SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on March 27th, 2025
SAMSUNG ELECTRONICS CO., LTD.: 226 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H01L23/00 (31), H01L23/498 (17), H01L25/065 (15), H01L29/66 (11), H10B12/00 (10) H10B43/27 (4), H01L23/5283 (3), H01Q1/243 (3), H04L5/0051 (3), H01L25/0657 (3)
With keywords such as: device, including, semiconductor, layer, surface, data, substrate, based, region, and configured in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
20250098931. DISH WASHER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Johannes BUESING of Suwon-si KR for samsung electronics co., ltd., Jisun YANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A47L15/42
CPC Code(s): A47L15/4217
Abstract: a dish washer comprising: a tub forming a washing chamber; a plurality of spray rotors spraying water into the washing chamber; and a sump assembly. the sump assembly comprises: a sum housing including a distribution chamber to accommodate water which is provided to the plurality of spray rotors; a distribution disk, positionable in the distribution chamber, to provide the water accommodated in the distribution chamber to at least one of the plurality of spray rotors; a distribution motor generating rotational force to rotate the distribution disk; and a connecting shaft to transmit the rotational force of the distribution motor to the distribution disk and guide water leaking from the distribution chamber to outside of the connecting shaft.
Inventor(s): Hyunjun JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A61B5/1455, A61B5/00
CPC Code(s): A61B5/1455
Abstract: a wearable device includes a light-emitting part including a light source for emitting light of multiple wavelengths including a first wavelength band corresponding to a first bandwidth, a second wavelength band corresponding to a second bandwidth, and a third wavelength band corresponding to a third bandwidth, a light-receiving part for detecting reflection light reflected from the user's skin, by light of multiple wavelengths, a signal acquisition part for selecting light of two or more wavelengths at which an oxygen hemoglobin absorption rate is the same as a reduced hemoglobin absorption rate, from among the reflection light, the signal acquisition part acquiring pulse wave signals corresponding to the light of the selected wavelengths, and an estimating part for estimating a percentage of an object to be detected, on the basis of an absorption rate of each wavelength of pulse wave signals.
Inventor(s): Doyoon KIM of Suwon-si KR for samsung electronics co., ltd., Chanwon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/0205, A61B5/024, A61B5/08, A61B5/11
CPC Code(s): A61B5/4812
Abstract: a sleep management system including: a plurality of sensors including a first sensor and a second sensor, the first sensor and the second sensor being configured to collect data of a user; a hub device configured to: receive first data from the first sensor and second data from the second sensor, obtain first processed data based on processing of the first data, and obtain second processed data based on processing of the second data; and a user device configured to: receive the first processed data and the second processed data from the hub device, obtain sleep state information about a sleep stage and a body movement of the user based on the first processed data and the second processed data, determine whether a rapid eye movement sleep behavior disorder (rbd) of the user occurs based on the body movement of the user.
Inventor(s): Chanwon Lee of Suwon-si KR for samsung electronics co., ltd., Doyoon Kim of Suwon-si KR for samsung electronics co., ltd., Jonggyu Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A61B5/00, A61B5/0205, A61B5/024, A61B5/11, A61B5/1455, A61B5/28
CPC Code(s): A61B5/4812
Abstract: provided is a sleep management system, including a plurality of sensors including a first sensor and a second sensor being configured to collect data of a user, a hub device configured to receive first data collected by the first sensor and second data collected by the second sensor, obtain first processed data based on processing of the first data and second processed data based on processing of the second data, and a user device configured to receive the first processed data and the second processed data, obtain sleep state information corresponding to a sleep stage and a body movement of the user based on the first processed data and the second processed data, determine whether a non-rapid eye movement (nrem) sleep behavior disorder of the user occurs based on the user's sleep stage and the user's body movement, and perform a preset operation based on an occurrence of the nrem.
Inventor(s): Sunok KIM of Suwon-si KR for samsung electronics co., ltd., Yuhyun AN of Suwon-si KR for samsung electronics co., ltd., Junho LEE of Suwon-si KR for samsung electronics co., ltd., Bosung JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): A61M21/02, A61M21/00
CPC Code(s): A61M21/02
Abstract: a sleep management system includes a plurality of sensors obtaining user data; a hub device configured to preprocess the user data obtained by the plurality of sensors; and a user device configured to obtain the preprocessed user data from the hub device. the user device determines a stability level of the user based on the preprocessed user data, provides a sleep induction program corresponding to the stability level of the user through a user interface, monitors a change in the stability level of the user according to the providing of the sleep induction program, and provides feedback information corresponding to the change in the stability level of the user through the user interface.
Inventor(s): Seungyoon Kim of Suwon-si KR for samsung electronics co., ltd., Eunkyoung Kim of Suwon-si KR for samsung electronics co., ltd., Boumyoung Park of Suwon-si KR for samsung electronics co., ltd., Hyodong Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): B24B37/26
CPC Code(s): B24B37/26
Abstract: a buffing treatment module includes: a buffing table that supports a substrate; a buffing head located on the buffing table and configured to rotate; and a buffing pad attached to a lower part of the buffing head and rotating while in contact with the substrate for performing buffing treatment on the substrate, wherein the buffing pad includes: a base unit; a plurality of protrusion units that protrude from a surface of the base unit and are spaced apart from each other in a circumferential direction of the base unit; and a plurality of trench units positioned adjacent to the plurality of protrusion units, and extending from a center portion of the base unit to an edge portion of the base unit, wherein the plurality of trench units are spaced apart from each other in the circumferential direction of the base unit.
Inventor(s): Ohyun Kwon of Suwon-si KR for samsung electronics co., ltd., Jongwon Choi of Suwon-si KR for samsung electronics co., ltd., Byoungki Choi of Suwon-si KR for samsung electronics co., ltd., Jungok Chu of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/02, C09K11/06, H10K85/30, H10K85/40, H10K85/60
CPC Code(s): C07F15/0033
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Ohyun Kwon of Suwon-si KR for samsung electronics co., ltd., Jongwon Choi of Suwon-si KR for samsung electronics co., ltd., Byoungki Choi of Suwon-si KR for samsung electronics co., ltd., Jungok Chu of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/02, C09K11/06, H10K85/30, H10K85/40, H10K85/60
CPC Code(s): C07F15/0033
Abstract:
()() formula 1
Inventor(s): Ohyun Kwon of Suwon-si KR for samsung electronics co., ltd., Jongwon Choi of Suwon-si KR for samsung electronics co., ltd., Byoungki Choi of Suwon-si KR for samsung electronics co., ltd., Jungok Chu of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/02, C09K11/06, H10K85/30, H10K85/40, H10K85/60
CPC Code(s): C07F15/0033
Abstract: wherein, in formula 1, mis a transition metal, lis a ligand represented by formula 1a, lis a ligand represented by formula 1b, and n1 and n2 are each independently 1 or 2,
Inventor(s): Ohyun Kwon of Suwon-si KR for samsung electronics co., ltd., Jongwon Choi of Suwon-si KR for samsung electronics co., ltd., Byoungki Choi of Suwon-si KR for samsung electronics co., ltd., Jungok Chu of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/02, C09K11/06, H10K85/30, H10K85/40, H10K85/60
CPC Code(s): C07F15/0033
Abstract:
Inventor(s): Ohyun Kwon of Suwon-si KR for samsung electronics co., ltd., Jongwon Choi of Suwon-si KR for samsung electronics co., ltd., Byoungki Choi of Suwon-si KR for samsung electronics co., ltd., Jungok Chu of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C07F15/00, C09K11/02, C09K11/06, H10K85/30, H10K85/40, H10K85/60
CPC Code(s): C07F15/0033
Abstract: wherein xis c or n; xis c(r) or n, xis c(r) or n, xis c(r) or n, xis c(r) or n, xis c(r) or n, xis c(r) or n, xis c(r) or n, xis c(r) or n, xis c(r) or n, and xis c(r) or n; at least one of rcomprises fluorine; b2 is an integer from 1 to 6; * and *′ each indicate a binding site to m; and the remaining descriptions of formulae 1a and 1b are as provided herein.
Inventor(s): Changhyeon An of Suwon-si KR for samsung electronics co., ltd., Yeonsik Jung of Daejeon-si KR for samsung electronics co., ltd., Yemin Park of Daejeon-si KR for samsung electronics co., ltd., Jeehyun Hong of Daejeon-si KR for samsung electronics co., ltd., Youngseog Kang of Suwon-si KR for samsung electronics co., ltd., Changmin Park of Suwon-si KR for samsung electronics co., ltd., Kwangsub Yoon of Suwon-si KR for samsung electronics co., ltd., Jisun Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C08F8/32, C08F293/00, H01L21/027, H01L21/308
CPC Code(s): C08F8/32
Abstract: a block copolymer is described, such as one including a first polymer block and a second polymer block that have different structures, wherein the first polymer block includes a first unit derived from an acrylic acid ester, and the second polymer block includes an inorganic material-containing random block, in which a second unit including an inorganic material-containing group and a third unit that is devoid of an inorganic material-containing group are connected to each other to provide a concentration gradient. also described are methods of manufacturing an integrated circuit device that include forming, on a feature layer, a block copolymer layer including the block copolymer as set forth above; phase-separating the block copolymer layer to form a structure that includes a plurality of first domains that each include the first polymer block, and at least one second domain including the second polymer block; removing the plurality of first domains; and etching the feature layer using the at least one second domain as an etch mask.
20250101582. APPARATUS FOR TREATING SUBSTRATE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Seung Jin YOU of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): C23C16/44
CPC Code(s): C23C16/4409
Abstract: an apparatus for treating a substrate is provided. an apparatus for treating a substrate comprises a first body, a second body forming a chamber space therein in contact with the first body, a first gas supply line installed in the first body and a first connection portion, and a second gas supply line installed in the second body and a second connection portion, the second connection portion configured to contact the first connection portion, wherein the first connection portion includes a sealing groove, into which a gasket is inserted, on a surface that is in contact with the second connection portion, an inner wall separating a first flow path of the first gas supply line from the sealing groove, and a trench installed on the inner wall and fluidly connecting the first flow path to the sealing groove.
20250101972. COMPRESSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungmin KIM of Suwon-si KR for samsung electronics co., ltd., Jiwoong KIM of Suwon-si KR for samsung electronics co., ltd., Ohyeok KWON of Suwon-si KR for samsung electronics co., ltd., Yongtae KIM of Suwon-si KR for samsung electronics co., ltd., Kichul SONG of Suwon-si KR for samsung electronics co., ltd., Wooju JEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F04B39/10, F04B39/00, F04B39/08
CPC Code(s): F04B39/1066
Abstract: a compressor may include a valve plate having a suction port, a cylinder forming a compression chamber, a piston in the compression chamber, and which is movable in the compression chamber, a suction valve unit coupled to the valve plate and having a suction valve which is movable, based on movement of the piston, to open and close the suction, and a cushioning member disposed between the valve plate and the suction valve unit, outside of the suction port, and configured to be elastically deformed by contact with the suction valve if the suction valve is moved to open or close the suction port.
20250101976. SCROLL COMPRESSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Mooseong BAE of Suwon-si KR for samsung electronics co., ltd., Jongsoo NOH of Suwon-si KR for samsung electronics co., ltd., Inwon PARK of Suwon-si KR for samsung electronics co., ltd., Sanghun SEONG of Suwon-si KR for samsung electronics co., ltd., Jaesang LEE of Suwon-si KR for samsung electronics co., ltd., Sungchan CHO of Suwon-si KR for samsung electronics co., ltd., Yanghee CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F04C2/02
CPC Code(s): F04C2/025
Abstract: a scroll compressor can include a frame including a shaft hole, a fixed scroll on an upper side of the frame, an orbiting scroll between the fixed scroll and the frame, a lower surface of the orbiting scroll including a boss inserted into the shaft hole, a rotatable shaft including an eccentric portion inserted into the boss and inserted into the shaft hole, a first bearing in the shaft hole between the shaft hole and a bearing support coupled to an outer circumferential surface of the rotating shaft, an inner circumferential surface of the first bearing being supported by an outer circumferential surface of the bearing support, the bearing support being separatable from, and couplable to, the rotating shaft, and a second bearing between the boss and the eccentric portion so that a location of the second bearing overlaps the first bearing in an axial direction of the rotatable shaft.
Inventor(s): Sungdo JO of Suwon-si KR for samsung electronics co., ltd., Sunggi KIM of Suwon-si KR for samsung electronics co., ltd., Sunghwan PARK of Suwon-si KR for samsung electronics co., ltd., Jinoh HONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F16M11/16, F16M11/24
CPC Code(s): F16M11/16
Abstract: a supporting device for supporting a display may include a stand base including a first coupling portion; and a stand neck including a second coupling portion being couplable with the first coupling portion, the stand neck being supported by the stand base and being connectable to a rear side of the display. the first coupling portion may include: a first coupling body formed in a hollow shape; and a coupling hole formed in the first coupling body. the second coupling portion may include: a second coupling body being insertable in the first coupling body; a spring accommodated inside the second coupling body; and an elastic block being movable relative to the second coupling body by the spring and corresponding to the coupling hole.
Inventor(s): Jaechan PARK of Suwon-si KR for samsung electronics co., ltd., Jeonguk KOH of Suwon-si KR for samsung electronics co., ltd., Sungtae KIM of Suwon-si KR for samsung electronics co., ltd., Woong SUN of Suwon-si KR for samsung electronics co., ltd., Kwangnam SHIN of Suwon-si KR for samsung electronics co., ltd., Seungjin YUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F24F1/56
CPC Code(s): F24F1/56
Abstract: an outdoor unit of an air conditioner comprises: a first body and a second body fixed by a fastener. the first body comprises: a first fixing plate comprising a first burring hole penetrated by the fastener, the first fixing plate supporting the second body; a second fixing plate comprising a second burring hole penetrated by the fastener, the second fixing plate being in contact with one surface of the first fixing plate opposite to the second body; a first flange provided along the first burring hole and protruding from the first fixing plate in a direction of penetrating the second burring hole; and a second flange provided along of the second burring hole and protruding from the second fixing plate in a direction away from the first fixing plate. an inner surface of the second flange is in contact with an outer surface of the first flange.
20250102196. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehyun LEE of Suwon-si KR for samsung electronics co., ltd., Sungbok KO of Suwon-si KR for samsung electronics co., ltd., Myounghun KIM of Suwon-si KR for samsung electronics co., ltd., Ilsung BAE of Suwon-si KR for samsung electronics co., ltd., Seokjun SON of Suwon-si KR for samsung electronics co., ltd., Byungkwan YANG of Suwon-si KR for samsung electronics co., ltd., Wonjae YOON of Suwon-si KR for samsung electronics co., ltd., Insub LEE of Suwon-si KR for samsung electronics co., ltd., Hyoju HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25B21/02
CPC Code(s): F25B21/02
Abstract: a refrigerator may include: a body; a storage compartment inside the body; a door configured to open and close the storage compartment; an evaporator configured to evaporate a refrigerant to generate cold air; an evaporator duct at a rear side of the storage compartment and configured to supply cold air generated by the evaporator to the storage compartment; and a thermoelectric cooling device including a thermoelectric element including a heating portion and a cooling portion, wherein the thermoelectric cooling device is configured to heat air from outside of the body with the heating portion and discharge the air heated by the heating portion to outside of the body, and to cool air from the storage compartment with the cooling portion and supply the cooled air to the storage compartment, and the thermoelectric cooling device is disposed on an upper side of the storage chamber.
20250102197. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehwan LEE of Suwon-si KR for samsung electronics co., ltd., Haejin SONG of Suwon-si KR for samsung electronics co., ltd., Heemoon JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25B21/02
CPC Code(s): F25B21/02
Abstract: a refrigerator including an inner case having an inner case opening, an outer case having an outer case opening, a mounting frame having a passage between the inner case opening and the outer case opening, an insulation in an insulating space where one end of the passage of the mounting frame is at the inner case opening of the inner case and another end of passage of the mounting frame is at the outer case opening, a thermoelectric element including a heat-absorbing surface and a heat-generating surface, a cooling sink in contact with the heat-absorbing surface so as to exchange heat with the heat-absorbing surface, and a heat sink in contact with the heat-generating surface so as to exchange heat with the heat-generating surface, wherein the cooling sink and the heat sink are respectively coupled to the mounting frame.
20250102198. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changwan HAN of Suwon-si KR for samsung electronics co., ltd., Sungbok KO of Suwon-si KR for samsung electronics co., ltd., Ilsung BAE of Suwon-si KR for samsung electronics co., ltd., Seokjun SON of Suwon-si KR for samsung electronics co., ltd., Byungkwan YANG of Suwon-si KR for samsung electronics co., ltd., Wonjae YOON of Suwon-si KR for samsung electronics co., ltd., Oungu LEE of Suwon-si KR for samsung electronics co., ltd., Bongkeun LIM of Suwon-si KR for samsung electronics co., ltd., Sangyoul CHA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25B21/04, F25D17/04, F25D23/02
CPC Code(s): F25B21/04
Abstract: a refrigerator may include: a body; a storage compartment inside the body; first and second doors to open and close the storage compartment; a rotation bar coupled to one of the doors and rotatable to cover a gap between the doors when they are closed; a thermoelectric element including a heating portion and a cooling portion to cool the storage compartment; a heat sink heated by the heating portion; a fan configured to flow air toward the heat sink to exchange heat with the heat sink; and a duct including: a first discharge portion to discharge a first portion of the airflow, which exchanged heat with the heat sink, to an outside of the body; and a second discharge portion to discharge a second portion of the airflow, which exchanged heat with the heat sink, to the rotation bar to prevent dew from condensing on the rotation bar.
20250102216. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaehyun LEE of Suwon-si KR for samsung electronics co., ltd., Sungbok KO of Suwon-si KR for samsung electronics co., ltd., Myounghun KIM of Suwon-si KR for samsung electronics co., ltd., Ilsung BAE of Suwon-si KR for samsung electronics co., ltd., Seokjun SON of Suwon-si KR for samsung electronics co., ltd., Byungkwan YANG of Suwon-si KR for samsung electronics co., ltd., Wonjae YOON of Suwon-si KR for samsung electronics co., ltd., Oungu LEE of Suwon-si KR for samsung electronics co., ltd., Hyoju HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25D11/02, F25B21/02, F25D17/06, F25D21/14, F25D23/00
CPC Code(s): F25D11/025
Abstract: a refrigerator may include: a body including an upper wall, a compartment in the body, a door to open or close the compartment, a thermoelectric element on the upper wall and including: a heating portion which generates heat and faces upward and a cooling portion which absorbs heat and faces downward, a cooling sink including a base contacting the cooling portion, and fins protruding from the base perpendicular to a lower surface of the base and extending parallel to the lower surface of the base so that the cooling sink is cooled by the cooling portion, a fan on the upper wall to blow air toward the fins so that the air is cooled, and a duct on the upper wall to guide the air into the compartment.
20250102220. REFRIGERATOR WITH WATER TANK_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngjo PARK of Suwon-si KR for samsung electronics co., ltd., Seongu LEE of Suwon-si KR for samsung electronics co., ltd., Seongoh KWAK of Suwon-si KR for samsung electronics co., ltd., Kitae PARK of Suwon-si KR for samsung electronics co., ltd., Yongik CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25D23/12
CPC Code(s): F25D23/126
Abstract: a refrigerator includes: a main body, a door rotationally or slidably installed at a front of the main body, at least one storage chamber configured to store items, a water tank arranged in the at least one storage chamber and configured to store water to be supplied to at least one water supply system, a water detection sensor configured to detect the water stored in the water tank, and at least one processor configured to, when the water stored in the water tank is detected for at least a certain period of time by the water detection sensor, control a first pump to discharge the water stored in the water tank onto an evaporation tray under a condenser in a machine room by using a discharge path for defrost water.
Inventor(s): Hyosuck KANG of Suwon-si KR for samsung electronics co., ltd., Daesung KIM of Suwon-si KR for samsung electronics co., ltd., Sanghyeok PARK of Suwon-si KR for samsung electronics co., ltd., Jongkyoung BOK of Suwon-si KR for samsung electronics co., ltd., Youngseok CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): F25D29/00, G10L17/02, G10L17/22, G10L25/51
CPC Code(s): F25D29/003
Abstract: a refrigerator is provided. the refrigerator includes memory storing a preset frequency of the refrigerator and one or more computer programs, a communication interface communicating with a terminal device, a driving unit, and one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the refrigerator to receive audio information sensed by the terminal device from the terminal device through the communication interface while the refrigerator operates in a first mode, extract refrigerator noise from the audio information based on the preset frequency, acquire location information of the terminal device based on the refrigerator noise when the refrigerator noise is greater than or equal to a threshold value, and control the driving unit to operate in a second mode different from the first mode when the terminal device is identified as being within a critical distance from the refrigerator based on the location information.
Inventor(s): Guanbo Chen of Mckinney TX US for samsung electronics co., ltd., Songwei Li of Mckinney TX US for samsung electronics co., ltd., Yuming Zhu of Plano TX US for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Frisco TX US for samsung electronics co., ltd.
IPC Code(s): G01S7/00, G01S7/41, G01S13/52, H04W24/02, H04W84/12
CPC Code(s): G01S7/006
Abstract: a computer-implemented method for multi-device sensing at a first device in a wireless network, comprising: determining, by the first device, whether the first device operates in a mode in which the first device and a second device coordinate to simultaneously transmit and receive radio frequency (rf) signals and the first device is within a distance of the second device, exchanging, by the first device, rf signals with the second device, obtaining, by communicating with the second device, signal information from the exchanged rf signals, and performing sensing based on the signal information
Inventor(s): Xingyu HAN of Beijing CN for samsung electronics co., ltd., Hong WANG of Beijing CN for samsung electronics co., ltd.
IPC Code(s): G01S13/76, H04L5/00
CPC Code(s): G01S13/765
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method performed by location management function (lmf) in a communication system, the method comprising: transmitting, to a serving base station, a first request message for an area-specific reference signal configuration; and receiving, from the serving base station, a first response message including reference signal configuration information; wherein the reference signal configuration information includes: at least one reference signal configuration and validity area related information corresponding to the reference signal configuration.
20250102748. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon KANG of Suwon-si KR for samsung electronics co., ltd., Daegon KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G02B6/42, G02B6/43
CPC Code(s): G02B6/4283
Abstract: a semiconductor package includes a redistribution layer on a substrate, a semiconductor chip on the redistribution layer, and a stack structure on the redistribution layer and spaced apart from the semiconductor chip in a horizontal direction, wherein the stack structure includes an optical integrated circuit chip, the first optical integrated circuit chip includes a first region adjacent to the semiconductor chip and a second region adjacent to an outer portion of the substrate, and the optical integrated circuit chip defines a first notch and a first groove in the second region, the first groove recessed upwards in a vertical direction from a lower surface of the optical integrated circuit chip, the first groove recessed downwards in the vertical direction from an upper surface of the optical integrated circuit chip.
Inventor(s): Jungpa SEO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G02B13/00, G02B3/14, G02B15/00
CPC Code(s): G02B13/0075
Abstract: provided is a lens assembly including a reflective optical member, an image sensor configured to receive at least a portion of light transmitted through the reflective optical member, at least three lenses disposed sequentially along a direction of an optical axis of the lens assembly between the reflective optical member and the image sensor, and a tunable lens between the at least three lenses and the image sensor, the tunable lens being configured to have a variable refractive power or curvature, wherein the reflective optical member is configured to reflect light incident in a direction intersecting the optical axis.
