18099059. PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsing-Kuo Hsia of Hsinchu (TW)
PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18099059 titled 'PHOTONIC SEMICONDUCTOR DEVICE, PHOTONIC SEMICONDUCTOR PACKAGE USING THE SAME AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The abstract describes a photonic semiconductor device that includes a light-emitting component and a photonic integrated circuit. The device is designed to efficiently transmit light emitted from the gain medium layer to the second taper portion through optical coupling in a short length of an optical coupling path.
- The device includes a light-emitting component with a gain medium layer, a first contact layer, and a first optical coupling layer stacked on top of each other.
- The photonic integrated circuit includes a second optical coupling layer that is stacked with the light-emitting component in a stacking direction.
- The first optical coupling layer has a first taper portion, and the second optical coupling layer has a second taper portion that overlaps with the first taper portion in the stacking direction.
- This design allows for the efficient transmission of light from the gain medium layer to the second taper portion through optical coupling, reducing the length of the optical coupling path.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Optical communication systems
- Laser diodes
- Photonic integrated circuits
Problems Solved
This technology addresses the following issues:
- Efficient transmission of light in photonic semiconductor devices
- Reduction of the length of optical coupling paths
- Improved performance of light-emitting components
Benefits
The benefits of this technology include:
- Enhanced efficiency in transmitting light
- Compact design for photonic semiconductor devices
- Improved overall performance of the device
Potential Commercial Applications
The potential commercial applications of this technology could include:
- Telecommunications industry
- Semiconductor manufacturing companies
- Research institutions
Possible Prior Art
One possible prior art for this technology could be the development of photonic integrated circuits with optical coupling layers. However, the specific design described in this patent application, with overlapping taper portions for efficient light transmission, may be a novel innovation.
Unanswered Questions
How does this technology compare to existing optical coupling methods in terms of efficiency and performance?
The article does not provide a direct comparison with existing optical coupling methods, so it is unclear how this technology stands out in terms of efficiency and performance.
Are there any limitations or challenges in implementing this technology in practical applications?
The article does not address any potential limitations or challenges that may arise in implementing this technology in real-world applications.
Original Abstract Submitted
A photonic semiconductor device including a light-emitting component and a photonic integrated circuit is provided. The light-emitting component at least includes a gain medium layer, a first contact layer and a first optical coupling layer stacked to each other. The photonic integrated circuit includes a second optical coupling layer. The light-emitting component and the photonic integrated circuit are stacked in a stacking direction, the first optical coupling layer has a first taper portion, the second optical coupling layer has a second taper portion, and the first taper portion and the second taper portion overlap in the stacking direction. Accordingly, the light emitted from the gain medium layer may be transmitted to the second taper portion from the first taper portion by optical coupling in a short length of an optical coupling path.
