18495368. METHOD AND SYSTEM FOR DIE BONDING (CANON KABUSHIKI KAISHA)
METHOD AND SYSTEM FOR DIE BONDING
Organization Name
Inventor(s)
Byung-Jin Choi of Austin TX US
METHOD AND SYSTEM FOR DIE BONDING
This abstract first appeared for US patent application 18495368 titled 'METHOD AND SYSTEM FOR DIE BONDING
Original Abstract Submitted
A bonding method includes providing a source substrate, the source substrate includes active side alignment marks on an active side of the source substrate, first non-active side alignment marks and second non-active side alignment marks on a non-active side of the source substrate, and obtaining positions of the active side alignment marks and positions of the first non-active side alignment marks of the source substrate, and determining alignment marks placement errors based on offsets between the positions of the active-side alignment marks and the positions of the first non-active side alignment marks in the X, Y, and θ directions.