Inventor(s): Jeonggeun YUN of Suwon-si KR for samsung electronics co., ltd., Youngmo Jeong of Suwon-si KR for samsung electronics co., ltd., Jongchul Choi of Suwon-si KR for samsung electronics co., ltd., Bonkon Koo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G02B27/01, B82Y20/00, G02B1/00, G02B27/00
CPC Code(s): G02B27/0172
Abstract: an electronic device, including: an infra-red (ir) light source configured to output infrared light; a waveguide; a first optical element on a first area of the waveguide, wherein the first optical element is configured to allow external light to enter the waveguide; a second optical element on a second area of the waveguide, wherein the second optical element is configured to output the external light incident to an outside of the waveguide; a third optical element on a third area of the waveguide, wherein the third area is different from the first area and the second area, and wherein the third optical element is configured to diffract the infrared light; and an image sensor configured to receive the diffracted infrared light
20250102809. DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangwoo HA of Seongnam-si KR for samsung electronics co., ltd., Tetsuo ARIYOSHI of Seongnam-si KR for samsung electronics co., ltd., Sornoon PARK of Seoul KR for samsung electronics co., ltd., llseop WON of Hwaseong-si KR for samsung electronics co., ltd., Jongpil WON of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): G02B27/01, F21V8/00, G02B5/18, G02B5/26, G02B27/09, G02B27/28, G02B27/42
CPC Code(s): G02B27/0172
Abstract: a display device includes a light guide plate; an input grating on a first surface of the light guide plate and configured to generate a diffracted transmission beam; an output grating on the first surface of the light guide plate and spaced apart from the input grating, wherein the output grating is configured to generate a first output beam emitted from the light guide plate; and an optical efficiency enhancement layer on a second surface of the light guide plate and overlapping at least one of the input grating and the output grating in a traveling direction of the input beam, the second surface being opposite to the first surface.
20250102859. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yongsung Yoo of Suwon-si KR for samsung electronics co., ltd., Jungmin An of Suwon-si KR for samsung electronics co., ltd., Dahoon Won of Suwon-si KR for samsung electronics co., ltd., Dongjung Yun of Suwon-si KR for samsung electronics co., ltd., Youngwook Jung of Suwon-si KR for samsung electronics co., ltd., Minnyeong Han of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G02F1/13357
CPC Code(s): G02F1/133605
Abstract: provided is a display apparatus including: a display panel; a plurality of light sources configured to radiate light onto the display panel; and a reflective sheet including a central area, a middle area outward from the central area, an edge area outward from the middle area, and a plurality of holes corresponding to positions of the plurality of light sources, wherein the reflective sheet is configured to reflect the light radiated from the plurality of light sources toward the display panel, wherein the plurality of holes includes a first hole in the middle area, a second hole in the central area, and a third hole in the edge area, and wherein a size of the first hole is larger than a size of the second hole and a size of the third hole.
Inventor(s): Jinwon JEON of Suwon-si KR for samsung electronics co., ltd., Haengdeog KOH of Suwon-si KR for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si KR for samsung electronics co., ltd., Mijeong KIM of Suwon-si KR for samsung electronics co., ltd., Sunyoung LEE of Suwon-si KR for samsung electronics co., ltd., Changheon LEE of Suwon-si KR for samsung electronics co., ltd., Kyuhyun IM of Suwon-si KR for samsung electronics co., ltd., Jungha CHAE of Suwon-si KR for samsung electronics co., ltd., Minyoung HA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07F7/22
CPC Code(s): G03F7/0042
Abstract: provided are an organometallic compound represented by one of formulae 1-1 to 1-4, a resist composition including the same, and a pattern formation method using the resist composition:
Inventor(s): Jinwon JEON of Suwon-si KR for samsung electronics co., ltd., Haengdeog KOH of Suwon-si KR for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si KR for samsung electronics co., ltd., Mijeong KIM of Suwon-si KR for samsung electronics co., ltd., Sunyoung LEE of Suwon-si KR for samsung electronics co., ltd., Changheon LEE of Suwon-si KR for samsung electronics co., ltd., Kyuhyun IM of Suwon-si KR for samsung electronics co., ltd., Jungha CHAE of Suwon-si KR for samsung electronics co., ltd., Minyoung HA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07F7/22
CPC Code(s): G03F7/0042
Abstract:
Inventor(s): Jinwon JEON of Suwon-si KR for samsung electronics co., ltd., Haengdeog KOH of Suwon-si KR for samsung electronics co., ltd., Yoonhyun KWAK of Suwon-si KR for samsung electronics co., ltd., Mijeong KIM of Suwon-si KR for samsung electronics co., ltd., Sunyoung LEE of Suwon-si KR for samsung electronics co., ltd., Changheon LEE of Suwon-si KR for samsung electronics co., ltd., Kyuhyun IM of Suwon-si KR for samsung electronics co., ltd., Jungha CHAE of Suwon-si KR for samsung electronics co., ltd., Minyoung HA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/004, C07F7/22
CPC Code(s): G03F7/0042
Abstract: m, qto q, b11 to b14, rto r, yto y, and xto xin formulae 1-1 to 1-4 are as described in the specification.
Inventor(s): Honggu Im of Suwon-si KR for samsung electronics co., ltd., Yonghoon Moon of Suwon-si KR for samsung electronics co., ltd., Jeongju Park of Suwon-si KR for samsung electronics co., ltd., Jicheol Park of Suwon-si KR for samsung electronics co., ltd., Giyoung Song of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/039, C08F212/14, C08F220/38, C08F228/02, G03F7/038, H01L21/027
CPC Code(s): G03F7/039
Abstract: photoresist compositions and methods of manufacturing an integrated circuit device by using said photoresist compositions are described. the photoresist compositions may include a photosensitive polymer, a photoacid generator (pag), and a solvent, wherein the photosensitive polymer contains a sulfonate group (—soo—) bonded with an �-trifluoromethylbenzyl group.
Inventor(s): Sanghwan LEE of Suwon-si KR for samsung electronics co., ltd., DOHYUNG KIM of Suwon-si KR for samsung electronics co., ltd., JINHONG PARK of Suwon-si KR for samsung electronics co., ltd., Sungbin JEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G03F7/00
CPC Code(s): G03F7/70833
Abstract: disclosed are a reticle masking device, a substrate processing apparatus, and a substrate processing method. the reticle masking device comprises a first masking device that provides a mask hole, a second masking device that is movable in a first direction with respect to the first masking device, and an optical sensor device coupled to the second masking device. the second masking device provides a slit vertically penetrates the second masking device and that overlaps the mask hole. the optical sensor device includes a first sensor fixedly coupled to a bottom surface of the second masking device, and a second sensor that stands opposite to the first sensor across the slit and is fixedly coupled to the bottom surface of the second masking device.
Inventor(s): Tongsung KIM of Suwon-si KR for samsung electronics co., ltd., Woojung KIM of Suwon-si KR for samsung electronics co., ltd., Yoonji PARK of Suwon-si KR for samsung electronics co., ltd., Younghoon SON of Suwon-si KR for samsung electronics co., ltd., Seonkyoo LEE of Suwon-si KR for samsung electronics co., ltd., Ilyoung JIN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/08, G06F1/10
CPC Code(s): G06F1/08
Abstract: provided are an apparatus and a method for adjusting a skew between data and a clock. the apparatus driven by a supply voltage includes a clock circuit that adjusts a skew between data and a clock. the clock circuit performs a first loop operation through a first loop and a second loop operation through a second loop, based on a phase difference between data and a clock. the first loop operation is performed until there is no phase difference between the data and the clock, and the second loop operation is performed until a first slope representing a change in delay of the data with respect to the levels of the power voltage and a second slope representing a change in delay of the clock become identical to each other.
Inventor(s): Kyusung HAN of Suwon-si KR for samsung electronics co., ltd., Hongki KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/041
CPC Code(s): G06F1/163
Abstract: a wearable electronic device is provided. the wearable electronic device includes a housing, which includes a first part at least partially exposed to an outside to receive a touch by being seated on at least a portion of a body of a user, and a second part extending from the first part, and configured to be concealed by the first part by being inserted into an ear canal of the user, the first part including a first touch area facing a first direction and a second touch area disposed on at least a portion of a lateral edge of the first part, adjacent to the first touch area and facing a second direction, a main touch sensor disposed below the first touch area, an auxiliary touch sensor disposed below the second touch area, and a circuit board disposed inside the housing, and including a processor electrically connected to the main touch sensor and the auxiliary touch sensor and configured to control an operation state of the wearable electronic device based on touch information obtained from the main touch sensor and the auxiliary touch sensor, wherein the auxiliary touch sensor includes a first auxiliary touch sensor and a second auxiliary touch sensor, disposed below the second touch area, wherein the processor is further configured to maintain the operation state of the wearable electronic device, when a touch sensitivity measured at least a portion of the first auxiliary touch sensor and the second auxiliary touch sensor is equal to or greater than a first threshold, and wherein the processor is further configured to change the operation state of the wearable electronic device, when touch sensitivities measured at the first auxiliary touch sensor and the second auxiliary touch sensor are less than the first threshold and a touch sensitivity measured at the main touch sensor is equal to or greater than a second threshold.
Inventor(s): Md Mahmud Muntakim KHAN of Dhaka IN for samsung electronics co., ltd., Faisal Khan of Dhaka IN for samsung electronics co., ltd., M Shaykat Shuva of Dhaka IN for samsung electronics co., ltd.
IPC Code(s): G06F3/0354, G06F3/041, G06F3/04883
CPC Code(s): G06F3/03545
Abstract: provided are an electronic device for executing an operation based on a user input via an electronic pen and an operating method of the electronic device, the operating method including: connecting to the electronic pen; receiving, from the electronic pen, a first input via a touch input to a touch pad at least one operation of rotation of at least a part of the electronic pen or the entire electronic pen; and executing a preset operation based on the first input.
Inventor(s): Minwoo LEE of Suwon-si KR for samsung electronics co., ltd., Taehwan KIM of Suwon-si KR for samsung electronics co., ltd., Kwangsub BYUN of Suwon-si KR for samsung electronics co., ltd., Sungjin SON of Suwon-si KR for samsung electronics co., ltd., Jooheon LEE of Suwon-si KR for samsung electronics co., ltd., Junyoung JEON of Suwon-si KR for samsung electronics co., ltd., Junho JUNG of Suwon-si KR for samsung electronics co., ltd., Hyunseok CHA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/0487, G06F3/0362, G06F3/0482
CPC Code(s): G06F3/0487
Abstract: a method of controlling a user interface in an electronic device according to an embodiment of the present disclosure may comprise: obtaining a wheel-based signal being executed by wheel manipulation; and obtaining an input signal type supported by a running application; based on the input signal type being a first input signal type, transferring the obtained wheel-based signal to the running application; and based on the input signal type being a second input signal type, changing the obtained wheel-based signal to a direction control signal and transferring same to the running application.
Inventor(s): Seungjoon PARK of Suwon-si KR for samsung electronics co., ltd., Jinhui PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/0488, G06F1/16, G06F3/046, G06F3/0484
CPC Code(s): G06F3/0488
Abstract: an electronic device is provided. the electronic device includes a display, memory storing one or more computer programs, and one or more processors communicatively coupled to the display and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to display a user interface (ui) having a first size within a display region of the display, receive touch inputs contacted on the display region while the user interface is displayed, in response to the touch inputs, identify a first partial region of the display region, based on a pattern and/or position of contact points corresponding to the touch input on the display region, wherein the first partial region of the display region is positioned under an external electronic device on the display region, and in response to the identification, refrain from recognizing a touch input having a contact point within the first partial region, and display the user interface having a second size smaller than the first size, within a second partial region of the display region adjacent to the first partial region.
Inventor(s): Insoo KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0611
Abstract: a memory system includes a memory device, and a memory controller connected to the memory device. the memory controller is configured to analyze a pattern of the suspend schedule command a plurality of times to obtain a plurality of analysis results, select an operating mode from among a plurality of operating modes based on the plurality of analysis results, determine a suspend schedule based on the operating mode, and perform a memory operation on the memory device based on the suspend schedule. the plurality of operating modes including a latency mode and a throughput mode. the memory operation including at least one of a read operation or a write operation.
Inventor(s): Kwangjin LEE of Suwon-si KR for samsung electronics co., ltd., Kirock KWON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0619
Abstract: a storage device includes a memory device including a plurality of memory blocks, a temperature sensor measuring an internal temperature of the storage device, and a controller, wherein the temperature sensor measures a program temperature at a point in time of programming data in the plurality of memory blocks, and the controller stores the program temperature of program memory blocks, wherein the controller determines at least one memory block failed to read the data programmed in the plurality of memory blocks, when the program temperature of the error block and a read attempt temperature fall within a driving guarantee temperature range, and the controller is configured to calculate a difference in temperature between the program temperature of the error block and the read attempt temperature, compares the difference in temperature and a guarantee magnitude, to register the error block as a bad block or a refresh candidate block.
Inventor(s): Tae Won KIM of Suwon-si KR for samsung electronics co., ltd., Jun Myung WOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G11C11/406
CPC Code(s): G06F3/0619
Abstract: a memory device includes a memory cell array including memory cell rows, a first random number generator generating an n-bit first pseudo random bit sequence signal based on a first seed and a first degree, first and second memory cell row picking circuits, and a refresh control circuit. the first memory cell row picking circuit randomly selects a first memory cell row at a first cycle, and stores a row address of the selected first memory cell row in a first queue. the second memory cell row picking circuit randomly selects a second memory cell row at a second cycle, and stores a row address of the selected second memory cell row in a second queue. the refresh control circuit performs a refresh operation on memory cell rows physically adjacent to memory cell rows corresponding to each of the row addresses stored in the first queue and the second queue.
Inventor(s): Kwang-Jin Lee of Suwon-si KR for samsung electronics co., ltd., Kirock Kwon of Suwon-si KR for samsung electronics co., ltd., Chanho Jung of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0647
Abstract: a storage device includes a non-volatile memory and a storage controller. the non-volatile memory includes a plurality of storage regions, and the plurality of storage regions include a first storage region and a second storage region which have different types. the storage controller programs data from a host device in the first storage region, based on safety level information of the host device and remaining storage region information of the non-volatile memory. based on the safety level information and the remaining storage region information, the storage controller migrates the data programmed in the first storage region to the second storage region or returns the data migrated to the second storage region to the first storage region.
Inventor(s): Dongmin Kim of Suwon-si KR for samsung electronics co., ltd., Jeongwoo Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: provided are a storage device performing communication with an external storage device via a host and an operating method of the storage device. the operating method includes: receiving a first packet from the host; transmitting a second packet to the host in response to the first packet, wherein the second packet includes first information to be provided to an external storage device and a device id value that indicates the external storage device; and receiving a third packet from the host, wherein the third packet includes second information generated by the external storage device.
20250103242. DATA STORAGE METHOD AND DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Siyu MOU of Xi'an CN for samsung electronics co., ltd., Kun DOU of Xi'an CN for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0658
Abstract: a data storage method performed by at least one processor of an object storage device (osd) of a storage system comprises receiving data from an external device through an ethernet interface of an ethernet solid state drive (ssd) of the osd. the method further includes storing the received data in the ethernet ssd.
Inventor(s): Kilsoo CHOI of Suwon-si KR for samsung electronics co., ltd., Sehyun KIM of Suwon-si KR for samsung electronics co., ltd., Jongin LEE of Suwon-si KR for samsung electronics co., ltd., Hyeeun PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F3/14, G06T3/60
CPC Code(s): G06F3/14
Abstract: an electronic device and an operation method thereof. the electronic device includes a memory and a processor configured to identify a usage environment of the electronic device based on receiving a request associated with displaying an image through a display of the electronic device, select one of a first mode or a second mode based on which the image is to be displayed, according to the identified usage environment of the electronic device. the processor is configured to, based on the first mode being selected, change extended display identification data (edid), transmit the changed edid to a source device from which the image is received, receive an adjusted image according to the changed edid from the source device, and display the adjusted image on the display, and based on the second mode being selected, rotate the image received from the source device and display the rotated image on the display.
Inventor(s): Shaoying ZHAO of Xi'an CN for samsung electronics co., ltd., Dong XU of Xi'an CN for samsung electronics co., ltd., Xin PAN of Xi'an CN for samsung electronics co., ltd., Yajun ZHI of Xi'an CN for samsung electronics co., ltd.
IPC Code(s): G06F3/16, H04L43/028
CPC Code(s): G06F3/16
Abstract: a method for audio sharing may include: establishing, by a first primary audio playing device of a first set of audio playing devices, a wireless connection with an audio sharing device, broadcasting, by the first primary audio playing device, a snoop enable message, the snoop enable message including information indicating a desired wireless communication channel, receiving, by the first primary audio playing device, a snoop consent event message sent on the desired wireless communication channel from a second primary audio playing device of a second set of audio playing devices, and snooping for and playing at least one audio packet sent on the desired wireless communication channel by an audio sharing device.
Inventor(s): Pascal M. Brunet of Pasadena CA US for samsung electronics co., ltd.
IPC Code(s): G06F3/16
CPC Code(s): G06F3/165
Abstract: one embodiment provides a computer-implemented method that includes predicting, based on an artificial intelligence (ai) model, a look-ahead level to adjust one or more levels for an audio stream in real-time. the method further includes providing level adjustments without user parametrization while improving sound quality for the audio stream.
Inventor(s): Jae Hun JANG of Suwon-si KR for samsung electronics co., ltd., Hong Rak SON of Suwon-si KR for samsung electronics co., ltd., Dong-Min SHIN of Suwon-si KR for samsung electronics co., ltd., JongYoon YOON of Suwon-si KR for samsung electronics co., ltd., Younho JEON of Suwon-si KR for samsung electronics co., ltd., Sejung KWON of Seongnam-si KR for samsung electronics co., ltd., Byeoungwook KIM of Seongnam-si KR for samsung electronics co., ltd., Baeseong PARK of Seongnam-si KR for samsung electronics co., ltd., Mankeun SEO of Suwon-si KR for samsung electronics co., ltd., Byungmin AHN of Suwon-si KR for samsung electronics co., ltd., Dongsoo LEE of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): G06F7/485, G06F5/01, G06F7/22
CPC Code(s): G06F7/485
Abstract: disclosed is an accelerator performing an accumulation operation on a plurality of data, each being a floating point type. a method of operating the accelerator includes loading first data, finding a first exponent, which is a maximum value among exponents of the first data, generating aligned first fractions by performing a bit shift on first fractions of the first data based on the first exponent, and generating a first accumulated value by an accumulation operation on the aligned first fractions, loading second data, finding a second exponent, which is a maximum value among exponents of the second data, and generating a first aligned accumulated value by a bit shift on the first accumulated value, generating aligned second fractions by a bit shift on second fractions of the second data, and generating a second accumulated value by an accumulation operation on the aligned second fractions and the first aligned accumulated value.
Inventor(s): Kwanhee JEONG of Suwon-si KR for samsung electronics co., ltd., Hyoungjong KIM of Suwon-si KR for samsung electronics co., ltd., Chanbin LIM of Suwon-si KR for samsung electronics co., ltd., Sengtai LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F8/41
CPC Code(s): G06F8/41
Abstract: an electronic device according to an embodiment may compile second type instructions stored in a package and obtain an order of a plurality of packages on the basis of execution of a first application for obtaining first type instructions. the electronic device may sequentially compile the plurality of packages on the basis of the obtained order. the electronic device may compile one or more packages from among the plurality of packages on the basis of frequencies of the plurality of packages being executed, in response to identification that at least one of a memory usage, a temperature, or a battery of the electronic device is within a designated range while sequentially compiling the plurality of packages on the basis of the execution of the first application.
Inventor(s): Jaesung LEE of Suwon-si KR for samsung electronics co., ltd., Inmyung WOO of Suwon-si KR for samsung electronics co., ltd., Seungho LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F8/65
CPC Code(s): G06F8/65
Abstract: provided is an electronic device, a charging device for updating firmware, and a control method therefor. the electronic device includes: a communicator including signal lines configured to transmit signals to and from a charging device; a memory storing instructions; and a processor configured to execute the instructions to: based on detecting a connection between the charging device and the electronic device, obtain version information of a firmware program installed on the charging device via the signal lines, based on the version information being different from reference version information, transmit a notification signal for updating the firmware program to the charging device, wherein the notification signal is configured to cause the charging device to switch a signal transmission/reception mode of the charging device from a power signal transmission/reception mode to a data signal transmission/reception mode, and transmit firmware update data to the charging device via the signal lines.
Inventor(s): Son Ngoc PHAM of Seoul KR for samsung electronics co., ltd., Taeweon SUH of Seoul-si KR for samsung electronics co., ltd.
IPC Code(s): G06F9/30
CPC Code(s): G06F9/30038
Abstract: provided is an operating method of a processing circuit, the method including generating a first compressed chunk including only a first valid value, generating a first mask includes a reference value at a same position as a position of the first valid value, and includes a plurality of first sub-masks, generating a second compressed chunk including only a second valid value, generating a second mask, includes a reference value at a same position as a position of the second valid value, and includes a plurality of second sub-masks, generating a valid pair position value for each of a current first sub-mask and a current second sub-mask, generating a first cumulative value corresponding to a number of reference values included in a first previous sub-mask, and generating a second cumulative value corresponding to a number of reference values included in a second previous sub-mask.
Inventor(s): Kyungmin KANG of Suwon-si KR for samsung electronics co., ltd., Iksoon KIM of Suwon-si KR for samsung electronics co., ltd., Changhyeon CHAE of Suwon-si KR for samsung electronics co., ltd., Youngho CHOI of Suwon-si KR for samsung electronics co., ltd., Byungkwon KANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F9/50
CPC Code(s): G06F9/5027
Abstract: an electronic device according to an embodiment of the disclosure may, in response to execution of an application being requested, identify at least one service associated with the application, determine a first scheduling policy and a second scheduling policy to be applied to at least one process associated with the at least one service, apply the first scheduling policy corresponding to a higher scheduling priority, of the first scheduling policy and the second scheduling policy, to the at least one process, and release the first scheduling policy and apply the second scheduling policy to the at least one process in response to generation of an application process executing the application.
Inventor(s): Bo Youn Park of Suwon-si KR for samsung electronics co., ltd., Chung Woo Park of Suwon-si KR for samsung electronics co., ltd., Chang Yong Park of Suwon-si KR for samsung electronics co., ltd., Gang Li of Suwon-si KR for samsung electronics co., ltd., Lei Wang of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F11/36, G06F11/07
CPC Code(s): G06F11/3644
Abstract: a system on chip comprises a first core cluster including a plurality of cores and executing a first virtual machine including a first debug client, and a second core cluster including a plurality of cores and executing a second virtual machine including a second debug client. a first core of the first core cluster and a second core of the second cluster execute a hypervisor at a first exception level and detect unusual operation cores in each cluster. the first core and second core execute the debug server at the first exception level and call the debug clients. the first core and second core execute the debug clients at a second exception level and output stack information of the unusual operation cores.
Inventor(s): Ting ZHANG of Suwon-si KR for samsung electronics co., ltd., Sizhe XIONG of Suwon-si KR for samsung electronics co., ltd., Huimei XIONG of Suwon-si KR for samsung electronics co., ltd., Weibang LIU of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/02, G06N5/022
CPC Code(s): G06F12/0246
Abstract: a data processing method includes acquiring input/output (i/o) data of plural storage apparatuses connected based on redundant arrays of independent disks (raid), determining a stripe size for a data operation based on the i/o data, and storing the i/o data into the storage apparatuses based on the stripe size.
