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Category:H01L23/16
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This category has the following 44 subcategories, out of 44 total.
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Pages in category "H01L23/16"
The following 87 pages are in this category, out of 87 total.
1
- 17822470. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17822476. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17840362. Molding Structures for Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17847130. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 18091270. IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract (Intel Corporation)
- 18121158. PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18334572. MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-RELIEF TRENCH (Intel Corporation)
- 18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435362. Integrated Circuit Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18524135. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18538889. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18604502. PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18673328. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18823171. FAN-OUT LEVEL SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18917246. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME (Samsung Electronics Co., Ltd.)
- 18941292. PACKAGE STRUCTURE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18955359. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18961031. LOW COST PACKAGE WARPAGE SOLUTION (Intel Corporation)
- 18969889. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (Intel Corporation)
- 18974937. SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18976369. PACKAGE STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18986778. SiC SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
- 19018792. COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS (TEXAS INSTRUMENTS INCORPORATED)
I
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240186197). SUBSTRATE ARCHITECTURE FOR ENHANCED ELECTROSTATIC CHUCKING simplified abstract
- Intel corporation (20240222211). IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract
- Intel corporation (20240258183). PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Intel corporation (20240258183). PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL simplified abstract
- Intel corporation (20240421102). MICROELECTRONIC ASSEMBLIES INCLUDING A MOLD MATERIAL WITH A STRESS-RELIEF TRENCH
- Intel corporation (20250096009). LOW COST PACKAGE WARPAGE SOLUTION
- Intel corporation (20250096178). MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on August 1st, 2024
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on February 13th, 2025
- Intel Corporation patent applications on February 29th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 20th, 2025
M
- Mitsubishi electric corporation (20240304567). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240347403). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on October 17th, 2024
- Mitsubishi Electric Corporation patent applications on September 12th, 2024
S
- Samsung electronics co., ltd. (20240096820). METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract
- Samsung electronics co., ltd. (20240203940). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240429110). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250062167). SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES
- Samsung electronics co., ltd. (20250087642). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250105159). FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250149467). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
T
- Taiwan semiconductor manufacturing co., ltd. (20240222215). PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312930). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250105090). SEMICONDUCTOR DEVICE
- Taiwan semiconductor manufacturing co., ltd. (20250105191). PACKAGE STRUCTURE
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240178091). Integrated Circuit Package and Method simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243076). SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062204). INTEGRATED CIRCUIT PACKAGE AND METHOD
- Taiwan semiconductor manufacturing company, ltd. (20250070050). PACKAGE STRUCTURE
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024
- Texas instruments incorporated (20250006573). OPEN CAVITY SENSOR
- Texas Instruments Incorporated patent applications on February 1st, 2024
- Texas Instruments Incorporated patent applications on January 2nd, 2025