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Category:G02B6/12
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Pages in category "G02B6/12"
The following 42 pages are in this category, out of 42 total.
1
- 17849557. TECHNOLOGIES FOR EXPANDED BEAM OPTICAL CONNECTOR simplified abstract (Intel Corporation)
- 17898427. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17956750. NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract (Intel Corporation)
- 17957341. DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract (Intel Corporation)
- 17960151. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18088302. FRINGE PROJECTOR FOR DEPTH SENSING simplified abstract (Meta Platforms Technologies, LLC)
- 18099059. PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18148879. Optical Waveguide Structure and Manufacturing Method, Optical Waveguide Module, Optical Switching Device, and System simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18151033. Signal Communication Through Optical-Engine Based Interconnect Component simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151044. Packages With Photonic Engines and Method of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18178229. SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18298574. WAVELENGTH TUNING IN SILICON PHOTONICS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18465791. SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
- 18513611. SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517599. PHOTONIC INTEGRATED CIRCUIT PLATFORM AND OPTICAL PHASE ARRAY DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
B
I
- Intel corporation (20240103216). VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES simplified abstract
- Intel corporation (20240111089). NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract
- Intel corporation (20240111090). DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 28th, 2024
M
- Meta platforms technologies, llc (20240093984). FRINGE PROJECTOR FOR DEPTH SENSING simplified abstract
- Meta platforms technologies, llc (20240134115). WAVEGUIDE COUPLER FOR COUPLING LASER BEAM INTO PHOTONIC INTEGRATED CIRCUIT simplified abstract
- Meta Platforms Technologies, LLC patent applications on April 25th, 2024
- Meta Platforms Technologies, LLC patent applications on March 21st, 2024
S
T
- Taiwan semiconductor manufacturing co., ltd. (20240094469). Packages With Photonic Engines and Method of Forming the Same simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240113056). SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240118491). PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
U
- US Patent Application 18150557. PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE HAVING EMBEDDED OPTICAL GLUE simplified abstract
- US Patent Application 18358790. METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING simplified abstract
- US Patent Application 18366758. STRUCTURE AND PROCESS FOR PHOTONIC PACKAGES simplified abstract