18178229. SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
- 1 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chih-Wei Tseng of Hsinchu (TW)
Jui Lin Chao of New Taipei City (TW)
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18178229 titled 'SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
Simplified Explanation
The semiconductor package described in the abstract includes a first interposer with optical components, dielectric layers, and conductive connectors, as well as a photonic package bonded to the first interposer with dielectric-to-dielectric and metal-to-metal bonds.
- The semiconductor package consists of a first interposer with optical components, dielectric layers, and conductive connectors.
- A photonic package is bonded to the first interposer using dielectric-to-dielectric and metal-to-metal bonds.
Potential Applications
This technology could be applied in:
- High-speed data transmission systems
- Optical communication networks
Problems Solved
This technology helps address:
- Signal loss in high-speed data transmission
- Integration challenges in optical communication systems
Benefits
The benefits of this technology include:
- Improved signal integrity
- Enhanced data transmission speeds
Potential Commercial Applications
A potential commercial application for this technology could be in:
- Telecommunications equipment manufacturing
Possible Prior Art
One possible prior art for this technology could be:
- Semiconductor packages with optical components from previous patents
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to existing solutions.
What are the environmental implications of using this technology?
The article does not address the environmental impact of implementing this technology.
Original Abstract Submitted
A semiconductor package including a first interposer comprising a first substrate, first optical components over the first substrate, a first dielectric layer over the first optical components, and first conductive connectors embedded in the first dielectric layer, a photonic package bonded to a first side of the first interposer, where a first bond between the first interposer and the photonic package includes a dielectric-to-dielectric bond between a second dielectric layer on the photonic package and the first dielectric layer, and a second bond between the first interposer and the photonic package includes a metal-to-metal bond between a second conductive connector on the photonic package and a first one of the first conductive connectors and a first die bonded to the first side of the first interposer.
