18303659. SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)

SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company Limited

Inventor(s)

Harry-Hak-Lay Chuang of Zhubei City (TW)

Yuan-Jen Lee of Hsinchu (TW)

Kuo-An Liu of Hsinchu City (TW)

Ching-Huang Wang of Pingjhen City (TW)

C.T. Kuo of Hsinchu City (TW)

Tien-Wei Chiang of Taipei City (TW)

SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18303659 titled 'SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME

Simplified Explanation

The patent application describes devices and methods for forming a shielding assembly that includes a magnetic shield surrounding chip package structures sensitive to magnetic interference (MI) and electromagnetic interference (EMI). The shield is made of magnetic shielding materials such as silicon steel or Mu-metal, providing both EMI and MI protection to multiple chip package structures with varying susceptibilities to interference.

• Magnetic shield made of silicon steel or Mu-metal
• Provides EMI and MI protection to chip package structures
• Surrounds sidewalls and top surfaces of sensitive chip package structures

Potential Applications

The technology can be applied in various electronic devices where protection against both electromagnetic and magnetic interference is required, such as in medical devices, communication equipment, and automotive electronics.

Problems Solved

1. Protects sensitive chip package structures from both EMI and MI interference. 2. Ensures reliable performance of electronic devices in environments with high interference levels.

Benefits

1. Enhanced reliability and performance of electronic devices. 2. Cost-effective solution for mitigating EMI and MI issues in multiple chip package structures.

Potential Commercial Applications

"EMI and MI Shielding Technology for Electronic Devices"

Possible Prior Art

There are existing solutions for EMI and MI shielding in electronic devices, but the use of specific materials like silicon steel or Mu-metal for shielding multiple chip package structures with varying susceptibilities to interference may be a novel aspect of this technology.

How does the shielding material impact the overall size and weight of the electronic device?

The article does not address how the choice of shielding material affects the physical characteristics of the device.

Are there any limitations to the effectiveness of the shielding in extreme interference environments?

The article does not discuss the potential limitations of the shielding technology in highly intense interference environments.

Original Abstract Submitted

Devices and method for forming a shielding assembly including a first chip package structure sensitive to magnetic interference (MI), a second chip package structure sensitive to electromagnetic interference (EMI), and a shield surrounding sidewalls and top surfaces of the first chip package structure and the second chip package structure, in which the shield is a magnetic shielding material. In some embodiments, the shield may include silicon steel, in some embodiments, the shield may include Mu-metal. The silicon-steel-based or Mu-metal-based shield may provide both EMI and MI protection to multiple chip package structures with various susceptibilities to EMI and MI.