18124653. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18124653 titled 'PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The patent application describes a package substrate with multiple insulating layers, a signal line, and a ground line.
- The first signal line has a signal via that partially penetrates the insulating layers, a signal pad at one end, and signal wiring extending from the pad.
- The ground line includes a ground via, a ground pad, ground wiring, and a ground stub extending towards the signal via or pad.
- Potential Applications:**
- High-speed electronic devices
- Integrated circuits
- Printed circuit boards
- Problems Solved:**
- Signal interference
- Grounding issues
- Signal transmission efficiency
- Benefits:**
- Improved signal integrity
- Enhanced electrical performance
- Reduced electromagnetic interference
Original Abstract Submitted
A package substrate includes a plurality of sequentially stacked insulating layers, a first signal line configured to transmit a first signal therethrough, and a ground line. The first signal line including a first signal via at least partially penetrating the plurality of insulating layers, a first signal pad provided at one end of the first signal via in any selected one of the insulating layers, and a first signal wiring extending from the first signal pad in the selected insulating layer. The ground line including a ground via at least partially penetrating the plurality of insulating layers, a ground pad provided at one end of the ground via in the selected insulating layer, a ground wiring extending from the ground pad in the selected insulating layer, and a ground stub extending from the ground pad toward the first signal via or the first signal pad.
