shaped body having a top surface and a bottom surface defining a thickness, a center, an outer edge having an outer peripheral face, a first arc-shaped slit and a second arc-shaped slit. Embodiments of the disclosure advantageously provide the ability to use the centering wafer to monitor and control backside pressure and thereby determine the center of a substrate support prior to processing the centering wafer. The centering wafer may be centered at a plurality of different angles by rotating the centering wafer.