Inventor(s): Chanha KIM of Suwon-si KR for samsung electronics co., ltd., Jiyeun KANG of Suwon-si KR for samsung electronics co., ltd., Alain TRAN of Suwon-si KR for samsung electronics co., ltd., Soojun IM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0246
Abstract: a storage device includes a non-volatile memory device including a plurality of memory blocks; and a memory controller configured to control a garbage collection operation of copying valid data of a source block among the plurality of memory blocks to a destination block. the memory controller is configured to read a logical address stored in a page included in the source block, determine a validity of user data stored in the page included in the source block based on the logical address, read the valid data, which includes the user data determined to be valid, from the non-volatile memory device, and perform a write operation on the destination block by transferring the read valid data to the non-volatile memory device.
Inventor(s): Mingoo KANG of Suwon-si KR for samsung electronics co., ltd., Joonyoung CHANG of Suwon-si KR for samsung electronics co., ltd., Sungcheol PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0246
Abstract: a compute express link (cxl) memory device may include a high bandwidth memory (hbm) comprising a cxl base die and a plurality of core dies that are sequentially stacked on the cxl base die. the cxl base die may include an hmb interface intellectual property (ip) core configured to convert data transmission and reception between the plurality of core dies and dynamic random access memory (dram) in compliance with a cxl specification, and the hmb interface ip core corresponds to a non-joint electron device engineering council (jedec) standard.
Inventor(s): Hanjun Lee of Suwon-si KR for samsung electronics co., ltd., Suyong Kim of Suwon-si KR for samsung electronics co., ltd., Seungjae Lee of Suwon-si KR for samsung electronics co., ltd., Suchang Jeon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F12/14, G06F3/06
CPC Code(s): G06F12/1408
Abstract: a nonvolatile memory device includes a memory cell array to store an original setting data, a page buffer circuit connected to the memory cell array through a plurality of bit-lines, a secure buffer and a control circuit. the secure buffer includes an access control circuit and a plurality registers with restricted access, and the plurality registers store the original setting data that is dumped-down from the memory cell array through the page buffer circuit in an initialization sequence. the control circuit controls the page buffer circuit and the secure buffer. the plurality registers include a first register and second registers. the access control circuit, in response to the first register being accessed, accesses at least a portion of the second registers concurrently with accessing the first register.
Inventor(s): Sompong Paul OLARIG of Pleasanton CA US for samsung electronics co., ltd., Fred WORLEY of San Jose CA US for samsung electronics co., ltd., Son PHAM of San Ramon CA US for samsung electronics co., ltd.
IPC Code(s): G06F13/40, G06F13/16, G06F13/42
CPC Code(s): G06F13/4022
Abstract: a system includes a fabric switch including a motherboard, a baseboard management controller (bmc), a network switch configured to transport network signals, and a pcie switch configured to transport pcie signals; a midplane; and a plurality of device ports. each of the plurality of device ports is configured to connect a storage device to the motherboard of the fabric switch over the midplane and carry the network signals and the pcie signals over the midplane. the storage device is configurable in multiple modes based a protocol established over a fabric connection between the system and the storage device.
Inventor(s): Sompong Paul OLARIG of Pleasanton CA US for samsung electronics co., ltd., Fred WORLEY of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): G06F13/40, G06F13/16
CPC Code(s): G06F13/4022
Abstract: a rack-mountable data storage system includes: a chassis including one or more switchboards; a midplane interfacing with the one or more switchboards; and one or more data storage devices removably coupled to the midplane using a connector. at least one data storage device of the one or more data storage devices include a logic device to interface with the midplane. the logic device provides a device-specific interface of a corresponding data storage device with the midplane. the at least one data storage device is configured using the logic device according to a first protocol based on a signal on a pin of the connector, and the at least one data storage device is reconfigurable according to a second protocol based on a change of the signal on the pin of the connector using the logic device.
Inventor(s): Chao LIN of Xi'An CN for samsung electronics co., ltd., Wenwen CHEN of Xi'An CN for samsung electronics co., ltd.
IPC Code(s): G06F16/17, G06F16/16
CPC Code(s): G06F16/1724
Abstract: the present disclosure is related to a file processing method, electronic apparatus and storage medium, the file processing method including: updating a file list according to file access information for a file in a storage device, wherein the file list contains file inode numbers of files to be defragmented; defragmenting the files to be defragmented corresponding to the file inode numbers in the storage device, according to the updated file list, in response to the occurrence of a triggering event.
Inventor(s): Sangmin PARK of Suwon-si KR for samsung electronics co., ltd., Gajin SONG of Suwon-si KR for samsung electronics co., ltd., Kyungtae KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F16/334, G06F40/30
CPC Code(s): G06F16/3344
Abstract: an electronic device is provided. the electronic device includes memory storing one or more computer programs. the electronic device includes one or more processors communicatively coupled to the memory. the one or more computer programs include computer-executable instructions. the computer-executable instructions, when executed by the one or more processors, may cause the electronic device to receive an utterance of a user. the computer-executable instructions, when executed by the one or more processors, may cause the electronic device to analyze a bias of the utterance or a bias of the user. the computer-executable instructions, when executed by the one or more processors, may cause the electronic device to generate a response including biased information, based on an analysis result of the bias of the utterance or an analysis result of the bias of the user. the computer-executable instructions, when executed by the one or more processors, may cause the electronic device to provide the response to the user.
Inventor(s): Atul GUPTA of Noida IN for samsung electronics co., ltd., Manali ARORA of Delhi IN for samsung electronics co., ltd., Shreya BHARTI of Ghaziabad IN for samsung electronics co., ltd., Manas Ranjan SAHOO of Noida IN for samsung electronics co., ltd.
IPC Code(s): G06F16/906, G06F16/908, G16Y20/10
CPC Code(s): G06F16/906
Abstract: a method performed by an electronic device for providing an appropriate alternate receiver to perform one or more input events in an internet of things (iot) environment is provided. the method includes performing one or more actions including determining essentiality and classifying the one or more input events and determining expected response for the one or more input events, determining current availability of a receiver for the one or more input events, predicting response of the receiver to the one or more input events, based on current availability of the receiver with respect to the expected response.
20250103787. ROUTING METHOD AND SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongsu LEE of Suwon-si KR for samsung electronics co., ltd., Wontae JEONG of Suwon-si KR for samsung electronics co., ltd., Sungcheol PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06F30/3953
CPC Code(s): G06F30/3953
Abstract: a routing method for an integrated circuit includes selecting design for testing (dft) instances targeted by routing, routing positions respectively corresponding to the dft instances, generating routing sequences for the dft instances, deriving a start point and an end point based on indices included in each of the routing sequences, calculating a distance between the start point and the end point, and selecting a routing sequence as a result of the calculating of the distance.
Inventor(s): Bo Gyeong Kang of Suwon-si KR for samsung electronics co., ltd., Ye Ji Kim of Suwon-si KR for samsung electronics co., ltd., Min-Chul Park of Suwon-si KR for samsung electronics co., ltd., Byoung Seon Choi of Suwon-si KR for samsung electronics co., ltd., Seong Ryeol Kim of Suwon-si KR for samsung electronics co., ltd., Young-Gu Kim of Suwon-si KR for samsung electronics co., ltd., Jae Myung Choe of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06V10/44, G06V10/75, G06V10/762
CPC Code(s): G06T7/0008
Abstract: a computing device of predicting potential predicting potential defect-inducing factors within a semiconductor layout is provided. the computing device comprising: a machine learning module, calculating predicted measurement data corresponding to at least one first semiconductor layout image among a plurality of semiconductor layout mages after being trained based on the plurality of semiconductor layout images and corresponding real measurement data and an image explanation module generating an attribution map image of the predicted measurement data based on an image regression model utilizing an integrated gradient (ig) manner, analyzing the attribution map image and detecting elements within the attribution map image with attribution values with high sensitivity to the predicted measurement data as potential defect-inducing factors in advance.
Inventor(s): Hyeongseok SON of Suwon-si KR for samsung electronics co., ltd., Seungin PARK of Suwon-si KR for samsung electronics co., ltd., Byung In YOO of Suwon-si KR for samsung electronics co., ltd., Dongwook LEE of Suwon-si KR for samsung electronics co., ltd., Sangil JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/50, G06T5/20, G06T7/12
CPC Code(s): G06T7/50
Abstract: a method performed by one or more processors of an electronic device includes: processing an input image and point cloud data corresponding to the input image; projecting the point cloud data to generate a first depth map and adding new depth values to the first depth map based on the input image; obtaining a second depth map by inputting the input image to a depth estimation model configured to infer depth maps from input images; and training the depth estimation model based on a loss difference between the first depth map and the second depth map.
Inventor(s): Kyuhyun CHO of Suwon-si KR for samsung electronics co., ltd., Jinsol PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T7/70, G06T7/55
CPC Code(s): G06T7/70
Abstract: an electronic device is disclosed. an electronic device, according to one embodiment of the present disclosure, may include: a memory; and at least one processor electrically connected to the memory, wherein the at least one processor be configured to generate first subject information associated with a first image and second subject information associated with a second image; identify first distance information associated with the first image and second distance information associated with the second image; identify first coordinate information based on the first subject information and the first distance information; identify second coordinate information based on the second subject information and the second distance information; generate first plane information based on the first coordinate information and the second coordinate information; and store the first plane information in the memory.
Inventor(s): Bonggil BAK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T11/00, G06T5/20, G06T5/77, G06T7/11, G06T7/194, G06T7/90, G06V10/56, G06V10/60, G06V20/20
CPC Code(s): G06T11/00
Abstract: an electronic device comprising a memory; a camera; a communication unit; and at least one processor electrically connectable to the memory, the camera, and the communication unit. the at least one processor to: extract a frame from an image including a plurality of frames; identify an rgb vector of the frame; determine a light source vector by filtering the rgb vector of the frame through a first filter; identify an illuminance value of the frame; determine an illuminance value in relation to a composite image by filtering the illuminance value of the frame through a second filter; and generate synthetic light source information on the basis of the light source vector and the illuminance value in relation to the composite image.
20250104318. Real-Time Avatar Animation_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Liang Zhao of Saratoga CA US for samsung electronics co., ltd., Siva Penke of San Jose CA US for samsung electronics co., ltd., Christopher Peri of Mountain View CA US for samsung electronics co., ltd., Byeonghee Yu of Berkeley CA US for samsung electronics co., ltd., Jisun Park of Palo Alto CA US for samsung electronics co., ltd.
IPC Code(s): G06T13/20, G06T13/40, G10L15/02, G10L15/06, G10L21/028, G10L25/63
CPC Code(s): G06T13/205
Abstract: in one embodiment, a method includes accessing an audio input that includes a mixture of vocal sounds and non-vocal sounds and separating, by a trained audio source separation model, the audio input into a first audio output representing the vocal sounds and a second audio output representing the non-vocal sounds. the method further includes determining, by one or more trained avatar animation models and by separately encoding the first audio output representing the vocal sounds and the second audio output representing the non-vocal sounds, an avatar animation temporally corresponding to the audio input; and rendering, in real time and temporally coincident with the audio input, the determined avatar animation.
Inventor(s): Hyunwoong CHO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T17/00, G01C21/36
CPC Code(s): G06T17/00
Abstract: a processor-implemented method includes, based on an overlapping area between a first sensing range of a first sensor and a second sensing range, of a second sensor, that includes an area occluded to the first sensor by an object in the first sensing range, generating an occupancy map by supplementing information about the occluded area among the first point cloud data based on a corresponding portion of the second point cloud data, wherein an acquisition timepoint of the first point cloud data and an acquisition timepoint of the second point cloud data are a same timepoint or temporally adjacent to each other, wherein the first point cloud data corresponds to the first sensing range of the first sensor from a perspective of the first sensor of a moving object, where the first sensing range corresponds to a surrounding area of the moving object, and wherein the second point cloud data corresponds to the second sensing range of the second sensor that is remote from the first sensor, where the second sensing range corresponds to a surrounding area of the second sensor.
Inventor(s): Michal WODCZAK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T17/20, G06T13/40
CPC Code(s): G06T17/20
Abstract: a method of providing a virtual world service, includes: receiving, by a service-based architecture (sba), a first registration request from a user equipment (ue); receiving, by the sba, a second registration request for a virtual object related to the ue through a virtual application function (vaf) in a virtual world, based on whether the first registration request is allowed; acquiring parameters for the ue, the virtual object, and the virtual world by an artificial intelligence function (aif); and providing a virtual mesh function (vmf) with information configured for the virtual world by the aif.
Inventor(s): Seowon JI of Suwon-si KR for samsung electronics co., ltd., Seunghak SHIN of Suwon-si KR for samsung electronics co., ltd., Jaeyun JEONG of Suwon-si KR for samsung electronics co., ltd., Yoonjae YEO of Suwon-si KR for samsung electronics co., ltd., Seungjae WON of Suwon-si KR for samsung electronics co., ltd., Jaehyun JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06T19/20, G06F3/01, G06F3/0488, G06F3/16, G06F40/295, G06F40/40, G06V10/40, G06V40/20
CPC Code(s): G06T19/20
Abstract: an electronic device may include: a display; a camera configured to obtain an image; a memory storing at least one instruction; and at least one processor configured to execute the at least one instruction to: obtain spatial information about a real-world space based on the image obtained through the camera; obtain user inputs based on the image obtained through the camera; obtain object characteristic information from the user inputs; obtain object generation information for generating a virtual object, based on the spatial information and the object characteristic information; generate the virtual object for the object generation information by inputting the object generation information to a generative artificial intelligence (ai) model trained to generate a three-dimensional (3d) virtual object based on information about a space and an object; and control the display to display the virtual object.
Inventor(s): Hyunjun JUNG of Suwon-si KR for samsung electronics co., ltd., Hyoujoo KWON of Suwon-si KR for samsung electronics co., ltd., Hyuncheol PARK of Suwon-si KR for samsung electronics co., ltd., Soohan YOO of Suwon-si KR for samsung electronics co., ltd., Seungwon LEE of Suwon-si KR for samsung electronics co., ltd., Seongwook JO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G06V40/13, G06F1/16, H05K1/18
CPC Code(s): G06V40/1318
Abstract: a ring-type wearable electronic device is provided. the ring-type wearable electronic device includes a ring-shape housing including a first housing portion and a second housing portion coupled to the first housing portion, wherein the second housing portion is configured to contact a finger of a user wearing the ring-type wearable electronic device, a first light source including a plurality of light emitters disposed in the ring-shape housing, and configured to emit light of red wavelength and infrared wavelength bands towards the finger, a first sensor disposed in the ring-shape housing, and configured to receive light emitted by the first light source, a second sensor disposed in the ring-shape housing, and configured to receive light emitted by the first light source, wherein the first sensor is positioned farther from the first light source than the second sensor is positioned from the first light source, a flexible printed circuit board (fpcb) disposed in the ring-shape housing, wherein the first light source, the first sensor, and the second sensor are disposed on the fpcb at least partially bent corresponding to the ring-shape housing, at least one processor including a processing circuitry, and memory storing instructions, wherein the instructions, when executed by the at least one processor individually or collectively, cause the ring-type wearable electronic device to: emit, by the first light source at a first time, first light of red wavelength and infrared wavelength bands, the first light being configured to reach the first sensor through the finger, based on the first light emitted by the first light source at the first time, obtain first information corresponding to part of the first light that is received by the first sensor via the finger, emit, by the first light source at a second time different from the first time, second light of red wavelength and infrared wavelength bands, the second light being configured to reach the second sensor through the finger, based on the second light emitted by the first light source at the second time, obtain second information corresponding to part of the second light that is received by the second sensor via the finger, and acquire an oxygen saturation information of the user based on at least one of the first information or the second information.
Inventor(s): Hajun Lee of Suwon-si KR for samsung electronics co., ltd., Mi-Ri Park of Suwon-si KR for samsung electronics co., ltd., Junhyuk Yang of Suwon-si KR for samsung electronics co., ltd., Seungmin Jeong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/00, G09G3/20, G09G3/3233, G09G3/3275
CPC Code(s): G09G3/006
Abstract: a display device including a plurality of channels including at least one dummy channel; a plurality of first sampling circuits sampling a plurality of dummy voltages corresponding to each of the at least one dummy channel; and a holding/scaling circuit including a first input node, a second input node, a first output node, a second output node, a first feedback capacitor connected between the first input node and the first output node, and a second feedback capacitor connected between the second input node and the second output node.
Inventor(s): Sungjin LIM of Suwon-si KR for samsung electronics co., ltd., Seungjun JEONG of Suwon-si KR for samsung electronics co., ltd., Hyun KANG of Suwon-si KR for samsung electronics co., ltd., Woosuk KO of Suwon-si KR for samsung electronics co., ltd., Myeonggu KIM of Suwon-si KR for samsung electronics co., ltd., Namwoo PARK of Suwon-si KR for samsung electronics co., ltd., Yongcheol PARK of Suwon-si KR for samsung electronics co., ltd., Wanhee CHUN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/32
CPC Code(s): G09G3/32
Abstract: a method of manufacturing including: generating first compensation data based on pre-stored first mura data; displaying a test image according to the first compensation data; generating second mura data based on the displayed test image; generating second compensation data based on the second mura data; generating integrated compensation data based on a combination of the first compensation data and the second compensation data; and compensating for a luminance of the display device based on the integrated compensation data.
20250104617. DISPLAY DEVICE AND OPERATION METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taeyong SON of Suwon-si KR for samsung electronics co., ltd., Jungmin KU of Suwon-si KR for samsung electronics co., ltd., Sunghwan JANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/32
CPC Code(s): G09G3/32
Abstract: a display device is disclosed. the display device includes: a plurality of light-emitting elements including light emitting circuitry comprising a plurality of subpixels of a display panel, a light emitting diode (led) driving circuit configured to drive the plurality of light emitting elements, a substrate on which the plurality of light emitting elements and the led driving circuit are disposed, memory storing an abnormal pixel area and led arrangement information of the abnormal pixel area, and at least one processor, comprising processing circuitry, individually and/or collectively, configured to control the led driving circuit such that a signal corresponding to gradation information corresponding to each of the plurality of light emitting elements is provided based on specified led color positions, wherein at least one processor, individually and/or collectively, is configured to control the led driving circuit such that a signal corresponding to the led arrangement information of the abnormal pixel area is provided instead of the specified led color positions, with respect to the plurality of light-emitting devices in the abnormal pixel area.
Inventor(s): Sangwon KIM of Suwon-si KR for samsung electronics co., ltd., Jeongryeol Seo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/32, H10H29/32
CPC Code(s): G09G3/32
Abstract: a display device includes a power supply, a display, a communication interface including circuitry, and at least one processor. the display device obtains humidity information of ambient air from a sensor, or receives the humidity information from an external device through the communication interface while the display device is in a standby mode, based on identifying that a humidity of the ambient air is greater than or equal to a threshold value based on the obtained humidity information, switches the display device from the standby mode to a dehumidification mode, and based on the display device being switched to the dehumidification mode, controls the power supply to supply power to the display, and controls the display to sequentially display each of a plurality of predetermined images.
Inventor(s): Changju Lee of Suwon-si KR for samsung electronics co., ltd., Woojoo Kim of Suwon-si KR for samsung electronics co., ltd., Haksong Kim of Suwon-si KR for samsung electronics co., ltd., Kyounghwan Kwon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G09G3/3208
CPC Code(s): G09G3/3208
Abstract: a display driving circuit operating in video mode is described. the display driving circuit includes an interface configured to receive, from an external source, sync signals and image data corresponding to each of a plurality of frames, a data processor configured to receive the image data from the interface and convert the image data, and a timing controller configured to generate internal control signals for driving a driver circuit based on the sync signals and the image data. the internal control signals are configured to be output only when the sync signals and signals corresponding to the image data are input simultaneously, and panel driving signals are configured to be output when the internal control signals are output.
Inventor(s): Andri Bezzola of La Canada CA US for samsung electronics co., ltd., Adrian Celestinos Arroyo of Valencia CA US for samsung electronics co., ltd.
IPC Code(s): G10K11/178, H04R1/10, H04R1/22, H04R3/04, H04R29/00
CPC Code(s): G10K11/17821
Abstract: one embodiment provides a method comprising obtaining, via a microphone of a hearable device, one or more measurements of a first individual transfer function from a transducer of the hearable device to a first sound pressure at the microphone. at least a portion of the hearable device is within proximity of an ear canal of an individual ear. the method further comprises determining, based on the one or more measurements of the first individual transfer function, a second individual transfer function from the first sound pressure to a second sound pressure at an eardrum within the ear canal. the method further comprises applying, based in part on the second individual transfer function, personalized equalization (peq) within the audio full range (low, mid and high frequencies) to an audio signal for reproduction via the hearable device.
Inventor(s): Yongsung CHO of Hwaseong-si KR for samsung electronics co., ltd., Min Hwi KIM of Suwon-si KR for samsung electronics co., ltd., Ji-Sang LEE of Iksan-si KR for samsung electronics co., ltd.
IPC Code(s): G11C7/20, G11C7/06, G11C7/10, G11C7/12
CPC Code(s): G11C7/20
Abstract: disclosed is a memory device which includes a memory cell array including memory cells, data latches connected with a sensing node and storing data in a first memory cell of the memory cells, a sensing latch connected with the sensing node, a temporary storage node, a switch connected between the sensing latch and the temporary storage node and configured to operate in response to a temporary storage node setup signal, a first precharge circuit configured to selectively precharge a first bit line corresponding to the first memory cell depending on a level of the temporary storage node, and a control logic circuit configured to control a dump operation between the data latches, the sensing latch, and the temporary storage node. the control logic circuit performs the dump operation from the data latches to the sensing latch while the first precharge circuit selectively precharges the first bit line.
Inventor(s): Dongho Shin of Suwon-si, Gyeonggi-do KR for samsung electronics co., ltd., Kangyoon Lee of Seoul KR for samsung electronics co., ltd., Seonkyoo Lee of Suwon-si KR for samsung electronics co., ltd., Junha Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G11C7/22
CPC Code(s): G11C7/22
Abstract: a method of calibrating impedance of a memory device including a data transmitter includes: outputting a comparison signal by comparing a power supply voltage and a reference voltage, the power supply voltage being supplied to the data transmitter when the data transmitter is driven; storing a voltage level of the reference voltage when the comparison signal changes logical state; adjusting the reference voltage based on the comparison signal such that the voltage level of the reference voltage increases or decreases; and calibrating an output impedance of the memory device based on a digital code corresponding to an average reference voltage level, the average reference voltage level being obtained by averaging a prescribed number of voltage levels of the reference voltage stored as a result of repeatedly outputting the comparison signal, storing the voltage level of the reference voltage, and adjusting the reference voltage.
Inventor(s): Byongmo MOON of Suwon-si KR for samsung electronics co., ltd., Jeonghyeok YOU of Seoul KR for samsung electronics co., ltd., Seong-Ook JUNG of Seoul KR for samsung electronics co., ltd., Ji Young KIM of Seoul KR for samsung electronics co., ltd., Hohyun CHAE of Seoul KR for samsung electronics co., ltd.
IPC Code(s): G11C7/22, G11C7/10, G11C29/50
CPC Code(s): G11C7/222
Abstract: a memory device includes core dies including memory cell arrays, and a buffer die electrically connected to the core dies through one or more through silicon vias. the buffer die includes a dqs generation circuit that receives an external clock signal from an external device and generates data strobe signals based on the external clock signal for communicating data with the core dies, a dqs calibration circuit that detects a latency of each of plural rank signal that are received from the core dies based on the data strobe signals, respectively, and a coefficient decision circuit that detects a threshold voltage code of the buffer die, applies a weight to the latency of each rank signal based on the threshold voltage code to generate a weighted calibration code for each rank signal, and transmits the weighted calibration codes to respective ones of the core dies.
