PICK-AND-PLACE SYSTEM WITH A STABILIZER

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

PICK-AND-PLACE SYSTEM WITH A STABILIZER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18748025 titled 'PICK-AND-PLACE SYSTEM WITH A STABILIZER

Simplified Explanation:

The pick-and-place system described in the patent application consists of a wafer holder, a gantry with a stabilizer, a primary drive mechanism, a secondary drive mechanism, and a suction head.

The system includes a wafer holder for holding the wafer in place.
A gantry with a stabilizer extends downwardly over the wafer holder.
A primary drive mechanism is connected to the gantry to drive it.
A secondary drive mechanism is located at the gantry.
The secondary drive mechanism is connected to a suction head, which it drives.

Key Features and Innovation:

Integration of a stabilizer in the gantry for enhanced stability.
Dual drive mechanisms for precise movement control.
Suction head for picking and placing objects accurately.

Potential Applications:

The pick-and-place system can be used in semiconductor manufacturing, electronics assembly, and other industries requiring precise object manipulation.

Problems Solved:

This technology addresses the need for efficient and accurate pick-and-place operations in manufacturing processes.

Benefits:

Improved precision in object handling.
Increased efficiency in production processes.
Reduced risk of errors and damage to delicate objects.

Commercial Applications:

Potential commercial applications include semiconductor fabrication facilities, electronics manufacturing plants, and automated production lines.

Prior Art:

Readers can explore prior art related to pick-and-place systems in the field of automation and robotics.

Frequently Updated Research:

Stay informed about the latest advancements in pick-and-place technology by following research publications and industry developments.

Questions about Pick-and-Place Systems:

1. What are the primary components of a pick-and-place system? 2. How does the integration of dual drive mechanisms improve the performance of the system?

Original Abstract Submitted

A pick-and-place system is provided. The pick-and-place system includes: a wafer holder; a gantry over the wafer holder and comprising a stabilizer extending downwardly; a primary drive mechanism connected to the gantry and configured to drive the gantry; a secondary drive mechanism located at the gantry; and a suction head, wherein the secondary drive mechanism is connected to the suction head and configured to drive the suction head.