18465791. SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF simplified abstract (ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE)
Contents
- 1 SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF
Organization Name
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Inventor(s)
SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18465791 titled 'SURFACE MOUNT TYPE OPTICAL MODULE AND ATTACHMENT/DETACHMENT APPARATUS AND METHOD THEREOF
Simplified Explanation
The present disclosure describes a surface mount type optical module and a compact and lightweight optical module attachment/detachment apparatus for mounting the optical module on a system board or package submount. The apparatus automates the loading/unloading, alignment, and laser soldering processes to facilitate easy attachment and detachment of the optical module in a confined space.
- Body frame for the attachment/detachment apparatus
- Fixing part to secure the body frame to the board
- Gripper for gripping the optical module
- Aligning part to align the position of the optical module with the board
- Laser part for non-contact bonding between the optical module and the board
Potential Applications
The technology can be used in various industries such as telecommunications, data centers, and consumer electronics for mounting optical modules on system boards or package submounts.
Problems Solved
1. Simplifies the process of attaching and detaching optical modules in confined spaces 2. Automates loading/unloading, alignment, and soldering processes for efficiency
Benefits
1. Compact and lightweight design 2. Easy attachment and detachment of optical modules 3. Facilitates non-contact bonding for secure mounting
Potential Commercial Applications
Optical communication systems, networking equipment, consumer electronics, medical devices
Possible Prior Art
Prior art may include manual methods of attaching and detaching optical modules, which can be time-consuming and less efficient compared to the automated apparatus described in this disclosure.
Unanswered Questions
1. What specific types of optical modules are compatible with this attachment/detachment apparatus? 2. Are there any limitations to the size or weight of the optical modules that can be mounted using this technology?
Original Abstract Submitted
The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.