Inventor(s): Seungyeon Kim of Suwon-si KR for samsung electronics co., ltd., Jooyong Park of Suwon-si KR for samsung electronics co., ltd., Hongsoo Jeon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G11C11/4099, G11C11/408, G11C11/4097
CPC Code(s): G11C11/4099
Abstract: a memory device includes a peripheral circuit structure and a cell array structure vertically overlapping the peripheral circuit structure. the cell array structure includes a plurality of memory blocks divided into a normal cell region and a dummy cell region, and the dummy cell region includes a bit line through-electrode region. the peripheral circuit structure includes a row decoder region in which a unit row decoder circuit connected to each of n (n is a positive integer) memory blocks is arranged, and the bit line through-electrode region is disposed to correspond to the block height of the unit row decoder circuit.
Inventor(s): JunHo KIM of Suwon-si KR for samsung electronics co., ltd., Sangjin Yoo of Suwon-si KR for samsung electronics co., ltd., Kwangwoo Lee of Suwon-si KR for samsung electronics co., ltd., Jeongwoo Lee of Suwon-si KR for samsung electronics co., ltd., Heewon Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G11C16/34, G11C16/26, G11C29/52
CPC Code(s): G11C16/349
Abstract: a data recover read (drr) operation method of a nonvolatile memory system includes: performing a first read operation on adjacent memory cells, which are connected to an adjacent wordline adjacent to a target wordline, based on a first specific read level; obtaining a cell count value for the adjacent wordline; determining offset values for a normal read level of target memory cells, which are connected to the target wordline, based on the cell count value for the adjacent wordline; and performing a second read operation on the target memory cells, based on the determined offset values and a result of the first read operation.
Inventor(s): Jaewon Park of Suwon-si KR for samsung electronics co., ltd., Jaehoon Lee of Suwon-si KR for samsung electronics co., ltd., Kyomin Sohn of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): G11C29/18
CPC Code(s): G11C29/18
Abstract: a memory device includes: a built-in self-test circuit configured to select a first target bank and a second target bank for each of a plurality of row addresses such that each of a plurality of memory banks is selected as the first target bank and the second target bank at least once, and to perform parallel tests on the first and second target banks for each of the plurality of row addresses; a comparator configured to compare first data output from the first target bank and second data output from the second target bank, and to output a fail signal according to a comparison result thereof; and a built-in analysis circuit configured to update a fail bank table indicating fail information of each of the plurality of memory banks, in response to the fail signal, and to determine a defective bank by referring to the fail bank table.
Inventor(s): CHANGBAE PARK of Suwon-si KR for samsung electronics co., ltd., KI-IL KIM of Suwon-si KR for samsung electronics co., ltd., Jae Sik AN of Suwon-si KR for samsung electronics co., ltd., SUNTAEK LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32, H01L21/3065
CPC Code(s): H01J37/32082
Abstract: disclosed are substrate processing apparatuses and substrate processing methods using the same. the substrate processing apparatus comprises a process chamber that provides a process space; a stage that supports a substrate, a gas spray device in the process space and upwardly spaced apart from the stage, a dielectric layer in the process space and upwardly spaced apart from the stage, a piezoelectric element that has a connection with and vibrates the dielectric layer, and a piezo power source that supplies the piezoelectric element with an alternating electric power.
Inventor(s): HYUN BAE KIM of Suwon-si KR for samsung electronics co., ltd., JUHO LEE of Suwon-si KR for samsung electronics co., ltd., HYEONGMO KANG of Suwon-si KR for samsung electronics co., ltd., KYUNG-SUN KIM of Suwon-si KR for samsung electronics co., ltd., NAM KYUN KIM of Suwon-si KR for samsung electronics co., ltd., DONGHYEON NA of Suwon-si KR for samsung electronics co., ltd., SANG KI NAM of Suwon-si KR for samsung electronics co., ltd., HYUNJAE LEE of Suwon-si KR for samsung electronics co., ltd., HYUNHAK JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32146
Abstract: a substrate processing method including: placing a substrate in a substrate processing apparatus; applying source power to the substrate processing apparatus; and applying bias power to the substrate processing apparatus, wherein applying the source power to the substrate processing apparatus includes: providing the substrate processing apparatus with a first radio-frequency (rf) power with a first pulse having a first period; and providing the substrate processing apparatus with a second rf power with a second pulse having a second period, wherein the first period is longer than the second period.
Inventor(s): Changbae PARK of Suwon-si KR for samsung electronics co., ltd., Ki-ll KIM of Suwon-si KR for samsung electronics co., ltd., Jongchul PARK of Suwon-si KR for samsung electronics co., ltd., Jae Sik AN of Suwon-si KR for samsung electronics co., ltd., Suntaek LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32669
Abstract: a substrate processing apparatus includes a process chamber providing a process space, a stage configured to support a substrate, a gas injection unit spaced upward from the stage in the process space, and a spin polarizer having a ring shape and spaced upward from the stage. the spin polarizer includes a polarizer body having a ring shape, and a thin layer on a surface of the polarizer body. the thin layer includes a ferromagnetic material.
Inventor(s): Hee Jeong PARK of Suwon-si KR for samsung electronics co., ltd., Jihyun KIM of Seoul KR for samsung electronics co., ltd., Yunho KIM of Suwon-si KR for samsung electronics co., ltd., Sungjune LEE of Suwon-si KR for samsung electronics co., ltd., Donggyu LEE of Seoul KE for samsung electronics co., ltd., Dongryul LEE of Seoul KR for samsung electronics co., ltd., Sam-Jong Chol of Suwon-si KR for samsung electronics co., ltd., Kuk Nam HAN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/67
CPC Code(s): H01L21/67017
Abstract: provided is a chemical liquid purification apparatus for semiconductor manufacturing, the apparatus including a first tank configured to store a chemical liquid, the chemical liquid including impurities, a first line configured to supply the chemical liquid to the first tank, a first electrode and a second electrode included in the first tank, an alternating current waveform generator connected to the first electrode and the second electrode, a second line configured to supply the chemical liquid processed in the first tank to an outside of the first tank, and a filter configured to filter the impurities in the chemical liquid flowing in the second line.
Inventor(s): Sung Hyun PARK of Suwon-si KR for samsung electronics co., ltd., Min Suk KANG of Suwon-si KR for samsung electronics co., ltd., Young-Hoo KIM of Suwon-si KR for samsung electronics co., ltd., Jin Seon YOU of Suwon-si KR for samsung electronics co., ltd., Tae-Hong KIM of Suwon-si KR for samsung electronics co., ltd., Woo Gwan SHIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L21/67
CPC Code(s): H01L21/67075
Abstract: a chemical liquid supply apparatus is provided and includes an additive supply, a chemical liquid supply, and a controller that controls the additive supply and the chemical liquid supply. the additive supply includes a first tank that receives an additive from an additive container, and a first circulating pipe connected to the first tank. the chemical liquid supply includes an auxiliary tank that receives an etching liquid from another container and receives the additive, and a second circulating pipe connected to the auxiliary tank. the controller provides control so as to: circulate the additive in the first tank; heat the etching liquid in the auxiliary tank using a heater such that a temperature of the etching liquid is increased to a first temperature; supply the additive to the auxiliary tank; and produce a chemical liquid by circulating the etching liquid and the additive at the first temperature.
Inventor(s): Chunyan RUAN of Suzhou CN for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/00, H01L23/498
CPC Code(s): H01L23/3675
Abstract: a chip package includes: a flexible substrate including a bottom surface, a side wall, and a top surface including a central region and an edge region; a first heat dissipation part including a body part and a wing part on the bottom surface and extending from opposite ends of the body part to the top surface along the side wall, the wing part covering the edge region; a semiconductor chip on the top surface; a second heat dissipation part covering an upper surface of the semiconductor chip, and a portion of the wing part that covers the edge region; and a heat dissipation glue on a lower surface of the second heat dissipation part, wherein the heat dissipation glue connects the semiconductor chip to the second heat dissipation part and connects the second heat dissipation part to the first heat dissipation part, to form a heat dissipation path.
20250105088. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hwanjoo Park of Suwon-si KR for samsung electronics co., ltd., Jaesun Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L23/00, H01L23/373, H01L23/48, H01L25/065, H05K1/18
CPC Code(s): H01L23/3677
Abstract: an example semiconductor package includes a first redistribution structure, a first chip on the first redistribution structure, a molding member on the first redistribution structure to surround the first chip, a conductive pillar penetrating the molding member in a vertical direction, a second redistribution structure on the first chip and the molding member, a second chip on the second redistribution structure, and a third chip on the second redistribution structure and separated from the second chip in a horizontal direction. the first redistribution structure includes a first redistribution insulating layer and a first redistribution pattern. the second redistribution structure includes a second redistribution insulating layer and a second redistribution pattern. the first chip includes a first semiconductor substrate and a through electrode penetrating the first semiconductor substrate in the vertical direction. the through electrode is in contact with the second redistribution pattern.
Inventor(s): Daehyuk SON of Suwon-si KR for samsung electronics co., ltd., Sungchan KANG of Suwon-si KR for samsung electronics co., ltd., Dongkyun KIM of Suwon-si KR for samsung electronics co., ltd., Hotaik LEE of Suwon-si KR for samsung electronics co., ltd., Seogwoo HONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/427
CPC Code(s): H01L23/427
Abstract: a semiconductor device may include: a semiconductor chip may include a heat radiation part; a pressure chamber formed on the heat radiation part, wherein the pressure chamber is configured to contain coolant such that an internal pressure in the pressure chamber increases as the coolant absorbs heat from the heat radiation part, and the coolant is ejected in a first direction away from the heat radiation part as the internal pressure of the pressure chamber increases; and a cooling channel providing a flow path configured such that the coolant ejected from the pressure chamber flows through the flow path and back into the pressure chamber.
Inventor(s): Yeongseon KIM of Suwon-si KR for samsung electronics co., ltd., JUHYEON KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/48, H01L23/00, H01L23/28, H01L23/498, H01L25/065
CPC Code(s): H01L23/481
Abstract: a semiconductor package includes a first chip, a second chip on an active surface of the first chip, a dummy chip on the active surface of the first chip, a mold layer on the active surface of the first chip and enclosing the second chip and the dummy chip, and a conductive post vertically penetrating the mold layer proximate to the second chip and the dummy chip to be coupled to the active surface of the first chip. an active surface of the second chip and an active surface of the dummy chip may be in direct contact with the active surface of the first chip. the dummy chip may include a first via. the second chip includes a second via chip. a width of the first via is larger than a width of the second via.
20250105100. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeonjeong HWANG of Cheonan-si KR for samsung electronics co., ltd., Minjung KIM of Cheonan-si KR for samsung electronics co., ltd., Dongkyu KIM of Anyang-si KR for samsung electronics co., ltd., Taewon YOO of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H01L23/49, H01L23/00, H01L23/31, H01L23/498, H01L25/18
CPC Code(s): H01L23/49
Abstract: disclosed is a semiconductor package comprising a first redistribution substrate; a solder ball on a bottom surface of the first redistribution substrate; a second redistribution substrate; a semiconductor chip between a top surface of the first redistribution substrate and a bottom surface of the second redistribution substrate; a conductive structure electrically connecting the first redistribution substrate and the second redistribution substrate, the conductive structure laterally spaced apart from the semiconductor chip and including a first conductive structure and a second conductive structure in direct contact with a top surface of the first conductive structure; and a conductive seed pattern between the first redistribution substrate and the first conductive structure. a material of first conductive structure and a material of the second conductive structure may be different from a material of the solder ball.
20250105116. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JU-IL CHOI of Seongnam-si KR for samsung electronics co., ltd., GYUHO KANG of Cheonan-si KR for samsung electronics co., ltd., SEONG-HOON BAE of Cheonan-si KR for samsung electronics co., ltd., JIN HO AN of Seoul KR for samsung electronics co., ltd., JEONGGI JIN of Seoul KR for samsung electronics co., ltd., ATSUSHI FUJISAKI of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/538, H01L25/065, H01L25/10
CPC Code(s): H01L23/49816
Abstract: a semiconductor package may include a redistribution substrate, a semiconductor chip mounted on a top surface of the redistribution substrate, and a conductive terminal provided on a bottom surface of the redistribution substrate. the redistribution substrate may include an under-bump pattern including a via portion in contact with the conductive terminal and a wire portion on the via portion and an insulating layer covering top and side surfaces of the under-bump pattern. a central portion of a bottom surface of the via portion may be provided at a level higher than an edge portion of the bottom surface of the via portion.
Inventor(s): Sangseok HONG of Suwon-si KR for samsung electronics co., ltd., Jaeseong KIM of Suwon-si KR for samsung electronics co., ltd., Jeongseok KIM of Suwon-si KR for samsung electronics co., ltd., Tae Wook KIM of Suwon-si KR for samsung electronics co., ltd., Yejin LEE of Suwon-si KR for samsung electronics co., ltd., Jooyoung CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49822
Abstract: a semiconductor package may include a semiconductor chip, a redistribution layer on the semiconductor chip, a protection pattern covering the redistribution layer, and a connection terminal on the redistribution layer. the redistribution layer may include a redistribution pad on a top surface of the redistribution layer, and the redistribution pad may include a first pad and a second pad on the first pad. the second pad may have a side surface that is inclined and that extends to a top surface of the first pad, and the protection pattern may be spaced apart from the side surface of the second pad and may have a side surface that is inclined and that extends to the top surface of the first pad.
20250105127. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dohyun KIM of Suwon-si KR for samsung electronics co., ltd., Yeongseon KIM of Suwon-si KR for samsung electronics co., ltd., JUHYEON KIM of Suwon-si KR for samsung electronics co., ltd., HYOEUN KIM of Suwon-si KR for samsung electronics co., ltd., SUNKYOUNG SEO of Suwon-si KR for samsung electronics co., ltd., Haksun LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/48, H01L23/528, H01L23/544, H01L25/10
CPC Code(s): H01L23/49838
Abstract: a semiconductor package may include a first dielectric structure, a first pad in the first dielectric structure, a first semiconductor chip provided on the first dielectric structure, and a bump electrically connected to the first pad. the first semiconductor chip includes: a first substrate; a first chip dielectric layer in contact with the first dielectric structure; and a first chip pad in contact with a top surface of the first pad. the first pad may be provided between the bump and the first chip of the first semiconductor chip. the first pad may include a first conductive layer and a second conductive layer covered by the first conductive layer. the bump may be positioned closer to the first conductive layer than to the second conductive layer.
20250105128. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byungjoon Yoo of Suwon-si KR for samsung electronics co., ltd., Jungmin Seo of Suwon-si KR for samsung electronics co., ltd., Kiwhan Song of Suwon-si KR for samsung electronics co., ltd., Hanbyeol Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065
CPC Code(s): H01L23/49838
Abstract: a semiconductor package includes a package substrate having a plurality of substrate pads, a chip stack including a plurality of semiconductor chips each chip having a plurality of chip pads arranged along one edge of an upper surface and pad extensions extending from the plurality of chip pads to an adjacent side surface to the one edge. the semiconductor chips are stacked such that the adjacent side surfaces have a coplanar surface. a multichannel film having an insulating film and a plurality of conductive lines disposed connects the chip pads of the plurality of semiconductor chips to the plurality of substrate pads.
Inventor(s): Jinyoung KIM of Suwon-si KR for samsung electronics co., ltd., Okseon YOON of Suwon-si KR for samsung electronics co., ltd., Jiyoung YOON of Suwon-si KR for samsung electronics co., ltd., Kiseok KIM of Suwon-si KR for samsung electronics co., ltd., Jihye SHIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/03
CPC Code(s): H01L23/49894
Abstract: a semiconductor package includes a redistribution structure including a redistribution layer including copper (cu) and an insulating layer surrounding the redistribution layer, a semiconductor chip mounted on the redistribution structure and including connection pads, internal connection terminals between the redistribution structure and the semiconductor chip electrically connecting the redistribution layer to the connection pads, external connection terminals attached under the redistribution structure and electrically connected to the redistribution layer, and an encapsulant configured to surround the semiconductor chip and the internal connection terminals on the redistribution structure. the insulating layer includes an insulating material of which k is 20 to 100 in a tc index according to equation below.
Inventor(s): Jinyoung KIM of Suwon-si KR for samsung electronics co., ltd., Okseon YOON of Suwon-si KR for samsung electronics co., ltd., Jiyoung YOON of Suwon-si KR for samsung electronics co., ltd., Kiseok KIM of Suwon-si KR for samsung electronics co., ltd., Jihye SHIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L25/03
CPC Code(s): H01L23/49894
Abstract:
20250105150. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeon Il Lee of Suwon-si KR for samsung electronics co., ltd., Seryeun Yang of Suwon-si KR for samsung electronics co., ltd., Dongkyun Lim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L25/065, H10B12/00, H10B80/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device may include a substrate that includes a first surface and a second surface opposite to each other, a first driving transistor and a second driving transistor on the first surface of the substrate, a first insulation layer on the first surface of the substrate, a second insulation layer on the second surface of the substrate, a first penetration electrode and a second penetration electrode that extend into the substrate, the first insulation layer, and the second insulation layer, a first contact plug extending in the first insulation layer and electrically connected to the first driving transistor and the first penetration electrode, and a second contact plug extending in the substrate and the second insulation layer and electrically connected to the second driving transistor and the second penetration electrode.
Inventor(s): Jin Myoung Lee of Suwon-si KR for samsung electronics co., ltd., Keun-Hee Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/5283
Abstract: a semiconductor device includes a backside power delivery network (bspdn). the semiconductor device includes a substrate, a first active pattern extending in a first direction, on a top surface of the substrate, a second active pattern extending in the first direction, and spaced apart from the first active pattern in a second direction intersecting the first direction, on the top surface of the substrate, a gate structure extending in the second direction, on the first active pattern and the second active pattern, a first source/drain pattern connected to the first active pattern, on a side surface of the gate structure, a second source/drain pattern connected to the second active pattern, on the side surface of the gate structure, back source/drain contacts penetrating the substrate, and a first power line connected to the back source/drain contacts on a bottom surface of the substrate.
Inventor(s): Hansae Lim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L21/56, H01L23/00, H01L23/31
CPC Code(s): H01L23/5283
Abstract: a semiconductor package includes a package substrate including wirings having a plurality of pad patterns that respectively extend such that at least a portion of each of the pad patterns is exposed in at least one pad open region, a semiconductor chip mounted on the chip mounting region of the package substrate by a plurality of conductive bumps, and a sealing member on the semiconductor chip on the package substrate. each of the plurality of pad patterns includes a main line extending in a first direction away from one side of the pad open region, and a branch line extending in a second direction different from the first direction from an end portion of the main line or from a position laterally spaced apart from the end portion of the main line.
Inventor(s): Jintae Kim of Clifton Park NY US for samsung electronics co., ltd., Panjae Park of Halfmoon NY US for samsung electronics co., ltd., Kang-Ill Seo of Springfield VA US for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/48, H01L27/092
CPC Code(s): H01L23/5286
Abstract: integrated circuit devices are provided. an integrated circuit device includes a substrate and a cell that has a plurality of transistors. the transistors include an upper transistor having an upper channel region. moreover, the transistors include a lower transistor between the substrate and the upper transistor. the lower transistor includes a lower channel region. the integrated circuit device includes a power line extending longitudinally in a first horizontal direction below the substrate and defining a cell boundary of the cell that extends longitudinally in the first horizontal direction. the integrated circuit device includes a cell boundary signal metal pattern on the cell and extending longitudinally in the first horizontal direction over the cell boundary and connected to at least two transistors of the plurality of transistors. related methods of forming integrated circuit devices are also provided.
Inventor(s): Giyoung JO of Suwon-si KR for samsung electronics co., ltd., Sangwon KIM of Suwon-si KR for samsung electronics co., ltd., Jaewon KIM of Suwon-si KR for samsung electronics co., ltd., Hyeon Jin SHIN of Suwon-si KR for samsung electronics co., ltd., Van Luan NGUYEN of Suwon-si KR for samsung electronics co., ltd., Chang Seok LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/532, H01L21/768
CPC Code(s): H01L23/53295
Abstract: disclosed is an interconnect structure including a substrate, a conductive layer on the substrate, and a passivation layer in contact with the conductive layer, where the passivation layer includes a first layer including boron nitride (h-bn) having a hexagonal crystal structure and a second layer including amorphous boron nitride (a-bn), and the first layer is in contact with the conductive layer the first layer.
Inventor(s): Geun Won Lim of Yongin-si KR for samsung electronics co., ltd., Beyoung Hyun Koh of Seoul KR for samsung electronics co., ltd., Yong Jin Kwon of Yongin-si KR for samsung electronics co., ltd., Joong Shik Shin of Yongin-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/535, H01L21/768, H10B41/27, H10B41/41, H10B43/27, H10B43/40
CPC Code(s): H01L23/535
Abstract: a semiconductor memory device may include a mold structure that includes mold insulation films and gate electrodes alternately stacked on a first substrate, a channel structure that penetrates the mold structure and intersects the gate electrodes, a block separation region that extends in a first direction parallel to an upper surface of the first substrate and cuts the mold structure, a first dam region and a second dam region spaced apart from each other, that each having a closed loop in a plan view and each cutting the mold structure, pad insulation films in the first and second dam regions that are alternately stacked with the mold insulation films and include a material different from the mold insulation films, and a through via which penetrates through the first substrate, the mold insulation films, and the pad insulation films, in the first dam region but not in the second dam region.
20250105158. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sung Min MOON of Suwon-si KR for samsung electronics co., ltd., Pyoung Wan KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/36, H01L23/498, H01L25/00, H10B80/00
CPC Code(s): H01L23/5385
Abstract: a semiconductor package includes: a substrate including a first surface extended in first and second directions that cross each other; a semiconductor chip disposed on the substrate; a first memory chip structure disposed on the substrate, and including a plurality of first memory chips that are stacked on each other in a third direction that is substantially perpendicular to the first and second directions; a first interposer disposed on the semiconductor chip and the first memory chip structure; a second memory chip structure disposed on the first interposer, and including a plurality of second memory chips that are stacked on each other in the third direction; and a heat dissipation structure disposed on the semiconductor chip, wherein a length of the heat dissipation structure is smaller than a length of the semiconductor chip based on the first direction.
20250105159. FAN-OUT LEVEL SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Pyunghwa Han of Suwon-si KR for samsung electronics co., ltd., Dahee Kim of Suwon-si KR for samsung electronics co., ltd., Bongsoo Kim of Suwon-si KR for samsung electronics co., ltd., Chobi Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L23/00, H01L23/16, H01L23/31, H01L23/498, H01L25/10
CPC Code(s): H01L23/5385
Abstract: a semiconductor package includes a first wiring structure, an extension structure disposed on the first wiring structure, including an extension base layer and a plurality of via structures, and having a mounting space passing through the extension base layer. the plurality of via structures include a plurality of via connection patterns, a semiconductor chip disposed in the mounting space and electrically connected to the first wiring structure, a filling insulating layer filling the mounting space, and a second wiring structure disposed on the extension structure and the filling insulating layer and electrically connected to the first wiring structure. lowermost via connection patterns, among the plurality of via connection patterns, include a plurality of first lower connection pads, and the extension base layer includes base dams respectively passing through the plurality of first lower connection pads.
