18151033. Signal Communication Through Optical-Engine Based Interconnect Component simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Signal Communication Through Optical-Engine Based Interconnect Component
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsing-Kuo Hsia of Jhubei City (TW)
Chih-Wei Tseng of Hsinchu (TW)
Jui Lin Chao of New Taipei City (TW)
Signal Communication Through Optical-Engine Based Interconnect Component - A simplified explanation of the abstract
This abstract first appeared for US patent application 18151033 titled 'Signal Communication Through Optical-Engine Based Interconnect Component
Simplified Explanation
The method described in the patent application involves encapsulating two device dies in an encapsulant, forming an interconnect structure that electrically connects to the device dies, creating a waveguide in the interconnect structure, and bonding an optical-engine based interconnect component to the structure to form a signal path between the device dies.
- Encapsulating two device dies in an encapsulant
- Forming an interconnect structure to connect to the device dies
- Creating a waveguide within the interconnect structure
- Bonding an optical-engine based interconnect component to the structure
- Establishing a signal path between the device dies
Potential Applications
- High-speed data transmission
- Optical communication systems
- Integrated circuit packaging
Problems Solved
- Improving signal transmission speed and efficiency
- Enhancing data processing capabilities
- Reducing signal interference
Benefits
- Increased data transfer rates
- Enhanced signal reliability
- Compact and efficient design
Original Abstract Submitted
A method includes encapsulating a first device die and a second device die in an encapsulant, and forming an interconnect structure over and electrically connecting to the first device die and the second device die. A waveguide is formed in the interconnect structure. An optical-engine based interconnect component is bonded to the interconnect structure. The optical-engine based interconnect component forms a part of a signal path that connects the first device die to the second device die.
