Samsung electronics co., ltd. (20250125179). MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS
MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS
Organization Name
Inventor(s)
Junsik Hwang of Hwaseong-si KR
MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS
This abstract first appeared for US patent application 20250125179 titled 'MICRO-SEMICONDUCTOR CHIP WETTING ALIGNMENT APPARATUS
Original Abstract Submitted
a micro-semiconductor chip wet alignment apparatus is provided. the micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.