Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract

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METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD

Organization Name

intel corporation

Inventor(s)

Gianni Signorini of Garching bei Muenchen (DE)

Georg Seidemann of Landshut (DE)

Bernd Waidhas of Pettendorf (DE)

METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128202 titled 'METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD

Simplified Explanation

The abstract describes electronic packages with conformal shields and methods of forming such packages. Here is a simplified explanation of the patent application:

  • The electronic package includes a die with a first surface, a second surface, and sidewall surfaces.
  • A redistribution layer with a first conductive layer is over the first surface of the die.
  • An under ball metallization (UBM) layer is over the redistribution layer.
  • A conductive shield is over the sidewall surfaces and the second surface of the die, electrically coupled to the UBM layer.

Potential Applications

The technology described in this patent application could be applied in various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics.

Problems Solved

This technology helps in providing electromagnetic interference (EMI) shielding for electronic components, reducing signal interference and improving overall device performance.

Benefits

The conformal shields improve the reliability and durability of electronic packages by protecting them from external electromagnetic interference. This can lead to enhanced device performance and longevity.

Potential Commercial Applications

One potential commercial application of this technology could be in the telecommunications industry, where electronic devices require high levels of EMI shielding to ensure reliable communication.

Possible Prior Art

One possible prior art for this technology could be existing methods of applying EMI shielding to electronic components, such as using metal enclosures or coatings to protect against interference.

Unanswered Questions

How does the size of the conductive shield impact the overall performance of the electronic package?

The size of the conductive shield could potentially affect the level of EMI shielding provided and the overall efficiency of the electronic package in reducing signal interference.

What are the potential challenges in integrating conformal shields into existing electronic packaging processes?

Integrating conformal shields into existing electronic packaging processes may pose challenges in terms of compatibility, cost, and manufacturing complexity. It would be important to address these challenges to ensure successful implementation of the technology.


Original Abstract Submitted

embodiments disclosed herein include electronic packages with conformal shields and methods of forming such packages. in an embodiment, the electronic package comprises a die having a first surface, a second surface opposite the first surface, and sidewall surfaces. a redistribution layer is over the first surface of the die, and the redistribution layer comprises a first conductive layer. in an embodiment, an under ball metallization (ubm) layer is over the redistribution layer, and a conductive shield is over the sidewall surfaces of the die and the second surface of the die. in an embodiment, the conductive shield is electrically coupled to the ubm layer.

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