Taiwan semiconductor manufacturing co., ltd. (20240094469). Packages With Photonic Engines and Method of Forming the Same simplified abstract
Contents
- 1 Packages With Photonic Engines and Method of Forming the Same
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Packages With Photonic Engines and Method of Forming the Same - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Packages With Photonic Engines and Method of Forming the Same
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei CIty (TW)
Jui Lin Chao of NewTaipei City (TW)
Packages With Photonic Engines and Method of Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094469 titled 'Packages With Photonic Engines and Method of Forming the Same
Simplified Explanation
The method described in the abstract involves patterning a top silicon layer in a substrate to create multiple photonic devices, embedding them in a dielectric layer, forming an interconnect structure, bonding an electronic die, thinning the semiconductor layer, and creating dielectric regions with through-vias for electrical coupling.
- Patterning of top silicon layer to form photonic devices
- Embedding photonic devices in a dielectric layer
- Forming an interconnect structure for signal coupling
- Bonding an electronic die to the interconnect structure
- Thinning the semiconductor layer
- Creating dielectric regions with through-vias for electrical coupling
Potential Applications
This technology could be applied in the development of advanced photonic devices for communication systems, sensors, and optical computing.
Problems Solved
This method solves the challenge of integrating photonic and electronic components on the same substrate, enabling high-speed data transfer and signal processing.
Benefits
The benefits of this technology include improved performance, reduced signal loss, compact device size, and enhanced integration of photonic and electronic functionalities.
Potential Commercial Applications
Potential commercial applications of this technology include data centers, telecommunications infrastructure, aerospace systems, and medical devices.
Possible Prior Art
One possible prior art for this technology could be the integration of photonic devices on silicon substrates using different fabrication techniques.
Unanswered Questions
How does this technology compare to existing methods for integrating photonic and electronic components?
This article does not provide a direct comparison with existing methods for integrating photonic and electronic components. Further research or a comparative study would be needed to address this question.
What are the specific performance metrics and limitations of the photonic devices created using this method?
The article does not delve into specific performance metrics or limitations of the photonic devices created. Additional testing and analysis would be required to determine these aspects.
Original Abstract Submitted
a method includes patterning a top silicon layer in a substrate to form a plurality of photonic devices. the substrate includes the top silicon layer, a first dielectric layer under the top silicon layer, and a semiconductor layer under the first dielectric layer. the method further includes forming a second dielectric layer to embed the plurality of photonic devices therein, forming an interconnect structure over and signally coupling to the plurality of photonic devices, bonding an electronic die to the interconnect structure, thinning the semiconductor layer, and patterning the semiconductor layer that has been thinned to form openings. the openings are filled with a dielectric material to form dielectric regions. through-vias are formed to penetrate through the dielectric regions to electrically couple to the interconnect structure.