Inventor(s): MinKi AHN of Suwon-si KR for samsung electronics co., ltd., Kwangho LEE of Suwon-si KR for samsung electronics co., ltd., Heeseok LEE of Suwon-si KR for samsung electronics co., ltd., Jaegwon JANG of Suwon-si KR for samsung electronics co., ltd., Heejung CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/05
Abstract: a semiconductor chip according to an embodiment includes a semiconductor substrate, an interconnection pad on a first surface of the semiconductor substrate, an insulation layer being on the first surface of the semiconductor substrate and defining an opening that exposes at least a partial portion of the interconnection pad, a capping pad being on the insulation layer and being connected to the interconnection pad through the opening, and an insulation structure at a periphery of the capping pad on the insulation layer.
Inventor(s): Jumyong PARK of Cheonan-si KR for samsung electronics co., ltd., Unbyoung KANG of Hwaseong-si KR for samsung electronics co., ltd., Byeongchan KIM of Asan-si KR for samsung electronics co., ltd., Solji SONG of Suwon-si KR for samsung electronics co., ltd., Chungsun LEE of Asan-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/48, H01L25/065
CPC Code(s): H01L24/05
Abstract: a semiconductor package includes a first semiconductor chip having a first substrate, a first insulating layer on the first substrate, and a plurality of first bonding pads on the first insulating layer, and having a flat upper surface by an upper surface of the first insulating layer and upper surfaces of the plurality of first bonding pads; and a second semiconductor chip on the upper surface of the first semiconductor chip and having a second substrate, a second insulating layer below the second substrate and in contact with the first insulating layer, and a plurality of second bonding pads on the second insulating layer and in contact with the first bonding pads, respectively, wherein the first insulating layer includes an insulating interfacial layer in contact with the second insulating layer, embedded in the first insulating layer, and spaced apart from the plurality of first bonding pads.
Inventor(s): Hyung Chul SHIN of Suwon-si KR for samsung electronics co., ltd., Won IL LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L25/18
CPC Code(s): H01L24/06
Abstract: according to example embodiments of the present inventive concept, a semiconductor chip includes: a semiconductor substrate including a first surface and a second surface that is opposite to the first surface; a through-via disposed in the semiconductor substrate; a first bonding pad disposed on the first surface of the semiconductor substrate and electrically connected to the through-via; a first dummy pad disposed on the first surface of the semiconductor substrate and insulated from the through-via; and a second bonding pad disposed on the second surface of the semiconductor substrate and electrically connected to the through-via, wherein a first maximum width of the first bonding pad is greater than a second maximum width in a first direction of the first dummy pad and is smaller than a third maximum width in a second direction of the first dummy pad, and wherein the first direction is substantially perpendicular to the second direction.
20250105187. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gayoung Kim of Hwaseong-si KR for samsung electronics co., ltd., Hyungsun Jang of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00
CPC Code(s): H01L24/08
Abstract: a semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (ubm) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the ubm, wherein the redistribution line pattern and the ubm provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.
Inventor(s): Doheon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L24/14
Abstract: a semiconductor package includes a first semiconductor chip on a package substrate, and a molding film on the package substrate and covering a side surface of the first semiconductor chip, wherein the first semiconductor chip includes a first semiconductor substrate, first signal pillars on a lower surface of a first signal region of the first semiconductor substrate and having a first signal pitch, first dummy pillars on a lower surface of a first dummy region of the first semiconductor substrate and having a first dummy pitch greater than the first signal pitch, second dummy pillars disposed on a lower surface of a second dummy region of the first semiconductor substrate and having a second dummy pitch greater than the first dummy pitch, and a dummy agglomerate solder connected to lower surfaces of adjacent first dummy pillars among the first dummy pillars.
Inventor(s): Tae Wook KIM of Suwon-si KR for samsung electronics co., ltd., Jaeseong KIM of Suwon-si KR for samsung electronics co., ltd., Jeongseok KIM of Suwon-si KR for samsung electronics co., ltd., Yejin LEE of Suwon-si KR for samsung electronics co., ltd., Jooyoung CHOI of Suwon-si KR for samsung electronics co., ltd., Sangseok HONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/762, H01L23/498, H01L23/522, H01L25/00, H01L25/18
CPC Code(s): H01L24/16
Abstract: a semiconductor package may include a redistribution layer structure including a redistribution layer, a semiconductor chip a first surface of the redistribution layer structure, an under-bump structure disposed on a second surface of the redistribution layer structure and including a protective layer having a trench and an under-bump metal layer, an electronic element on the under-bump structure, and an underfill member filling at least a portion of a space between the under-bump structure and the electronic element and filling at least a portion of the trench, wherein, in a plan view, the trench surrounds the electronic element and may include a protrusion portion protruding outward from the electronic element in a region surrounding an edge of the electronic element.
20250105193. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jungmin Ko of Suwon-si KR for samsung electronics co., ltd., Hyunhee Lee of Suwon-si KR for samsung electronics co., ltd., Hojun Lee of Suwon-si KR for samsung electronics co., ltd., Dongjoo Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/498, H01L25/065, H10B80/00
CPC Code(s): H01L24/16
Abstract: a semiconductor package includes a first semiconductor chip including a first through-via and a first upper pad, a second semiconductor chip provided on the first semiconductor chip and including a second lower pad, and a bonding bump provided between the first semiconductor chip and the second semiconductor chip and connected to the first upper pad and the second lower pad. the bonding bump includes: a conductive pattern directly contacting the second lower pad and including nickel and a bonding structure directly contacting the conductive pattern and the first upper pad, wherein the bonding structure includes an intermetallic compound including copper and a solder material. a thickness of the bonding structure is from about 47% to about 54% of a sum of a thickness of the conductive pattern, a thickness of the bonding structure, and a thickness of the first upper pad.
Inventor(s): Younghun KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L24/48
Abstract: a semiconductor package includes a package substrate including a package substrate comprising a base layer and a connection pad disposed on an upper surface of the base layer; a semiconductor chip disposed on the package substrate and the semiconductor chip comprises a semiconductor substrate and a bonding pad disposed on an upper surface of the semiconductor substrate; a bonding wire in contact with the connection pad and the bonding pad; a first dam structure disposed on the package substrate and arranged between the connection pad and the bonding pad; a non-conductive filler disposed on the package substrate surrounding the first dam structure and the bonding wire; and a mold layer disposed on the package substrate covering a portion of an upper surface of the package substrate and surrounding the semiconductor chip and the non-conductive filler.
Inventor(s): Kyung Deuk MIN of Suwon-si KR for samsung electronics co., ltd., Sin Yeop LEE of Suwon-si KR for samsung electronics co., ltd., Tae Gyu KANG of Suwon-si KR for samsung electronics co., ltd., Myeong Hyeon YU of Suwon-si KR for samsung electronics co., ltd., Jae-Seon HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L23/00, B23K1/005, B23K3/08, B23K101/42
CPC Code(s): H01L24/75
Abstract: a soldering apparatus includes a stage on which a plurality of electronic devices are loaded, a light source disposed on the stage and configured to cast light toward the plurality of electronic devices, and a mask film disposed between the light source and the plurality of electronic devices. the mask film has openings exposing at least a portion of each of the plurality of electronic devices and a guide is connected to the mask film and extends toward the plurality of electronic devices. the guide includes a reflective material.
Inventor(s): Keumhyo KANG of Suwon-si KR for samsung electronics co., ltd., Hongsoo KIM of Suwon-si KR for samsung electronics co., ltd., Jeon Il LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/48, H10B12/00
CPC Code(s): H01L25/0657
Abstract: disclosed are semiconductor packages and electronic systems. the semiconductor package comprises a first semiconductor chip that includes a first peripheral circuit structure and a first memory cell structure on the first peripheral circuit structure and a second semiconductor chip that includes a second peripheral circuit structure and a second memory cell structure on the second peripheral circuit structure. the first peripheral circuit structure includes a first substrate, a controller on the first substrate, and a first driver circuit on the first substrate. the second peripheral circuit structure includes a second substrate and a second driver circuit on the second substrate. the controller is electrically connected to the first driver circuit and the second driver circuit.
Inventor(s): Jing Cheng LIN of Suwon-si KR for samsung electronics co., ltd., Youngkun Jee of Suwon-si KR for samsung electronics co., ltd., Jihwan Suh of Suwon-si KR for samsung electronics co., ltd., Hyunchul Jung of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00
CPC Code(s): H01L25/0657
Abstract: provided is a semiconductor package and method of manufacturing same, the semiconductor package including: a first semiconductor chip; a chip stacked structure on the first semiconductor chip, the chip stacked structure including a plurality of second semiconductor chips; a third semiconductor chip on the chip stacked structure; an adhesive layer between the chip stacked structure and the third semiconductor chip; and a first pad pattern on a lower surface of the third semiconductor chip, wherein the adhesive layer surrounds the first pad pattern and the adhesive layer is between the first pad pattern and the chip stacked structure.
Inventor(s): Hyunsoo CHUNG of Hwaseong-si KR for samsung electronics co., ltd., Younglyong KIM of Anyang-si KR for samsung electronics co., ltd., Myungkee CHUNG of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/538, H01L25/10
CPC Code(s): H01L25/0657
Abstract: a semiconductor package including: a redistribution layer including redistribution line patterns, redistribution vias connected to the redistribution line patterns, and a redistribution insulating layer surrounding the redistribution line patterns and the redistribution vias; semiconductor chips including at least one upper semiconductor chip disposed on a lowermost semiconductor chip of the semiconductor chips, wherein the at least one upper semiconductor chip is thicker than the lowermost semiconductor chip; bonding wires each having a first end and a second end, wherein the bonding wires connect the semiconductor chips to the redistribution layer, wherein the first end of each of the bonding wires is connected to a respective chip pad of the semiconductor chips and the second end of each of the bonding wires is connected to a respective one of the redistribution line patterns; and a molding member surrounding, on the redistribution layer, the semiconductor chips and the bonding wires.
Inventor(s): Sangwook HAN of Suwon-si KR for samsung electronics co., ltd., Kyoungmin LEE of Suwon-si KR for samsung electronics co., ltd., Kyungsoo LEE of Suwon-si KR for samsung electronics co., ltd., Junho HUH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/10, H01L25/065, H03F3/24, H05K1/18
CPC Code(s): H01L25/105
Abstract: a radio frequency communication device may include a first package including a first semiconductor chip, the first semiconductor chip including a reception amplifier configured to receive a radio frequency (rf) signal, amplify the received rf signal, and output the amplified rf signal, a second package including a second semiconductor chip and a third semiconductor chip, the second semiconductor chip including a reception chain configured to receive the amplified rf signal from the first semiconductor chip via at least one first wire on a printed circuit board (pcb), and generate a baseband digital signal, and the third semiconductor chip being configured to receive the baseband digital signal from the second semiconductor chip via an internal transmission of the second package, and process the baseband digital signal, and the pcb on which the first package and the second package are mounted.
20250105231. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junghoon KANG of Suwon-si KR for samsung electronics co., ltd., Daegon KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/16, H01L23/00, H01L23/31, H01L23/48, H01L23/498
CPC Code(s): H01L25/167
Abstract: a semiconductor package including a package substrate defining a groove extending from an upper surface of the package substrate into the package substrate; a photonic integrated circuit (pic) chip inside the groove of the package substrate; an interposer above the pic chip and the package substrate, the interposer including a core substrate; an electronic integrated circuit (eic) chip inside the interposer; and a semiconductor chip above the interposer. the interposer defines a cavity extending from an upper surface of the core substrate to a lower surface of the core substrate, and the eic chip is inside the cavity of the core substrate.
Inventor(s): Youngbae Kim of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/16, G02B6/125, G02B6/42, H01L23/00, H01L23/498
CPC Code(s): H01L25/167
Abstract: a photonic ic chip includes an optical waveguide including an entrance waveguide extending in a first direction, a first branch waveguide and a second branch waveguide respectively branched from the entrance waveguide, a concave reflector between the first branch waveguide and the second branch waveguide and having a first reflective surface and a second reflective surface, a first exit waveguide extending from the first branch waveguide in the first direction, and a second exit waveguide extending from the second branch waveguide in the first direction, wherein the first reflective surface is adjacent the first branch waveguide and the second reflective surface is adjacent the second branch waveguide. the first reflective surface reflects a first optical signal into the second branch waveguide, and the second reflective surface reflects a second optical signal into the first branch waveguide.
20250105235. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JUNGHOON KANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00, H01L23/31, H01L23/48, H01L23/498, H01L25/00, H01L25/10
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes a first redistribution substrate, a first semiconductor chip having first pads on the first semiconductor chip, a second redistribution substrate on the first semiconductor chip, a first vertical connection structure through which the first and second redistribution substrates are electrically connected on one side of the first semiconductor chip, a second semiconductor chip on the second redistribution substrate, a first molding layer that covers the second semiconductor chip on the second redistribution substrate, a third redistribution substrate on the first molding layer; and a second vertical connection structure which is coupled to the second redistribution substrate and through which the second and third redistribution substrates are electrically connected on one side of the second semiconductor chip. a wiring pattern of the second redistribution substrate is coupled to the first pads of the first semiconductor chip.
20250105236. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hong Jin KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L25/18, H01L23/00
CPC Code(s): H01L25/18
Abstract: a semiconductor package includes a substrate extending in first and second directions crossing each other. a first spacer is on the substrate. a first semiconductor chip stack is on the first spacer and includes semiconductor chips stacked in a third direction. a second spacer is disposed on the substrate and is spaced apart from the first spacer in the first direction. a second semiconductor chip stack is on the second spacer and includes semiconductor chips stacked in the third direction. a mold layer integrally covers the first and second semiconductor chip stacks and directly contacts side surfaces of the first and second spacers. the first and second semiconductor chip stacks are spaced apart from each other in the first direction. a width of the first spacer in the first direction is greater than a width of the second spacer in the first direction.
Inventor(s): Hyunyoung ROH of Suwon-si KR for samsung electronics co., ltd., Jeong PARK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q9/04, H01Q9/16
CPC Code(s): H01Q1/243
Abstract: the disclosure relates to an electronic device. an electronic device according to an embodiment of the disclosure may include: a housing including a side wall, wherein the side wall includes a recess recessed from an outer surface of the side wall; a non-conductive cap disposed in the recess and including a protruding portion passing through the recess; an antenna module disposed opposite to the cap with respect to the recess and including at least one antenna element disposed to face the recess; and a bracket disposed inside the housing such that the antenna module is mounted thereon and including a coupling hole through which the protruding portion is inserted.
Inventor(s): Seongjin PARK of Suwon-si KR for samsung electronics co., ltd., Bumjin CHO of Suwon-si KR for samsung electronics co., ltd., Yoonjung KIM of Suwon-si KR for samsung electronics co., ltd., Hosaeng KIM of Suwon-si KR for samsung electronics co., ltd., Jaehoon JO of Suwon-si KR for samsung electronics co., ltd., Jinwoo JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q9/04, H01Q25/00
CPC Code(s): H01Q1/243
Abstract: an electronic device is provided. the electronic device includes a first frame, a first opening formed in one area of the first frame, a first antenna that includes a first printed circuit board including first conductive patches, a first dielectric material that is disposed in the first opening and has a first dielectric constant, a second dielectric material disposed between the first dielectric material and the first conductive patches, and a wireless communication circuit that is electrically connected to the first antenna, wherein the second dielectric material may have a second dielectric constant that is lower than the first dielectric constant of the first dielectric material, and the wireless communication circuit may be configured to feed power to the first conductive patches to transmit and/or receive a signal in a frequency band of 10 gigahertz (ghz) or higher.
Inventor(s): Namjun CHO of Suwon-si KR for samsung electronics co., ltd., Junghwan SON of Suwon-si KR for samsung electronics co., ltd., Hyoseok NA of Suwon-si KR for samsung electronics co., ltd., Youngju KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/38, H01Q13/02, H01Q21/06
CPC Code(s): H01Q1/243
Abstract: various embodiments of the disclosure relate to an electronic device including an antenna. the electronic device may include: a housing; a main board disposed in an internal space of the housing and including a first surface oriented in a first direction, a second surface facing a direction opposite the first direction, and a through hole; and an antenna module disposed on the main board. the antenna module may include: a board at least partially disposed in the through hole and including a plurality of antenna elements; and a wireless communication circuit configured to transmit and/or receive a wireless signal in a predetermined frequency band via the plurality of antenna elements, the wireless communication circuit disposed on the second surface of the main board.
Inventor(s): Sanghoon CHOI of Suwon-si KR for samsung electronics co., ltd., Youngjung Kim of Suwon-si KR for samsung electronics co., ltd., Jonghoon Kim of Suwon-si KR for samsung electronics co., ltd., Dongjun Oh of Suwon-si KR for samsung electronics co., ltd., Himchan Yun of Suwon-si KR for samsung electronics co., ltd., Youngsung Lee of Suwon-si KR for samsung electronics co., ltd., Aro Cheon of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01Q5/50, H01Q1/50
CPC Code(s): H01Q5/50
Abstract: an electronic device includes: a conductive portion; a printed circuit board having a first ground path, a second ground path, and a feed path; and a wireless communication circuit on the printed circuit board. the conductive portion includes a feed point, a first ground point, and a second ground point. the first ground point is connected to a ground of the electronic device through the first ground path. the second ground point is connected to the ground through the second ground path. the feed point is electrically connected to the wireless communication circuit through the feed path. the printed circuit board includes a conductive pattern connected between the feed path and the first ground path. the wireless communication circuit is configured to supply a signal, through the feed path, to the conductive portion and the conductive pattern. the signal is radiated through the conductive portion and the conductive pattern.
Inventor(s): Jaedeok CHA of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02J7/00, H02M1/00, H02M3/158
CPC Code(s): H02J7/00712
Abstract: this electronic device may comprise: a charging circuit configured to supply power to a battery, wherein: the charging circuit comprises: a first buck circuit including a first switching element and a second switching element, a second buck circuit including a third switching element and a fourth switching element, and a boost circuit including a fifth switching element and a sixth switching element, each of the switching elements including a switch; an input voltage is applied to an input node of the first switching element and an input node of the third switching element; one end of a first inductor is connected to a first connection node between the first switching element and the second switching element of the first buck circuit; one end of a second inductor is connected to a second connection node between the third switching element and the fourth switching element of the second buck circuit; an other end of the first inductor and an other end of the second inductor are connected to a third connection node between the fifth switching element and the sixth switching element of the boost circuit; and the fifth switching element is connected in parallel to the battery and a capacitor.
Inventor(s): Hyunggwang KANG of Suwon-si KR for samsung electronics co., ltd., Dongyeop LEE of Suwon-si KR for samsung electronics co., ltd., Hyunsik YUN of Suwon-si KR for samsung electronics co., ltd., Hoyoung JEONG of Suwon-si KR for samsung electronics co., ltd., Yongsuk KWAK of Suwon-si KR for samsung electronics co., ltd., Minseok PARK of Suwon-si KR for samsung electronics co., ltd., Eungkyu PARK of Suwon-si KR for samsung electronics co., ltd., Jin YOU of Suwon-si KR for samsung electronics co., ltd., Soyoung LEE of Suwon-si KR for samsung electronics co., ltd., Changhoon IM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H02K7/116, H05K5/00, H05K5/02
CPC Code(s): H02K7/116
Abstract: an electronic device according to an embodiment includes: a first housing including a frame cover; a second housing coupled to the first housing and configured to be slidable relative to the first housing; a flexible display disposed on one surface of the second housing, and configured to slide into or out of the first housing by movement of the second housing; a motor disposed on the frame cover; a pinion gear coupled to the motor and configured to be rotatable by the motor; a rack gear disposed on an inner surface of the second housing, opposite to the one surface of the second housing, and is engaged with the pinion gear to be movable according to rotation of the pinion gear; and a battery disposed on a seating surface of the frame cover spaced apart from the motor, and configured to supply power to the motor, wherein the frame cover includes a plurality of first through holes penetrating the seating surface that is in contact with the battery.
Inventor(s): Kibaek Kwon of Suwon-si KR for samsung electronics co., ltd., Byoungjoo Yoo of Suwon-si KR for samsung electronics co., ltd., Youngho Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H03F3/45, H03F1/02
CPC Code(s): H03F3/45677
Abstract: provided are a differential amplifier forming a first feedback loop and a second feedback loop by including feedback loop circuits, an electronic device, and an operating method thereof. the differential amplifier configured to generate at least one pair of differential output signals by amplifying at least one pair of differential input signals and to generate an output common-mode signal based on the at least one pair of differential output signals. the main amplifier includes a first current mirror that generates first currents. a first feedback loop circuit is connected to an output node of the main amplifier which outputs the output common-mode signal, and forms a first feedback loop that feeds back the output common-mode signal. a second feedback loop circuit generates a control signal that controls the first currents based on the output common-mode signal, and forms a second feedback loop.
Inventor(s): Wooseok CHOI of Seoul-si KR for samsung electronics co., ltd., Jihee KIM of Seoul-si KR for samsung electronics co., ltd.
IPC Code(s): H03L7/08, H03L7/091, H03L7/099
CPC Code(s): H03L7/0807
Abstract: a clock data recovery circuit including: a sampler to sample a comparison result between an input data signal and multiple reference voltages or to sample the input data signal based on a recovered clock signal; and a control circuit to output a control signal for controlling a phase of the recovered clock signal based on a k signal, an up signal, and a down signal.
Inventor(s): Youngmin LEE of Suwon-si KR for samsung electronics co., ltd., Hyoseok NA of Suwon-si KR for samsung electronics co., ltd., Gunun YOOK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H03L7/18, H03L7/093, H04B1/40
CPC Code(s): H03L7/18
Abstract: a wireless communication device and method for controlling activation of a radio frequency (rf) transmission signal generation circuit are disclosed. the wireless communication device includes a communication processor and a transceiver controlled by the communication processor to perform wireless communication, wherein the transceiver includes a phase locked loop (pll) configured to generate a first oscillator signal based on a clock frequency signal, an rf transmission signal generation circuit configured to generate an rf transmission signal based on the first oscillator signal received from the pll circuit and a baseband transmission signal received from the communication processor, and a first decision circuit configured to receive a first phase comparison signal indicating whether a phase of the first oscillator signal is locked from a first phase comparator in the pll circuit and control activation of at least one component included in the rf transmission signal generation circuit based on the first phase comparison signal.
Inventor(s): YOUNGSUB KIM of Suwon-si KR for samsung electronics co., ltd., HONGMIN CHOI of Suwon-si KR for samsung electronics co., ltd., HYUNG SUN LIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04B1/04
CPC Code(s): H04B1/0475
Abstract: disclosed is a transmitting device, comprising, a multi-mode digital predistorter circuit configured to pre-compensate an input baseband signal in one of a plurality of digital predistortion modes according to a selection signal, a power amplifier configured to amplify the pre-compensated baseband signal and output the amplified baseband signal as an output signal of an allocated band, and a digital predistortion mode selector circuit configured to determine the one of the plurality of digital predistortion modes corresponding to the allocated band using a feedback signal obtained from the output signal, and set the multi-mode digital predistorter circuit to the one of the determined modes.
Inventor(s): Youngrok JANG of Suwon-si KR for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si KR for samsung electronics co., ltd., Seongmok LIM of Suwon-si KR for samsung electronics co., ltd., Hyoungju JI of Suwon-si KR for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04B1/713, H04W72/0453, H04W72/21
CPC Code(s): H04B1/713
Abstract: a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, downlink control information (dci) scheduling a physical uplink shared channel (pusch) transmission, the dci including information on a frequency resource for the pusch transmission and information indicating whether frequency hopping to be applied to the pusch transmission, and transmitting, to the base station, a pusch, based on precoding applied according to a predetermined resource unit based on the frequency resource for the pusch transmission, wherein, in case that the information indicating whether the frequency hopping to be applied for the pusch transmission indicates a value indicating that the frequency hopping is applied and the precoding is a wideband based precoding for the frequency resource for the pusch transmission, a first precoding is applied according to the predetermined resource unit configured to a size equal to the frequency resource for the pusch transmission, and for a frequency resource which is frequency hopped from the frequency resource for the pusch transmission, a second precoding different from the first precoding is applied according to the predetermined resource unit configured to a size equal to the frequency resource which is frequency hopped.
