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Category:H01L23/552
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Pages in category "H01L23/552"
The following 49 pages are in this category, out of 49 total.
1
- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)
- 17872473. CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY simplified abstract (Huawei Technologies Co., Ltd.)
- 17874404. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17888324. SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
- 17929159. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17932209. DIE PACKAGE WITH SEALED DIE ENCLOSURES simplified abstract (QUALCOMM Incorporated)
- 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18114085. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18124653. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18155672. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18169662. Electromagnetic Interference Shield with Thermal Conductivity simplified abstract (Apple Inc.)
- 18244556. ELECTRONIC APPARATUS AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18303659. SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18361099. SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)
- 18401815. Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18484311. DEVICES AND METHODS RELATED TO STACK ASSEMBLY simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18513376. PACKAGED MODULE WITH ANTENNA AND FRONT END INTEGRATED CIRCUIT simplified abstract (Skyworks Solutions, Inc.)
2
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- Qualcomm incorporated (20240096817). ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract
- QUALCOMM Incorporated patent applications on January 18th, 2024
- QUALCOMM Incorporated patent applications on March 14th, 2024
- QUALCOMM Incorporated patent applications on March 21st, 2024
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- Taiwan semiconductor manufacturing company, ltd. (20240136280). Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Texas Instruments Incorporated patent applications on February 29th, 2024
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- US Patent Application 17823063. SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF simplified abstract
- US Patent Application 17881128. SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF simplified abstract
- US Patent Application 18230999. SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME simplified abstract
- US Patent Application 18344652. INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC BLOCK simplified abstract
- US Patent Application 18447572. METHOD OF MANUFACTURING INTEGRATED CIRCUIT simplified abstract