17929159. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
MYUNGSAM Kang of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17929159 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The disclosed semiconductor package includes a substrate, a semiconductor chip, a vertical structure, a molding layer, and a conductive pattern.
- The vertical structure is connected to the ground conductor of the substrate and has a narrower second part on top of a wider first part.
- The conductive pattern includes a pad and an inductor pattern connected to the pad.
- The second part of the vertical structure and the pad form a capacitor.
Potential Applications
- This semiconductor package can be used in various electronic devices such as smartphones, tablets, and computers.
- It can be applied in power management systems, communication devices, and integrated circuits.
Problems Solved
- The vertical structure and conductive pattern provide improved electrical performance and stability.
- The capacitor formed by the second part of the vertical structure and the pad helps in filtering and regulating electrical signals.
Benefits
- The semiconductor package offers enhanced electrical performance and stability.
- It provides improved filtering and regulation of electrical signals.
- The design allows for efficient integration into various electronic devices.
Original Abstract Submitted
Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a vertical structure on the substrate on one side of the semiconductor chip, a molding layer on the substrate and surrounding the semiconductor chip and the vertical structure, and a conductive pattern on the molding layer. The vertical structure includes a first part connected to a ground conductor of the substrate, and at least one second part on the first part and having a width less than a width of the first part. The conductive pattern includes at least one pad vertically spaced from the at least one second part, and an inductor pattern connected to the at least one pad. The at least one second part and the at least one pad form at least one capacitor.