20250105886. UPLINK TRANSMISSIONS AND RECEPTIONS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Md. Saifur Rahman of Plano TX US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd.
IPC Code(s): H04B7/0456
CPC Code(s): H04B7/0456
Abstract: apparatuses and methods for uplink (ul) transmissions and receptions. a method performed by a user equipment (ue). the method includes transmitting capability information about an ul codebook for 3 antenna ports; receiving a configuration indicating a sounding resource signal (srs) resource set comprising at least one srs resource with 4 srs ports, wherein one of the 4 srs ports is muted; and transmitting a srs from 3 of the 4 srs ports. the method further includes receiving an indication indicating a transmit precoding matrix indicator (tpmi) for transmission of a physical uplink shared channel (pusch) and transmitting the pusch based on the indicated tpmi. the tpmi indicates a precoding matrix from the ul codebook for the 3 antenna ports.
Inventor(s): Changsung LEE of Gyeonggi-do KR for samsung electronics co., ltd., Byonghyo SHIM of Seoul KR for samsung electronics co., ltd., Hyunsoo KIM of Seoul KR for samsung electronics co., ltd., Yongsuk BYUN of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W64/00
CPC Code(s): H04B7/0617
Abstract: the present disclosure relates to a 5g communication system or a 6g communication system for supporting higher data rates beyond a 4g communication system such as long term evolution (lte). a method and apparatus in the wireless communication system includes detecting at least one first object including at least one user equipment (ue), transmitting, to a second base station (bs), a first message including sensing information of the at least one first object, receiving, as response to the first message, from the second bs, a second message including sensing information of at least one second object, identifying the at least one ue based on the at least one first object and the at least one second object, estimating a location of the identified at least one ue, determining a beamforming vector based on the estimated location, and transmitting data, to the at least one ue, based on the determined beamforming vector.
Inventor(s): Daoud Burghal of San Jose CA US for samsung electronics co., ltd., Andreas Molisch of Los Angeles CA US for samsung electronics co., ltd., Yang Li of Plano TX US for samsung electronics co., ltd., Yan Xin of Princeton NJ US for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W24/10, H04W64/00
CPC Code(s): H04B7/0626
Abstract: a base station includes a transceiver, and a processor operatively coupled to the transceiver. the processor is configured to estimate a mobility level of a user equipment (ue), and determine whether the estimated mobility level of the ue exceeds a speed threshold. the processor is also configured to generate, from a channel response prediction model, a future channel response prediction based on the estimated mobility level of the ue and whether the estimated mobility of the ue exceeds the speed threshold.
Inventor(s): Sangyeob JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/231, H04W72/563, H04W88/06
CPC Code(s): H04L5/0035
Abstract: the disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system for supporting a higher data transmission rate. a user equipment (ue) and a method performed by a terminal (multi-universal subscriber identity module (usim) ue (musim ue)) supporting a first universal subscriber identity module (usim) and a second usim in a wireless communication system is provided. the method includes receiving, from a base station, a radio resource control (rrc) message for configuring the ue to provide a preference for a multi-universal subscriber identity module (musim) gap and a musim gap priority, identifying whether to initiate a transmission of a ue assistance information message for providing first preference information on the musim gap priority or second preference information indicating to keep all colliding musim gaps based on a timer th, and, in case that the timer th is not running, initiating the transmission of the ue assistance information message for providing the first preference information or the second preference information.
Inventor(s): Young Gul WON of Suwon-si KR for samsung electronics co., ltd., Yunseo NAM of Seoul KR for samsung electronics co., ltd., Jihoon MOON of Seoul KR for samsung electronics co., ltd., Byonghyo SHIM of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04L41/16
CPC Code(s): H04L5/0051
Abstract: there is provided mobile terminal including a receiver configured to receive a pilot signal from a base station at a first time interval, a processor configured to predict a channel based on the received pilot signal by using a neural network at a second time interval shorter than the first time interval, and to determine channel state information based on the predicted channel, and a transmitter configured to provide the determined channel state information to the base station.
Inventor(s): Pengru LI of Beijing CN for samsung electronics co., ltd., Qi XIONG of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W24/08, H04W64/00
CPC Code(s): H04L5/0051
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. the application provides a method performed by a user equipment (ue) for positioning reference signal (prs) measurement in a wireless communication system, the method comprising: identifying a first resource for the prs measurement in a prs processing window (ppw) without measurement gaps, and performing the prs measurement for the first resource, wherein the first resource is unmuted and at least partially overlapped with the ppw.
Inventor(s): Youngbum KIM of Gyeonggi-do KR for samsung electronics co., ltd., Cheolkyu SHIN of Gyeonggi-do KR for samsung electronics co., ltd., Heedon GHA of Gyeonggi-do KR for samsung electronics co., ltd., Taehan BAE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/25
CPC Code(s): H04L5/0051
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a user equipment (ue) includes transceiver, and a controller coupled to the transceiver, and configured to receive, from a base station, first information configuring sidelink positioning reference signal (sl prs) resources in a shared resource pool, receive, from the base station, second information configuring phase tracking reference signal (ptrs) resources, and transmit, to the base station, a ptrs on a ptrs resource which is not overlapped with an sl prs resource, wherein the shared resource pool is for the sl prs resources and physical sidelink shared channel (pssch) resources.
20250105984. CRI-BASED CSI REPORTING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gilwon Lee of McKinney TX US for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W24/10
CPC Code(s): H04L5/0057
Abstract: apparatuses and methods for enhancement of channel state information (csi) reporting for hybrid beamforming. a method performed by a user equipment (ue) includes receiving information about a csi report, kcsi reference signal (csi-rs) resources, and a value of m, where k>1, 1<m≤min (x, k), and x is an integer. the method further includes, based on the information, measuring the kcsi-rs resources and determining the csi report associated with m csi-rs resources out of the kcsi-rs resources. the csi report includes m csi-rs resource indicators (cris), m precoding matrix indicators (pmis), and m channel quality indicators (cqis). the method further includes transmitting the csi report.
Inventor(s): Jinwook Burm of Suwon-si KR for samsung electronics co., ltd., Jongmin Park of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L7/00, H03K3/037
CPC Code(s): H04L7/0016
Abstract: an integrated circuit includes a phase shifted data generation circuit, a synchronization circuit, and a control signal generation circuit configured to generate a reference clock control signal that controls at least one of a phase and a frequency of the reference clock signal by performing a logical operation on a plurality of received synchronization data.
Inventor(s): Miran KIM of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H04L9/06, H04L9/00
CPC Code(s): H04L9/0631
Abstract: a processor-implemented method includes receiving, from a first device, ciphertext corresponding to elements of a first data set of the first device, performing, based on a match function defined for elements of a second data set of a second device, an intersection operation between the ciphertext and the elements of the second data set, and transmitting a result of the intersection operation to the first device, wherein the ciphertext is generated based on an elementary symmetric polynomial corresponding to the elements of the first data set.
Inventor(s): Yangsoo Kwon of Seoul KR for samsung electronics co., ltd., Joonsung Kim of Hwaseong-si KR for samsung electronics co., ltd., Jinwoo Oh of Seogwipo-si KR for samsung electronics co., ltd., Yongin Choi of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H04L27/26, H04W4/40, H04W72/20, H04W92/10
CPC Code(s): H04L27/2613
Abstract: an apparatus and a method for effectively mapping a reference signal for vehicle-to-everything (v2x) communication in a wireless communication system are provided. a transmission terminal performing the v2x communication includes a processor generating sidelink control information (sci) and a transceiver transmitting the generated sci to a reception terminal through a physical sidelink control channel (pscch) and a physical sidelink shared channel (pssch). a decision on whether to allocate a demodulation reference signal (dmrs) of the pssch and the pscch to the same orthogonal frequency division multiplexing (ofdm) symbol is made based on a number of subchannels and at least one sized thereof.
Inventor(s): Jaehyeon BAE of Gyeonggi-do KR for samsung electronics co., ltd., Youngkyo BAEK of Gyeonggi-do KR for samsung electronics co., ltd., Jicheol LEE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04L47/2416, H04L47/12
CPC Code(s): H04L47/2416
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data rates. according to the disclosure, a method performed by a policy control function (pcf) that supports radio access network (ran) scheduling based on a protocol data unit (pdu) set includes receiving, from an application function (af) entity, an af session with a required quality of service (qos), the af session with the required qos including qos requirements for media flows and an additional packet filter, determining, based on the additional packet filter, at least one primary component carrier (pcc) rule for the media flows, and transmitting, to a session management function (smf) entity, the at least one pcc rule.
Inventor(s): Weiping SUN of Suwon-si KR for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si KR for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L47/32
CPC Code(s): H04L47/32
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station (bs), a radio resource control (rrc) message configuring a remaining time threshold for a delay status report (dsr), identifying a packet data convergence protocol (pdcp) service data unit (sdu) associated with the dsr based on the remaining time threshold, determining a pdcp data volume to be indicated to at least one medium access control (mac) entity based on the pdcp sdu associated with the dsr, and transmitting, to the bs, a dsr mac control element (ce) based on the pdcp data volume.
Inventor(s): Michal WODCZAK of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L65/1073
CPC Code(s): H04L65/1073
Abstract: a method for providing a service, includes: receiving a service request from an external entity in a service based architecture (sba); requesting, by an elevated plane function (epf) of the sba, an in-band registration or out-of-band registration for the external entity to a modified network resource function (mnrf) directly or indirectly; and based on the in-band registration or the out-of-band registration, providing at least a part of service function of the sba to the external entity.
Inventor(s): Juyeon JIN of Suwon-si KR for samsung electronics co., ltd., Hyeeoncho Gi of Suwon-si KR for samsung electronics co., ltd., Doosuk Kang of Suwon-si KR for samsung electronics co., ltd., Gupil Cheong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L65/75, H04L1/00, H04L27/18, H04W4/80
CPC Code(s): H04L65/75
Abstract: a method by an electronic device, includes: establishing a communication connection configured to use a first codec and a first modulation scheme for an audio service with an external electronic device; determining to use a second codec for reproducing a media file; transmitting, to the external electronic device, a first configuration message indicating the use of the second codec; after transmitting the first configuration message, receiving, from the external electronic device, a first change request message for a change from the first modulation scheme to a second modulation scheme; and transmitting, to the external electronic device, at least one audio packet generated using the second codec by using the second modulation scheme.
Inventor(s): Hyesung KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04L67/51, H04L41/083, H04L67/60, H04W4/50
CPC Code(s): H04L67/51
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment, a method by an edge enabler server (ees) in a mobile edge computing system comprises transmitting, to an edge configuration server (ecs), a request message for storing common edge application server (eas) bundle information. in an embodiment, the request message includes the common eas bundle information and the common eas bundle information includes at least one of eas bundle identifier (id) of an eas bundle, a list of eas id in the eas bundle and main eas id in the eas bundle.
Inventor(s): Sukhdeep SINGH of Bangalore IN for samsung electronics co., ltd., Madhan Raj KANAGARATHINAM of Bangalore IN for samsung electronics co., ltd., Avinash BHAT of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04L69/164, H04L41/16, H04L65/80
CPC Code(s): H04L69/164
Abstract: embodiments of the disclosure disclose a method and a network node for selecting quic streams in wireless communication. as such, current values associated with network parameters related to a data session in real-time are received by network node in a wireless communication system. the network parameters include at least one of: connection metrics, network condition and a type of service. as such, new values of the network parameters for the data session are predicted by the network node using an artificial intelligence (ai) model based on the current values. a plurality of quic streams related to the data session are determined based on new network parameters. each quic stream of the plurality of quic streams is selected from at least: reliable quic stream, semi-reliable quic stream, and unreliable quic stream. the plurality of quic streams are streamed in the wireless communication system.
Inventor(s): Kiyoung JUNG of Suwon-si KR for samsung electronics co., ltd., Sangkyu KIM of Suwon-si KR for samsung electronics co., ltd., Jungchul AN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0262
Abstract: an electronic device includes: first and housings; a display disposed on the first housing and the second housing; a hinge structure connecting the first housing and the second housing, and including first, second, and third hinges; a battery in the first housing; a substrate portion including a first circuit board in the first housing and a second circuit board in the second housing, the first circuit board including a main region at least partially positioned above the battery, and an extension region extending from the main region; a connecting structure connecting the first and second circuit boards, the connecting structure including a first connecting member at least partially positioned between the first and third hinges, and a second connecting member at least partially positioned between the second and third hinges; and at least one electronic component positioned between the third hinge and the battery and disposed in the extension region.
Inventor(s): Kwangtaek WOO of Suwon-si KR for samsung electronics co., ltd., Deukkyu OH of Suwon-si KR for samsung electronics co., ltd., Changho LEE of Suwon-si KR for samsung electronics co., ltd., Byoungkug KIM of Suwon-si KR for samsung electronics co., ltd., Jongwoon JANG of Suwon-si KR for samsung electronics co., ltd., Sungjun KIM of Suwon-si KR for samsung electronics co., ltd., Jinwan AN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04M1/72403, H04M1/02, H04N23/63, H05K1/02
CPC Code(s): H04M1/72403
Abstract: an example embodiment foldable electronic device includes a plurality of cameras, providing a preview image of a camera in response to folding or unfolding of the device and an operating method thereof. the example foldable electronic device may include a plurality of cameras, at least one display, at least one processor operatively connected with the plurality of the cameras and the at least one display, and at least one memory operatively connected with the at least one processor, and the at least one memory may store instructions which, when executed, cause the at least one processor to: while a first preview image corresponding to a first camera among the plurality of the cameras is displayed on the at least one display, select at least one other camera, based on an analysis result of at least one object included in the first preview image, in response to detecting folding or unfolding of the electronic device, display a second preview image corresponding to the selected at least one other camera, and obtain a captured image based on the displayed second preview image.
Inventor(s): Sun Young LEE of Seongnam-si KR for samsung electronics co., ltd.
IPC Code(s): H04N19/169, H04N19/82
CPC Code(s): H04N19/188
Abstract: the present invention discloses a video decoding method performed by a video decoding device. the video decoding method according to an embodiment may include the steps of: obtaining nal unit type information indicating a type of a current network abstraction layer (nal) unit from a bitstream; and decoding, when the nal unit type information indicates that the nal unit type of the current nal unit is an encoded data for an slice, the slice based on whether a mixed nal unit type is applied to a current picture.
Inventor(s): Molin Zhang of Santa Clara CA US for samsung electronics co., ltd., Soumendu Majee of Plano TX US for samsung electronics co., ltd., Chengyu Wang of Plano TX US for samsung electronics co., ltd., John Seokjun Lee of Plano TX US for samsung electronics co., ltd., Hamid Rahim Sheikh of Plano TX US for samsung electronics co., ltd.
IPC Code(s): H04N19/42, H04N9/64, H04N19/172, H04N19/184
CPC Code(s): H04N19/42
Abstract: a method includes obtaining a raw image and mapping, using a raw image encoder, the raw image to a compressed domain. the raw image is represented using latent variables in the compressed domain. the method also includes performing one or more image signal processing operations on the latent variables, where (i) each of the one or more image signal processing operations is configured to operate in the compressed domain and (ii) the one or more image signal processing operations generate processed latent variables. the method further includes mapping, using an output image decoder, the processed latent variables to an output image in an output color space.
Inventor(s): Jaehong JUNG of Seoul KR for samsung electronics co., ltd., Juhyung SON of Uiwang-Si KR for samsung electronics co., ltd., Dongcheol KIM of Suwon-Si KR for samsung electronics co., ltd., Geonjung KO of Seoul KR for samsung electronics co., ltd., Jinsam KWAK of Anyang-Si KR for samsung electronics co., ltd.
IPC Code(s): H04N19/625, H04N19/12, H04N19/176, H04N19/61
CPC Code(s): H04N19/625
Abstract: disclosed is a video signal processing method comprising the steps of: obtaining at least one transform block for a residual signal of a current block from a video signal bitstream; determining, on the basis of length information of a first side of the transform block, a horizontal transform kernel for horizontal transformation of the transform block, regardless of the length of a second side of the transform block, which is orthogonal to the first side; determining, on the basis of length information of the second side, a vertical transform kernel for vertical transformation of the transform block, regardless of the length of the first side; obtaining the residual signal of the current block by performing, on the transform block, inverse transformation using the horizontal transform kernel and the vertical transform kernel; and reconstructing the current block on the basis of the obtained residual signal.
Inventor(s): Jingyu FANG of Suzhou CN for samsung electronics co., ltd., Liwei YANG of Suzhou CN for samsung electronics co., ltd.
IPC Code(s): H04N23/88
CPC Code(s): H04N23/88
Abstract: a method for image processing including: obtaining a sensor image; performing a lens shading correction on the sensor image to obtain a first image; performing a weighted masking on the first image to obtain a second image; and performing an automatic white balance processing on the second image to obtain a third image.
Inventor(s): Sangeun Mun of Suwon-si KR for samsung electronics co., ltd., Hyunsung Park of Suwon-si KR for samsung electronics co., ltd., Sookyoung Roh of Suwon-si KR for samsung electronics co., ltd., Sungmo Ahn of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04N25/77, H04N25/11
CPC Code(s): H04N25/77
Abstract: provided is an image sensor including a sensor substrate including a first pixel group and a second pixel group, a nano-photonic lens array including a first region facing the first pixel group and a second region facing the second pixel group, and a color filter layer including a first color filter facing the first pixel group and the first region and transmitting light of a first wavelength band and a second color filter facing the second pixel group and the second region and transmitting light of a second wavelength band. the first region may include a plurality of nano-structures two-dimensionally arranged with a first arrangement period so as to condense incident light, the second region may include a plurality of nano-structures two-dimensionally arranged with a second arrangement period so as to condense incident light, and the second arrangement period may be less than the first arrangement period.
Inventor(s): Ko CHOI of Suwon-si KR for samsung electronics co., ltd., Yeonghun GU of Suwon-si KR for samsung electronics co., ltd., Youngho PARK of Suwon-si KR for samsung electronics co., ltd., Seokwoo LEE of Suwon-si KR for samsung electronics co., ltd., Kio JUNG of Suwon-si KR for samsung electronics co., ltd., Jiwoo LEE of Suwon-si KR for samsung electronics co., ltd., Jeongseob KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04R1/02, H04R1/32
CPC Code(s): H04R1/028
Abstract: an electronic device including a noise reduction member is disclosed with a speaker and an antenna. the speaker includes a speaker core for generating sound in a first direction; a speaker housing at least partially enclosing the exterior of the speaker core and including a speaker hole positioned to overlap with the speaker core with respect to the first direction; and a noise reduction member including a conductive material and positioned on the outer surface of the speaker housing. the noise reduction member includes a shielding member having an opening on a surface facing perpendicularly to the first direction, the region at least partially overlapping the speaker core. the shielding member includes the conductive material surrounding the outer perimeter of the speaker hole on the outer surface of the speaker housing; and a conductive extension part formed by extension of the conductive material from the shielding member.
Inventor(s): Haofan Lu of Los Angeles CA US for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX US for samsung electronics co., ltd., Hao Chen of Allen TX US for samsung electronics co., ltd., Lianjun Li of McKinney TX US for samsung electronics co., ltd., Pranav Madadi of Sunnyvale CA US for samsung electronics co., ltd.
IPC Code(s): H04W4/02, H04B7/06
CPC Code(s): H04W4/027
Abstract: methods and systems for user velocity tracking using wireless technology. a computer-implemented method includes sending one or more frames to one or more transceivers to initiate a process of frame exchanges, receiving, based on the frame exchanges, channel state information (csi) having one or more csi impairments, processing the csi to adjust the one or more csi impairments of the csi to generate a plurality of cleaned csi metrics, and estimating a velocity of a user using the plurality of cleaned csi metrics.
Inventor(s): Duc Doan NGUYEN of Hanoi VN for samsung electronics co., ltd., Van Hau TRUONG of Hanoi VN for samsung electronics co., ltd., Van Hung NGUYEN of Hanoi VN for samsung electronics co., ltd., Minh Duc HOANG of Hanoi VN for samsung electronics co., ltd., The Thoi NGUYEN of Hanoi VN for samsung electronics co., ltd., Van Thinh NGUYEN of Hanoi VN for samsung electronics co., ltd.
IPC Code(s): H04W8/18, H04W88/06
CPC Code(s): H04W8/183
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to various embodiments of the disclosure, there is provided a method of a terminal including a plurality of sims in a wireless communication system, the method including: based on a type of a sim used for a current communication service of the terminal, determining whether to enable a dual connectivity feature of the terminal; and transmitting information on whether to enable the dual connectivity feature to a base station, wherein the terminal and the base station are configured to support the dual connectivity feature, wherein the plurality of sims include a first sim and a second sim, and the first sim and the second sim include different subscription information.
Inventor(s): Sangjun MOON of Suwon-si KR for samsung electronics co., ltd., Hyesung KIM of Suwon-si KR for samsung electronics co., ltd., Dongeun SUH of Suwon-si KR for samsung electronics co., ltd., Hoyeon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W8/20, H04M15/00, H04W4/38, H04W64/00
CPC Code(s): H04W8/20
Abstract: provided is an operation method of an access and mobility management function (amf) in a wireless communication system, the operation method including receiving a subscription request from a sensing function (sf), receiving subscription information for each user equipment (ue) from unified data management (udm) and checking whether each ue is able to support a sensing service, identifying, based on the subscription information and whether each ue is able to support the sensing service, at least one base station or at least one ue that satisfies a location condition, and transmitting, to the sf, information related to the identified at least one base station or at least one ue and the corresponding location condition.
Inventor(s): Rajavelsamy RAJADURAI of Bangalore IN for samsung electronics co., ltd., Nivedya Parambath SASI of Bangalore IN for samsung electronics co., ltd., Rohini RAJENDRAN of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W12/06, H04W60/00
CPC Code(s): H04W12/06
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose a method and system for authentication method selection in an edge network system. the method includes determining whether the ue is configured with authentication methods supported by at least one of an ecs, an ees, a home network and a serving network in the edge network system. the method further includes selecting the authentication methods configured at the ue based on a capability of the ue to establish a connection with the ees based on the at least one selected authentication method when the ue is configured with the authentication methods supported by at least one of the ecs, the ees, the home network and the serving network.
Inventor(s): Huan HE of Beijing CN for samsung electronics co., ltd., Zhining YIN of Beijing CN for samsung electronics co., ltd., Yinghuan ZHAO of Beijing CN for samsung electronics co., ltd., Yan LI of Beijing CN for samsung electronics co., ltd., Huiyang WANG of Beijing CN for samsung electronics co., ltd., Jiajia WANG of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W56/00
CPC Code(s): H04W24/02
Abstract: embodiments of the present disclosure provide a network node and a method performed by the network node and a storage medium, relating to a field of artificial intelligence. a method performed by a network node may comprise: detecting an overshooting cell; determining an adjustment step corresponding to the overshooting cell based on a coverage situation of the overshooting cell; and adjusting a coverage range of the overshooting cell based on the determined adjustment step. the method performed by the network node may be performed using an artificial intelligence model.
