DIRECTLY COUPLED OPTICAL INTERPOSER

The device described in the patent application comprises a substrate with an IC die, possibly a photonic IC, and an optical waveguide integrated into the substrate. The IC die is positioned within a hole in the substrate, with the optical port of the IC die aligned with the end of the optical waveguide.

Substrate with integrated optical waveguide
IC die positioned within a hole in the substrate
Optical port of the IC die aligned with the end of the optical waveguide
Possibility of the IC die being a photonic IC
Substrate may include a recess for another device with a socket

Potential Applications

This technology could be applied in:

Optical communication systems
Photonic integrated circuits
Biomedical devices

Problems Solved

This technology solves the following problems:

Efficient optical signal transmission
Integration of optical components in a compact space
Alignment of optical ports with waveguides

Benefits

The benefits of this technology include:

Improved optical signal quality
Compact and integrated optical systems
Enhanced performance of photonic devices

Potential Commercial Applications

The potential commercial applications of this technology include:

Telecommunications industry
Biomedical device manufacturers
Research institutions

Possible Prior Art

One possible prior art for this technology could be the integration of optical waveguides in substrates for photonic applications.

Unanswered Questions

How does this technology compare to existing optical integration methods?

This article does not provide a direct comparison with existing optical integration methods.

What are the specific dimensions and materials used in the substrate and IC die?

The article does not specify the exact dimensions and materials used in the substrate and IC die.

Original Abstract Submitted

A device comprises a substrate and an IC die, which may be a photonic IC. The substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. The hole comprises a first sidewall. The optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. The IC die is within the hole and comprises a second sidewall and an optical port at the second sidewall. The second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. The substrate may include a recess to receive another device comprising a socket.

17957341. DIRECTLY COUPLED OPTICAL INTERPOSER simplified abstract (Intel Corporation)

Contents

DIRECTLY COUPLED OPTICAL INTERPOSER

Organization Name

Inventor(s)