US Patent Application 18344652. INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC BLOCK simplified abstract
Contents
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC BLOCK
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Jiun-Yi Wu of Taoyuan City (TW)
Chien-Hsun Lee of Hsinchu County (TW)
Chewn-Pu Jou of Hsinchu City (TW)
Fu-Lung Hsueh of Kaohsiung City (TW)
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC BLOCK - A simplified explanation of the abstract
This abstract first appeared for US patent application 18344652 titled 'INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC BLOCK
Simplified Explanation
The patent application describes an interconnect structure that includes several components: a dielectric block, two conductive plugs, a substrate, and two conductive lines.
- The dielectric block surrounds the two conductive plugs.
- The substrate surrounds the dielectric block.
- One of the conductive lines is connected to the first conductive plug and is in contact with the top surface of the dielectric block.
- The second conductive line is connected to the second conductive plug.
Original Abstract Submitted
An interconnect structure includes a dielectric block, a first conductive plug, a second conductive plug, a substrate, a first conductive line, and a second conductive line. The first conductive plug and the second conductive plug are surrounded by the dielectric block. The substrate surrounds the dielectric block. The first conductive line is connected to the first conductive plug and is in contact with a top surface of the dielectric block. The second conductive line is connected to the second conductive plug.