Inventor(s): Jeongho Jeon of San Jose CA US for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04L5/00
CPC Code(s): H04W24/10
Abstract: methods and apparatuses for reporting channel state information (csi) associated with sub-configurations in wireless communication systems. a method includes receiving information related to non-zero power csi reference signals (nzp csi-rss) for channel measurement and csi-rss or csi interference measurements (csi-rss/csi-ims) for interference measurement on a cell and information related to a csi report associated with csi report sub-configurations. the method further includes receiving information related to indicating csi report sub-configurations from the csi report sub-configurations, and the nzp csi-rss for channel measurement and the one or more csi-rss/csi-ims for interference measurement. the method further includes determining a csi sub-reports corresponding to the csi report sub-configurations, respectively, based on the reception of the nzp csi-rss for channel measurement and the one or more csi-rss/csi-ims for interference measurement and transmitting an uplink channel with the csi report including the csi sub-reports.
Inventor(s): Seungbeom JEONG of Gyeonggi-do KR for samsung electronics co., ltd., Sangyeob JUNG of Gyeonggi-do KR for samsung electronics co., ltd., Beomsik BAE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W24/10, H04W24/02, H04W76/20
CPC Code(s): H04W24/10
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system includes receiving, via radio resource control (rrc) signaling, an application layer measurement configuration, obtaining radio access network (ran) visible application layer measurement reports after receiving the application layer measurement configuration, identifying whether a first signaling radio bearer (srb) for transmission of the ran visible application layer measurement reports is available, and discarding the ran visible application layer measurement reports in case that the first srb for the transmission of the ran visible application layer measurement reports is not available.
Inventor(s): Hyunjeong KANG of Suwon-si KR for samsung electronics co., ltd., Anil AGIWAL of Suwon-si KR for samsung electronics co., ltd., Milos TESANOVIC of Staines GB for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W72/25, H04W88/04
CPC Code(s): H04W28/0231
Abstract: the present disclosure relates to a 5-generation (5g) or 6-generation (6g) communication system for supporting higher data transmission rates. according to an embodiment of the present disclosure, a method performed by a user equipment (ue) for sidelink (sl) communication may include: transmitting traffic status information about sl uplink and sl downlink; obtaining scheduling information for sl uplink traffic control and sl downlink traffic resource allocation determined based on the traffic status information; and controlling traffic flow, based on the scheduling information, wherein the ue is a sl remote ue or a sl relay ue.
Inventor(s): Sungin SHIN of Suwon-si KR for samsung electronics co., ltd., Seungbeom SEO of Suwon-si KR for samsung electronics co., ltd., Junyoung CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04L5/00, H04W76/15
CPC Code(s): H04W28/065
Abstract: various embodiments of the present disclosure relate to an electronic device for transmitting data and an operation method thereof �n electronic device according to an embodiment of the present disclosure may include a communication circuit configured to support bluetooth low energy (ble), and at least one processor operatively connected to the communication circuit, wherein the at least one processor is configured to identify first data packets by dividing the same to correspond to the number of subevents, identify at least one first subevent and at least one second subevent in the divided subevents, update, based on an offset, the at least one first subevent and the at least one second subevent, and transmit, to an external electronic device, the first data packets included in the updated first subevent and the updated second subevent. in addition, various embodiments identified through the specification are also possible.
Inventor(s): Weiwei WANG of Beijing CN for samsung electronics co., ltd., Hong WANG of Beijing CN for samsung electronics co., ltd., Lixiang XU of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08
CPC Code(s): H04W36/0055
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the application provides a method in a communication system, comprising: transmitting at least one of: candidate information related to cell selection, first data configuration information, update configuration indication information, and configuration indication information, and/or receiving at least one of: assistance information related to cell selection, second data configuration information, and third information related to configuration.
Inventor(s): Sangbum KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W76/20
CPC Code(s): H04W36/0058
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. a method and device disclosed herein can address the problem of signalling-based mdt override in inter-rat cell reselection or inter-rat handover.
Inventor(s): Donggun KIM of Staines GB for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08
CPC Code(s): H04W36/0072
Abstract: the disclosure relates to a fifth-generation (5g) or sixth-generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method comprises receiving, from a base station, a physical downlink control channel (pdcch) order for a random access procedure on a layer 1/layer 2 triggered mobility (ltm) candidate cell, transmitting a random access preamble for an early timing advance (ta) acquisition for the ltm candidate cell, based on the pdcch order and receiving, from the base station, a cell switch command including a ta value of the ltm candidate cell, wherein a bandwidth part (bwp) operation is not performed for the ltm candidate cell based on the random access procedure being initiated by the pdcch order.
Inventor(s): Donggun KIM of Staines GB for samsung electronics co., ltd.
IPC Code(s): H04W36/04
CPC Code(s): H04W36/04
Abstract: the disclosure relates to a 5th generation (5g) or 6th generation (6g) communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a communication system is provided. the method includes receiving a radio resource control (rrc) message including a configuration of layer 1 (l1)/layer 2 (l2) triggered mobility (ltm) associated with a ltm cell switch procedure identifying that the ltm cell switch procedure is triggered, and releasing current dedicated radio configuration associated with a cell group for which the ltm cell switch procedure is triggered, wherein, in case that the ltm cell switch procedure is triggered on a master cell group (mcg), the current dedicated radio configuration is released except for an mcg cell-radio network temporary identifier (c-rnti).
Inventor(s): Seungri JIN of Suwon-si KR for samsung electronics co., ltd., Sangkyu BAEK of Suwon-si KR for samsung electronics co., ltd., June HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W36/04, H04W36/00, H04W36/08, H04W56/00, H04W76/20, H04W80/02
CPC Code(s): H04W36/04
Abstract: a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, layer 1/layer 2 triggered mobility (ltm) configuration information including a configuration for at least one candidate cell via a radio resource control (rrc) message, wherein the configuration includes information associated with ue-based timing advance (ta) measurement configured for a candidate cell, identifying that the ue-based ta measurement is configured for the candidate cell of the at least one candidate cell, based on the information, receiving, from the base station, a medium access control (mac) control element (ce) indicating a ltm cell switch, the mac ce including first information indicating a configuration identity (id) of the candidate cell for the ltm cell switch and second information on a timing advance command, identifying whether a valid timing advance (ta) value is indicated based on the timing advance command, and in case that the valid ta value is indicated based on the timing advance command, applying the ta value for the ltm cell switch to the candidate cell.
Inventor(s): Emad Nader Farag of Flanders NJ US for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX US for samsung electronics co., ltd., Dalin Zhu of Allen TX US for samsung electronics co., ltd.
IPC Code(s): H04W36/06, H04W36/00
CPC Code(s): H04W36/06
Abstract: methods and apparatuses for inter-cell beam management triggered cell switch. a method of operating a user equipment (ue) includes receiving first information for first sets of downlink (dl) or joint candidate cell transmission configuration indicator (tci) states corresponding to one or more candidate cells, receiving second information for second sets of uplink (ul) candidate cell tci states corresponding to the one or more candidate cells, receiving a first medium access control-channel element (mac-ce) for activating a subset of candidate cell tci states from the first or second sets, and receiving a second mac ce including a cell switch command. the cell switch command indicates a candidate cell and at least one candidate cell tci state from the first sets or the second sets corresponding to the candidate cell. the method further includes deactivating the subset of activated candidate cell tci states excluding the at least one candidate cell tci state.
Inventor(s): Aman AGARWAL of Bangalore IN for samsung electronics co., ltd., Siddharth SHUKLA of Bangalore IN for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore IN for samsung electronics co., ltd., Nishant of Bangalore IN for samsung electronics co., ltd., Lalith KUMAR of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W36/08, H04B7/185, H04W60/06, H04W84/06
CPC Code(s): H04W36/083
Abstract: a method performed by a user equipment (ue) may comprise: receiving one or more discontinuous coverage parameters associated with a first sim of the ue, identifying a default sim of at least one service as the first sim of the ue over a first non-terrestrial network (ntn), estimating a time period for completion of the at least one service based on one or more service parameters associated with the at least one service, configuring a second sim of the ue to provide the at least one service based on the time period and the one or more discontinuous coverage parameters, and switching the default sim of at least one service from the first sim to the second sim of the ue.
Inventor(s): Weiwei WANG of Beijing CN for samsung electronics co., ltd., Hong WANG of Beijing CN for samsung electronics co., ltd., Lixiang XU of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W40/12, H04W88/04
CPC Code(s): H04W40/12
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a first node in a communication system includes receiving first information related to path configuration from other nodes and/or sending information related to link failure to a fourth node. the first information includes path configuration information. the information related to link failure includes at least one of: link failure type indication information including at least one of: direct path failure indication information, indirect path failure indication information, failed path indication information or link failure cause information.
Inventor(s): Kyungjoo SUH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W48/14, H04W60/04, H04W76/12, H04W84/06
CPC Code(s): H04W48/14
Abstract: provided is a 5th generation (5g) or 6th generation (6g) communication system for supporting a higher data rate. a method performed by a user equipment may include transmitting a registration request message to an access and mobility management function (amf), receiving a registration accept message from the amf, transmitting a protocol data unit (pdu) session establishment request message to a session management function (smf), receiving a pdu session establishment accept message from the smf, and receiving a configuration update message from the amf.
Inventor(s): Youngbum KIM of Suwon-si KR for samsung electronics co., ltd., Younsun KIM of Suwon-si KR for samsung electronics co., ltd., Hyunsuk RYU of Suwon-si KR for samsung electronics co., ltd., Taehan BAE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W52/02
CPC Code(s): H04W52/0206
Abstract: the present invention relates to a communication technique which combines, with iot technology, a 5g communication system for supporting higher data transmission rates than 4g systems, and a system therefor. the present invention can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5g communication technology and iot-related technology. disclosed are a method and device for reducing the power consumption of a base station.
Inventor(s): Sapan Pramodkumar SHAH of Bangalore IN for samsung electronics co., ltd., Narendranath Durga TANGUDU of Bangalore IN for samsung electronics co., ltd., Basavaraj Jayawant PATTAN of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W60/02, H04L67/55, H04W8/00
CPC Code(s): H04W60/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose method for handling a registration of an eec () during a service continuity procedure by a target-edge enabler server (t-ees) (). the method includes performing an implicit registration of the eec () upon receiving a push eec context request message from a source-edge enabler server (s-ees) (). further, the method includes creating at least one of a registration id associated with the implicit registration and an expiration time associated with the implicit registration of the eec (). further, the method includes adding at least one of the registration id and the expiration time in a push eec context response message. further, the method includes sending the push eec context response message comprising at least one of the registration id and the expiration time to the s-ees ().
Inventor(s): Sidhant JAIN of Bangalore IN for samsung electronics co., ltd., Lalith KUMAR of Bangalore IN for samsung electronics co., ltd., Aman AGARWAL of Bangalore IN for samsung electronics co., ltd., Dinesh Rooparam CHOUDHARY of Bangalore IN for samsung electronics co., ltd., Varini GUPTA of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W60/04, H04W64/00, H04W76/20, H04W84/06
CPC Code(s): H04W60/04
Abstract: a method performed by a user equipment (ue) for signaling using satellite access in a 4generation (4g) or 5generation (5g) network is provided. the method includes receiving, by the ue, a signal from a first network apparatus associated with a satellite when a feeder link is available between the first network apparatus and the second network apparatus associated with a ground network, storing, by the ue, the signal received from the first network apparatus, and determining, by the ue, a third network apparatus associated with the satellite to transmit a response signaling to a user equipment (ue) upon receiving the signal using the first network apparatus based on an expected location of the ue.
Inventor(s): Anil Agiwal of Allen TX US for samsung electronics co., ltd., Kyeongin Jeong of Allen TX US for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W24/08
CPC Code(s): H04W68/02
Abstract: a user equipment (ue) includes a transceiver configured to receive a configuration for a paging notification or an alert from a base station of a cell camped on by the ue. the ue also includes a processor operably coupled to the transceiver. the processor is configured to determine whether a downlink signal quality of the camped cell is less than a threshold, and when the downlink signal quality of the camped cell is less than the threshold, monitor a downlink channel of the camped cell for receiving the paging notification or alert.
Inventor(s): Seongmok LIM of Suwon-si KR for samsung electronics co., ltd., Kyoungmin PARK of Suwon-si KR for samsung electronics co., ltd., Youngrok JANG of Suwon-si KR for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si KR for samsung electronics co., ltd., Hyoungju JI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04W72/231, H04W72/232
CPC Code(s): H04W72/1268
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure relates to a method of a terminal in a wireless communication system and, particularly, to a method and a device, the method comprising the steps of: receiving, from a base station, an rrc message including information for determination of a tci state; receiving, from the base station, dci including information indicating an integrated tci state; when multiple tci states are indicated based on the dci, determining a tci state for a pucch based on the information for determination of the tci state; and transmitting uplink control information to the base station on the pucch based on the determined tci state.
Inventor(s): Sa ZHANG of Beijing CN for samsung electronics co., ltd., Yi WANG of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd., Jingxing FU of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04L1/1812, H04L5/00, H04L5/14, H04W72/0446, H04W72/20
CPC Code(s): H04W72/1273
Abstract: the present disclosure relates to a communication method and system for converging a 5th-generation (5g) communication system for supporting higher data rates beyond a 4th-generation (4g) system with a technology for internet of things (iot). the present disclosure may be applied to intelligent services based on the 5g communication technology and the iot-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services.
Inventor(s): Sa ZHANG of Beijing CN for samsung electronics co., ltd., Yi WANG of Beijing CN for samsung electronics co., ltd., Feifei SUN of Beijing CN for samsung electronics co., ltd., Jingxing FU of Beijing CN for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04L1/1812, H04L5/00, H04L5/14, H04W72/0446, H04W72/20
CPC Code(s): H04W72/1273
Abstract: a method performed by a second type of transceiver node in a wireless communication system is provided, comprising: receiving a first type of data and/or a first type of control signaling from a first type of transceiver node; determining an harq-ack codebook and a time unit for transmitting the harq-ack codebook based on the first type of data and/or the first type of control signaling; and transmitting the harq-ack codebook to the first type of transceiver node in the determined time unit.
Inventor(s): Jeongseok YU of Gyeonggi-do KR for samsung electronics co., ltd., Hyunjeong KANG of Gyeonggi-do KR for samsung electronics co., ltd., Taeseop LEE of Gyeonggi-do KR for samsung electronics co., ltd.
IPC Code(s): H04W72/25, H04L1/1812, H04L5/00, H04W72/566
CPC Code(s): H04W72/25
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a terminal for sl communication is provided, which includes receiving, from a base station, an sl grant for sl transmission; in case that there is an sl-prs for transmission for a selected destination, identifying a first tbs including the sl-prs based on the sl grant; and in case that all data within a logical channel with higher priority than a logical channel of the sl-prs is allocated with resources of the sl grant, transmitting the sl-prs based on the sl grant.
Inventor(s): Sungdong KIM of Suwon-si KR for samsung electronics co., ltd., Kisoo AN of Suwon-si KR for samsung electronics co., ltd., Gyubong OH of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W76/14, G01S13/74, G06Q20/32, H04W76/15
CPC Code(s): H04W76/14
Abstract: an operation method of a first electronic apparatus in a wireless communication system according to an embodiment of the disclosure may include an operations of receiving, from a second electronic apparatus, a bluetooth low energy (ble) advertisement message including an indicator indicating a state in which the first electronic apparatus moves into a configured place or a state in which the electronic apparatus moves out of the configured place, identifying whether the first electronic apparatus is to move into the configured place or move out of the configured place, establishing, in case that a result of the identification corresponds to the indicator, a ble connection with the second electronic apparatus and receiving ultra-wideband (uwb) connection information from the second electronic apparatus, and establishing a uwb connection with the second electronic apparatus and performing uwb ranging with the second electronic apparatus based on the uwb connection information.
Inventor(s): Jajohn MATHEW MATTAM of Bangalore IN for samsung electronics co., ltd., Manasi EKKUNDI of Bangalore IN for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04W36/00, H04W72/56
CPC Code(s): H04W76/15
Abstract: a method, performed by a user equipment (ue), for prioritizing a secondary cell group (scg) supported cell in dual connectivity is provided. the method includes detecting whether the scg supported cell is called for with respect to a service that is triggered at the ue and detecting that a connection of the ue with the scg supported cell is released in a case. further, the method includes detecting whether the service that is triggered at the ue has ended and detecting, based on network configured scg measurements, the scg supported cell by using one or more unused new radio (nr) antennas of the ue. the method also includes identifying a master cell group supporting the detected scg supported cell and switching from a master cell not supporting scg to the identified master cell group supporting the detected scg supported cell.
Inventor(s): Youngrok JANG of Suwon-si KR for samsung electronics co., ltd., Kyoungmin PARK of Suwon-si KR for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si KR for samsung electronics co., ltd., Seongmok LIM of Suwon-si KR for samsung electronics co., ltd., Hyoungju JI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H04W76/20, H04B7/06, H04W72/231
CPC Code(s): H04W76/20
Abstract: the present disclosure relates to a communication technique for combining an iot technology with a 5g communication system for supporting a higher data transmission rate than that of a beyond-4g system, and a system therefor. the present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail business, security and safety-related services, etc.) on the basis of 5g communication technologies and iot-related technologies. the present disclosure provides a method and an apparatus for applying a plurality of unified transmission configuration indicators (tcis) in a wireless communication system.
Inventor(s): Marian Rudolf of Longueuil CA for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX US for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ US for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04W72/23
CPC Code(s): H04W76/28
Abstract: apparatuses and methods for monitoring indications for physical downlink control channels (pdcchs) in full-duplex (fd) systems. a method includes receiving a set of discontinuous reception (drx) parameters associated with a subband full-duplex (sbfd) configuration and receiving a first pdcch that provides a downlink control information (dci) format. the dci format includes a wake-up indication field enabling or disabling receptions of a second pdcch, in a drx on-period, for a symbol or a subband type. the method further includes selecting, based on the wake-up indication field, the symbol or the subband type for receptions of the second pdcch and receiving, based on (i) the selected symbol or subband type and (ii) the set of drx parameters, the second pdcch at a first occasion in a drx on-duration or during a drx active time. the first occasion is after reception of the first pdcch and before an end duration.
Inventor(s): Sangkyu BAEK of Suwon-si KR for samsung electronics co., ltd., Anil AGIWAL of Santa Clara CA US for samsung electronics co., ltd.
IPC Code(s): H04W76/28
CPC Code(s): H04W76/28
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure relates to a method performed by a terminal and the method comprises receiving, from a base station, a radio resource control (rrc) message including configuration information associated with cell dtx, in case that the cell dtx is configured for a serving cell, identifying whether one of a first timer associated with discontinuous reception (drx) retransmission of downlink (dl) or a second timer associated with drx retransmission of uplink (ul) is running on any serving cell in a drx group of the serving cell, and monitoring, in case that one of the first timer or the second timer is running, a physical downlink control channel (pdcch) on the serving cell in the drx group.
Inventor(s): Donghoon PARK of Suwon-si KR for samsung electronics co., ltd., Kwangyoung JUNG of Suwon-si KR for samsung electronics co., ltd., Seunghun KIM of Suwon-si KR for samsung electronics co., ltd., Jung-Soon BOK of Suwon-si KR for samsung electronics co., ltd., Jiho UH of Suwon-si KR for samsung electronics co., ltd., Hyunjoon OHN of Suwon-si KR for samsung electronics co., ltd., WonHee YOON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05H1/24, G01K7/00
CPC Code(s): H05H1/24
Abstract: provided is a plasma generating system including: a resonant inverter including a switching circuit and configured to generate a device output current and a device output voltage, and to have a switching frequency based on an input dc current and an input dc voltage; a plasma source configured to generate a plasma based on the device output current and the device output voltage; a controller configured to control the switching frequency of the resonant inverter based on a value of the input dc current, a value of the input dc voltage, a value of the device output current, and a value of the device output voltage; and a junction temperature estimator configured to: estimate a current output from the switching circuit based on the value of the input dc voltage, the value of the device output current, and the value of the device output voltage, generate an inverted current estimate value, and estimate a junction temperature of the switching circuit based on the inverted current estimate value.
20250107012. ELECTRONIC DEVICE INCLUDING BATTERY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hwanju JEON of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/00, A61B5/00, A61B5/01, H01F7/02, H05K5/02
CPC Code(s): H05K5/0086
Abstract: an electronic device according to an embodiment of the disclosure may include: a housing including a coupling part configured to be be detachably coupled to a ring-shaped external device, wherein the coupling part includes a first coupling surface, a second coupling surface extending from one side of the first coupling surface, a third coupling surface extending from an other side of the first coupling surface, and a connection terminal formed on at least one of the first coupling surface, the second coupling surface, and the third coupling surface and configured to electrically connect the electronic device with the external device based on the electronic device being coupled to the external device, and based on the electronic device being coupled with the external device, the first coupling surface is disposed to face an outer surface facing in a direction opposite to an inner surface of the external device, and the second coupling surface and the third coupling surface are arranged to face a side surface formed between the inner surface and the outer surface of the external device.
Inventor(s): Jooyoung KANG of Suwon-si KR for samsung electronics co., ltd., Bongsoo KIM of Suwon-si KR for samsung electronics co., ltd., Sejin PARK of Suwon-si KR for samsung electronics co., ltd., Wanju BYUN of Suwon-si KR for samsung electronics co., ltd., Sujeong CHO of Suwon-si KR for samsung electronics co., ltd., Hyunju HONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0217
Abstract: an electronic device includes a first housing, a second housing slidably coupled to the first housing, and a drive part. the drive part provides a driving force for sliding the second housing and includes a pinion gear and a drive motor configured to rotate the pinion gear. the electronic device further includes a rack gear and a guide structure. the rack gear is gear-coupled to the pinion gear to reciprocate in a predetermined section in accordance with a rotation of the pinion gear. the guide structure includes an accommodation space configured to accommodate at least a part of the rack gear and to guide the moving rack gear.
Inventor(s): Haejin LEE of Suwon-si KR for samsung electronics co., ltd., Joseph AHN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H05K7/20, G02B27/01
CPC Code(s): H05K7/2019
Abstract: according to an embodiment, a wearable device includes: a frame including at least one inlet, a printed circuit board disposed in the frame, an electronic component disposed on the printed circuit board, and a shield can, disposed on the printed circuit board, at least partially surrounding the electronic component. the wearable device includes a housing, coupled with the shield can. the wearable device includes an actuator facing the housing. the actuator is configured to move air received through the at least one inlet toward the housing.
20250107065. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jin-Seong PARK of Seoul KR for samsung electronics co., ltd., Jihyun KHO of Suwon-si KR for samsung electronics co., ltd., Seunghee LEE of Suwon-si KR for samsung electronics co., ltd., Yurim KIM of Suwon-si KR for samsung electronics co., ltd., Yong-Suk TAK of Suwon-si KR for samsung electronics co., ltd., Dong-Gyu KIM of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor device includes a semiconductor pattern, a dielectric layer on the semiconductor pattern, and a conductive pattern on the dielectric layer. each of the semiconductor pattern and the dielectric layer includes impurities. the dielectric layer includes a concentration profile of impurities including a first variation section including a first concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern, and a second variation section including a second concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern.
