18169662. Electromagnetic Interference Shield with Thermal Conductivity simplified abstract (Apple Inc.)
Contents
Electromagnetic Interference Shield with Thermal Conductivity
Organization Name
Inventor(s)
Murali Krishna Atluru of Liberty Hill TX (US)
Cheng P Tan of Fremont CA (US)
Electromagnetic Interference Shield with Thermal Conductivity - A simplified explanation of the abstract
This abstract first appeared for US patent application 18169662 titled 'Electromagnetic Interference Shield with Thermal Conductivity
Simplified Explanation
- Explanation:**
The patent application is focused on techniques for thermal management and EMI shielding for a System on a Chip (SOC) device. It aims to reduce thermal resistance between the SOC die and heat dissipation components, while still providing EMI shielding to components of the SOC device. One example provided is the use of an EMI mesh on the SOC die, which allows a thermal interface material to physically couple the heat dissipation components and the SOC die while maintaining EMI shielding.
- Potential Applications:**
- Electronic devices with SOC technology - Mobile devices - IoT devices - Wearable technology
- Problems Solved:**
- Reduced thermal resistance in SOC devices - Improved EMI shielding for components - Enhanced overall performance and reliability of electronic devices
- Benefits:**
- Better thermal management - Enhanced EMI shielding - Improved performance and reliability of SOC devices - Potential for smaller form factors in electronic devices
Original Abstract Submitted
The present disclosure is directed to thermal management and electromagnetic interference (EMI) shielding techniques for a system on a chip (SOC) device to reduce the thermal resistance between a SOC die of the SOC device and heat dissipation components, while still providing EMI shielding to components of the SOC device. For example, a SOC device may include an EMI mesh disposed on the SOC die. The EMI mesh includes a plurality of windows such that a thermal interface material (TIM) may extend through the plurality of windows and physically couple both the heat dissipation components (e.g., a spreader) and the SOC die while still providing EMI shielding to the SOC die.