20250107066. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bo Won Yoo of Suwon-si KR for samsung electronics co., ltd., Jin Woo Han of Suwon-si KR for samsung electronics co., ltd., Seok Han Park of Suwon-si KR for samsung electronics co., ltd., Sung-Min Park of Suwon-si KR for samsung electronics co., ltd., Gyu Hwan Oh of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, G11C5/06
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device includes a cell region element separation film that is on a substrate and includes first and second cell region side walls; an active pattern that is on the substrate; a word line that is on the first side wall of the active pattern; a back gate electrode that is on the second side wall of the active pattern; a bit line that is electrically connected to the first side of the active pattern; and a data storage pattern that is electrically connected to the second side of the active pattern, where the word line includes an electrode part and a plug connecting part, and where the plug connecting part of the word line includes a first connecting extending part and a second connecting extending part.
Inventor(s): Chaelyoung KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a memory device includes a substrate, a unit cell selection transistor on the substrate, and a capacitor structure on the unit cell selection transistor, the capacitor structure comprising a common electrode connected to the unit cell selection transistor, a plurality of plate electrodes facing the common electrode, and a capacitor dielectric layer arranged between the common electrode and the plurality of plate electrodes. the common electrode comprises a vertical extension portion in contact with the unit cell selection transistor and extending in a vertical direction, and a plurality of horizontal extension portions extending in a first horizontal direction from a side wall of the vertical extension portion and apart from each other in the vertical direction. each of the plurality of plate electrodes extends in a second horizontal direction between the plurality of horizontal extension portions, the second horizontal direction being perpendicular to the first horizontal direction.
20250107070. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): HOSANG LEE of Suwon-si KR for samsung electronics co., ltd., TAEJIN PARK of Suwon-si KR for samsung electronics co., ltd., HYEON-KYU LEE of Suwon-si KR for samsung electronics co., ltd., SUNG SOO YIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L29/66, H01L29/78
CPC Code(s): H10B12/482
Abstract: a semiconductor device may include a first bit line that extends in a first direction, a first active pillar and a second active pillar on the first bit line, a first gate insulating pattern enclosing the first active pillar, a second gate insulating pattern on the second active pillar, a first word line and a second word line that extends in a second direction that intersects the first direction, and a protection pattern between the first and second word lines. an air gap is between the first and second word lines and may be adjacent to the protection pattern.
20250107071. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Taegyu KANG of Suwon-si KR for samsung electronics co., ltd., Keunui KIM of Suwon-si KR for samsung electronics co., ltd., Seokhan PARK of Suwon-si KR for samsung electronics co., ltd., Joongchan SHIN of Suwon-si KR for samsung electronics co., ltd., Gyuhwan OH of Suwon-si KR for samsung electronics co., ltd., Bowon YOO of Suwon-si KR for samsung electronics co., ltd., Kiseok LEE of Suwon-si KR for samsung electronics co., ltd., Sangho LEE of Suwon-si KR for samsung electronics co., ltd., Eunsuk JANG of Suwon-si KR for samsung electronics co., ltd., Moonyoung JEONG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/482
Abstract: a semiconductor device comprising: a substrate; bit lines on the substrate; word lines on the bit lines, wherein the word lines are spaced apart from each other in a first direction; activation patterns between the word lines; a back gate electrode between the activation patterns, wherein the back gate electrode extends in a second direction; and a first gate separation pattern between the word lines in the first direction, wherein a portion of the word lines is a space between the activation patterns in the second direction and the word lines extend around the activation patterns, wherein the word lines and the first gate separation pattern each include a first surface facing the bit lines and a second surface opposite to the first surface in a third direction, wherein the first gate separation pattern is closer than the word lines to the bit lines in the third direction.
Inventor(s): Seran Oh of Suwon-si KR for samsung electronics co., ltd., Yunho Kang of Suwon-si KR for samsung electronics co., ltd., Minsik Kim of Suwon-si KR for samsung electronics co., ltd., Yeonuk Kim of Suwon-si KR for samsung electronics co., ltd., Byounghoon Lee of Suwon-si KR for samsung electronics co., ltd., Jangeun Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/528, H01L23/532
CPC Code(s): H10B12/485
Abstract: a semiconductor device may include a substrate including a first active region defined by a first device isolation layer, a bit line contact arranged on the first active region of the substrate, and a bit line that extends in a first direction on the substrate. the bit line includes a lower conductive layer arranged on the substrate and on a sidewall of the bit line contact and a metal line stack arranged on the lower conductive layer. the metal line stack includes a first conductive layer arranged on the lower conductive layer and the bit line contact and including a first metal material, a first intermediate layer arranged on the first conductive layer and including graphene, and a second conductive layer arranged on the first intermediate layer and including the first metal material.
Inventor(s): Kyunghwan KIM of Suwon-si KR for samsung electronics co., ltd., Joongchan SHIN of Suwon-si KR for samsung electronics co., ltd., Hyungeun CHOI of Suwon-si KR for samsung electronics co., ltd., Taegyu KANG of Suwon-si KR for samsung electronics co., ltd., Keunui KIM of Suwon-si KR for samsung electronics co., ltd., Bowon YOO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/488
Abstract: a semiconductor device includes a substrate including a cell array area and an interface area, bit lines on the cell array area and extending in a first horizontal direction, back gate lines on the bit lines and extending in a second direction, insulating blocks on the interface area and each overlapping the back gate lines in the second direction, word lines among which each pair of two adjacent word lines are on both sides of a corresponding back gate line, respectively, and extending on a sidewall of a corresponding insulating block, active semiconductor layers each between a corresponding back gate line and a corresponding word line on the cell array area and having one end electrically connected to a corresponding bit line, and a word line contact on the interface area and on a corresponding word line and a corresponding insulating block adjacent thereto.
Inventor(s): Hanbyeol LEE of Suwon-si KR for samsung electronics co., ltd., Younghwan SON of Suwon-si KR for samsung electronics co., ltd., Sangdon LEE of Suwon-si KR for samsung electronics co., ltd., Shinhwan KANG of Suwon-si KR for samsung electronics co., ltd., Sukkang SUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/00, H01L25/065, H01L25/18, H10B41/27, H10B41/35, H10B43/35, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes gate electrodes stacked and spaced apart from each other including upper gate electrodes, memory gate electrodes and lower gate electrodes sequentially stacked from the horizontal conductive layer; a horizontal connection portion between the memory gate electrodes and the lower gate electrodes; channel structures penetrating through the gate electrodes and extending in the first direction in the first region; isolation regions penetrating through the gate electrodes; an insulating region extending from a lowermost surface of the gate electrodes and penetrating through at least one of the lower gate electrodes between the isolation regions; wherein an upper surface of the insulating region has a first width, a lower surface has a second width greater than the first width, an upper surface of each of the channel structures has a third width, and a lower surface has a fourth width smaller than the third width.
Inventor(s): Wooyoung Lee of Suwon-si KR for samsung electronics co., ltd., Junghwan Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes: a stack structure including gate electrodes that are spaced apart from each other in a first direction, perpendicular to an upper surface of a substrate, in a first region and a second region; separation regions extending through the stack structure and extending in a second direction, perpendicular to the first direction, in the first region and the second region; a plurality of channel structures extending through the stack structure, in a cell region of the first region; a plurality of dummy channel structures extending through the stack structure, in a buffer region of the first region; and a plurality of support structures extending through the stack structure, in the second region. the first region and the second region are sequentially arranged in the second direction. the separation regions include a first separation region and a second separation region, adjacent to each other in a third direction, and perpendicular to the first direction and the second direction. between the first and second separation regions, the dummy channel structures include a first dummy group adjacent to the cell region and including first dummy channel structures sequentially arranged in the third direction, and a second dummy group adjacent to the second region and including second dummy channel structures sequentially arranged in the third direction. a first length of the first dummy group in the third direction is longer than a second length of the second dummy group in the third direction.
Inventor(s): Sanghun CHUN of Suwon-si KR for samsung electronics co., ltd., Kwangyoung JUNG of Hwaseong-si KR for samsung electronics co., ltd., Youngji NOH of Suwon-si KR for samsung electronics co., ltd., Junghwan PARK of Seongnam-si KR for samsung electronics co., ltd., Jeehoon HAN of Hwaseong-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/35
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a substrate, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the substrate, channel structures penetrating the gate electrodes, extending in the first direction, and each including a channel layer, separation regions penetrating the gate electrodes, extending in the first direction and a second direction perpendicular to the first direction, and spaced apart from each other in a third direction perpendicular to the first direction and the second direction, and crack prevention layers disposed on at least a portion of the separation regions, wherein each of the separation regions includes a lower region and upper regions spaced apart from each other in the second direction on the lower region and protruding upwardly from the lower region, and wherein the crack prevention layers are in contact with upper surfaces of the upper regions.
Inventor(s): Joongshik SHIN of Yongin-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/00, H01L25/065, H01L25/18, H10B43/10
CPC Code(s): H10B43/27
Abstract: a semiconductor device including: a horizontal wiring layer; a stack structure including a plurality of mold layers and a plurality of wiring layers alternately stacked on the horizontal wiring layer; a plurality of channel structures extending through the stack structure; and a plurality of separation patterns extending through the stack structure, wherein each of the plurality of separation patterns includes a plurality of first areas and a plurality of second areas adjacent to the plurality of first areas, wherein each of the plurality of first areas has a smaller width than each of the plurality of second areas.
Inventor(s): Yeonchoo CHO of Suwon-si KR for samsung electronics co., ltd., Junyoung KWON of Suwon-si KR for samsung electronics co., ltd., Huije RYU of Suwon-si KR for samsung electronics co., ltd., Minsu SEOL of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/30, H10B43/27
CPC Code(s): H10B43/30
Abstract: a memory device may include a gate electrode, a channel layer spaced apart from the gate electrode, a charge trap layer between the gate electrode and the channel layer, and a two-dimensional material layer arranged between the charge trap layer and the gate electrode. the two-dimensional material layer may include a material having an electron affinity of less than 1 ev.
Inventor(s): Kohji Kanamori of Suwon-si KR for samsung electronics co., ltd., Jae-Bok Baek of Suwon-si KR for samsung electronics co., ltd., Donghyuck Jang of Suwon-si KR for samsung electronics co., ltd., Jeehoon Han of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B41/27, H10B41/41, H10B43/27
CPC Code(s): H10B43/40
Abstract: disclosed are semiconductor devices and electronic systems. the semiconductor device comprises a semiconductor substrate including first and second cell array regions and a connection region including a lower pad region and an upper pad region, a peripheral circuit structure including peripheral circuits on the semiconductor substrate, and a cell array structure on the peripheral circuit structure and including a first stack structure including first conductive patterns stacked on the peripheral circuit structure and a second stack structure including second conductive patterns stacked on the first stack structure. the first stack structure includes a connection portion that has a uniform thickness on the upper pad region, and first and second stepwise structures that are asymmetric with each other on the lower pad region. the second stack structure includes third and fourth stepwise structures that are symmetric with each other on the connection portion of the first stack structure.
20250107099. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeran Lee of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B51/20, H01L23/522, H01L23/528, H01L29/78, H10B12/00, H10B53/20
CPC Code(s): H10B51/20
Abstract: a semiconductor device includes a first substrate and first and second memory blocks on the first substrate and spaced apart in a first direction, the first memory block includes first bit lines spaced apart in a second direction, first semiconductor patterns in contact with side surfaces of the first bit lines and extending in a direction, and first capacitors electrically connected to ends of the first semiconductor patterns, the second memory block includes second bit lines spaced apart in the second direction, second semiconductor patterns in contact with side surfaces of the second bit lines and extending in the first direction, and second capacitors electrically connected to ends of the second semiconductor patterns. the first capacitors respectively include a first dielectric layer of one of silicon oxide or metal oxide, and the second capacitors respectively include a second dielectric layer of one of ferroelectric or antiferroelectric materials.
20250107102. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Junhoe KIM of Suwon-si KR for samsung electronics co., ltd., Kilho LEE of Suwon-si KR for samsung electronics co., ltd., Shin KWON of Suwon-si KR for samsung electronics co., ltd., Hyeonah JO of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10B61/00, G01R33/09, H10N50/10
CPC Code(s): H10B61/22
Abstract: a semiconductor device includes a substrate including a cell region and a peripheral region, a first lower insulating layer disposed on the cell region and extending onto the peripheral region, a second lower insulating layer disposed on the first lower insulating layer on the cell region and extending onto the first lower insulating layer on the peripheral region, data storage patterns disposed on the second lower insulating layer on the cell region, a cell insulating layer disposed on the second lower insulating layer on the cell region and covering the data storage patterns, and a peripheral insulating layer disposed on the second lower insulating layer on the peripheral region and including a material different from the cell insulating layer. a thickness of the second lower insulating layer on the peripheral region is smaller than a maximum thickness of the second lower insulating layer on the cell region.
20250107136. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyeok-Jun SON of Suwon-si KR for samsung electronics co., ltd., Chan Hyeong LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L29/423, H01L29/66
CPC Code(s): H10D30/6215
Abstract: provided a semiconductor device. the semiconductor device comprises an active pattern extending in a first direction on a substrate, a gate stack extending in a second direction intersecting the first direction on the active pattern, and a source/drain pattern on at least one side of the gate stack, wherein the gate stack includes a first work function pattern, a second work function pattern on the first work function pattern, and a diffusion prevention pattern between the first work function pattern and the second work function pattern, and wherein a concentration of aluminum in the second work function pattern is greater than a concentration of aluminum in the first work function pattern.
20250107150. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daesik KIM of Suwon-si KR for samsung electronics co., ltd., Seonbae KIM of Suwon-si KR for samsung electronics co., ltd., Taeyong KWON of Suwon-si KR for samsung electronics co., ltd., Changhee KIM of Suwon-si KR for samsung electronics co., ltd., Doohyun LEE of Suwon-si KR for samsung electronics co., ltd., Jaehyun KANG of Suwon-si KR for samsung electronics co., ltd., Jinyoung PARK of Suwon-si KR for samsung electronics co., ltd., Hyunho PARK of Suwon-si KR for samsung electronics co., ltd., Jimin YU of Suwon-si KR for samsung electronics co., ltd., Jinwook LEE of Suwon-si KR for samsung electronics co., ltd., Seunghyun HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L21/285, H01L29/06, H01L29/08, H01L29/40, H01L29/423, H01L29/45, H01L29/66, H01L29/775
CPC Code(s): H10D30/6729
Abstract: a semiconductor device includes a substrate including an active region, a gate structure on the substrate, a plurality of channel layers on the active region, spaced apart from each other and surrounded by the gate structure, a source/drain region in a region at which the active region is recessed, on at least one side of the gate structure, and connected to the channel layers, and a contact plug partially recessing the source/drain region from an upper surface of the source/drain region, electrically connected to the source/drain region, and including a metal-semiconductor compound layer along a recessed surface of the source/drain region and a contact conductor layer on the metal-semiconductor compound layer, wherein the metal-semiconductor compound layer has a first thickness on a side surface of the contact conductive layer and a second thickness on a bottom surface of the contact plug, the second thickness being smaller than the first thickness.
20250107159. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Soojin JEONG of Bucheon-si KR for samsung electronics co., ltd., Myunggil KANG of Suwon-si KR for samsung electronics co., ltd., Junggil YANG of Hwaseong-si KR for samsung electronics co., ltd., Junbeom PARK of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L21/02, H01L29/06, H01L29/423, H01L29/66
CPC Code(s): H10D30/6757
Abstract: a semiconductor device includes a first source/drain, a second source/drain isolated from direct contact with the first source/drain in a horizontal direction, a channel extending between the first source/drain and the second source/drain, a gate surrounding the channel, an upper inner spacer between the gate and the first source/drain and above the channel, and a lower inner spacer between the gate and the first source/drain and under the channel, in which the channel includes a base portion extending between the first source/drain and the second source/drain, an upper protrusion portion protruding upward from a top surface of the base portion, and a lower protrusion portion protruding downward from a bottom surface of the base portion, and a direction in which a top end of the upper protrusion portion is isolated from direct contact with a bottom end of the lower protrusion portion is oblique with respect to a vertical direction.
20250107160. TRANSISTOR AND DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Joonseok Kim of Suwon-si KR for samsung electronics co., ltd., Sangwon KIM of Suwon-si KR for samsung electronics co., ltd., CHANG SEOK LEE of Suwon-si KR for samsung electronics co., ltd., Huije Ryu of Suwon-si KR for samsung electronics co., ltd., KEUN WOOK SHIN of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/76
CPC Code(s): H10D48/362
Abstract: a transistor including a semiconductor channel including a compound semiconductor, and a source electrode and a drain electrode each electrically connected to the semiconductor channel and each independently including a topological conductor, wherein the compound semiconductor and the topological conductor include at least one metal element in common.
Inventor(s): Byounghak Hong of Albany NY US for samsung electronics co., ltd., Seungchan Yun of Waterford NY US for samsung electronics co., ltd., Kang-ill Seo of Albany NY US for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/423, H01L29/66, H01L29/786
CPC Code(s): H10D62/118
Abstract: a multi-stack semiconductor device includes: a substrate; a multi-stack transistor formed on the substrate and including a nanosheet transistor and a fin field-effect transistor (finfet) above the nanosheet transistor, wherein the nanosheet transistor includes a plurality nanosheet layers surrounded by a lower gate structure except between the nanosheet layers, the finfet includes at least one fin structure, of which at least top and side surfaces are surrounded by an upper gate structure, and each of the lower and upper gate structures includes: a gate oxide layer formed on the nanosheet layers and the at least one fin structure; and a gate metal pattern formed on the gate oxide layer. at least one of the lower and upper gate structures includes an extra gate (eg) oxide layer formed between the gate oxide layer and the nanosheet layers and/or between the gate oxide layer and the at least one fin structure.
20250107178. INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyunghee Cho of Suwon-si KR for samsung electronics co., ltd., Donghoon Hwang of Suwon-si KR for samsung electronics co., ltd., Hyojin Kim of Suwon-si KR for samsung electronics co., ltd., Byungho Moon of Suwon-si KR for samsung electronics co., ltd., Doyoung Choi of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L27/088, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D62/121
Abstract: an integrated circuit device includes a first fin and a second fin that extend in a first horizontal direction on a first region of a substrate, a third fin and a fourth fin that extend in the first horizontal direction on a second region of a substrate, a connected gate line at least partially surrounding a first channel region and a second channel region, and a separated gate line including a first separated portion that at least partially surrounds a third channel region and a second separated portion that at least partially surrounds a fourth channel region, where an uppermost portion of a top surface of the separated gate line is at a first vertical level, and an uppermost portion of a top surface of the connected gate line is at a second vertical level higher than the first vertical level.
20250107179. INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonkeun CHUNG of Suwon-si KR for samsung electronics co., ltd., Geunwoo KIM of Suwon-si KR for samsung electronics co., ltd., Wandon KIM of Suwon-si KR for samsung electronics co., ltd., Hyoseok CHOI of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L23/522, H01L23/528, H01L27/092, H01L29/417, H01L29/423, H01L29/49, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D62/121
Abstract: provided is an integrated circuit device and a method of manufacturing same, the integrated circuit device including: a fin-type active region on a substrate, a pair of insulating spacers on the fin-type active region and the substrate and defining a first space, a gate dielectric film contacting the gate line in the first space, a gate contact plug having a conductive bottom surface contacting a top contact portion of the gate line in the first space, and a capping insulating pattern including an insulating bottom surface, a pair of first insulating sidewalls, and a second insulating sidewall, the insulating bottom surface contacting a local top surface of the gate line in the first space, the pair of first insulating sidewalls contacting the pair of insulating spacers, and the second insulating sidewall contacting the gate contact plug, wherein an insulating top surface of the capping insulating pattern and a conductive top surface of the gate contact plug extend along one plane.
20250107180. STACKED INTEGRATED CIRCUIT DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyunghee CHO of Suwon-si KR for samsung electronics co., ltd., Byungho MOON of Suwon-si KR for samsung electronics co., ltd., Donghoon HWANG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L21/822, H01L21/8238, H01L27/06, H01L27/092, H01L29/08, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D62/121
Abstract: provided is an integrated circuit device including a base substrate layer, a sheet separation wall extending on the base substrate layer in a first horizontal direction, a pair of nanosheet stacked structures including the sheet separation wall therebetween and apart from each other in a second horizontal direction, the second horizontal direction different from the first horizontal direction, the pair of nanosheet stacked structures each including a plurality of nanosheets, a plurality of cladding patterns between a first end of each of the plurality of nanosheets included in each of the pair of nanosheet stacked structures and the sheet separation wall, and a pair of gate electrodes extending on the pair of nanosheet stacked structures in the second horizontal direction.
Inventor(s): Hyohoon BYEON of Suwon-si KR for samsung electronics co., ltd., Seokhoon Kim of Suwon-si KR for samsung electronics co., ltd., Pankwi Park of Suwon-si KR for samsung electronics co., ltd., Sungkeun Lim of Suwon-si KR for samsung electronics co., ltd., Yuyeong Jo of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/08, H01L21/02, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H10D62/151
Abstract: a semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, and including a plurality of semiconductor patterns spaced apart from each other and vertically stacked, a gate electrode on the plurality of semiconductor patterns, and extending in a first horizontal direction, a gate spacer disposed on a sidewall of the gate electrode in a second horizontal direction crossing the first horizontal direction, a source/drain pattern electrically connected to the plurality of semiconductor patterns, and including a first epitaxial pattern and a second epitaxial pattern on a side surface of the first epitaxial pattern in the second horizontal direction, and a protection pattern between at least one of the plurality of semiconductor patterns and the gate spacer and including a material having an etch selectivity with the first epitaxial pattern.
Inventor(s): Jonggu LEE of Suwon-si KR for samsung electronics co., ltd., Hyeonjin KIM of Suwon-si KR for samsung electronics co., ltd., Kyungwon KANG of Suwon-si KR for samsung electronics co., ltd., Hyunjae KANG of Suwon-si KR for samsung electronics co., ltd., Youngha KIM of Suwon-si KR for samsung electronics co., ltd., Jeonggil KIM of Suwon-si KR for samsung electronics co., ltd., Jinman KIM of Suwon-si KR for samsung electronics co., ltd., Sunghyup KIM of Suwon-si KR for samsung electronics co., ltd., Sanghoon LEE of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/04, H01L23/00, H01L23/498
CPC Code(s): H10D62/405
Abstract: a semiconductor device may include a first semiconductor structure including a first device layer on an upper surface of a first substrate structure, the first device layer including a first region of the semiconductor device; and a second semiconductor structure including a second device layer on a lower surface of a second substrate structure, the second device layer connected to the first device layer and including a second region of the semiconductor device. the first substrate structure may include a first wafer and a second wafer on the first wafer. the second wafer may be in contact with the first device layer. the second substrate structure may include a third wafer and a fourth wafer on a lower surface of the third wafer. the fourth wafer may be in contact with the second device layer. an upper surface of the second wafer may be a (100) crystal plane.
Inventor(s): Minseok YOO of Suwon-si KR for samsung electronics co., ltd., Kibum KANG of Daejeon KR for samsung electronics co., ltd., Minseung GYEON of Daejeon KR for samsung electronics co., ltd., Minsu SEOL of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L29/24, H01L29/08, H01L29/10, H01L29/66, H01L29/786
CPC Code(s): H10D62/80
Abstract: a semiconductor device may include a channel layer including a channel region, a source region, and a drain region, the source region and the drain region being on both sides of the channel region, respectively; a source electrode connected to the source region, a drain electrode connected to the drain region, and a gate electrode on the channel region. the channel region may include a first two-dimensional material layer including a noble metal-based two-dimensional semiconductor material and a second two-dimensional material layer including a two-dimensional semiconductor material different from the first two-dimensional material layer.
Inventor(s): Byounghak Hong of Albany NY US for samsung electronics co., ltd., Seunghyun Song of Albany NY US for samsung electronics co., ltd., Kang-ill Seo of Albany NY US for samsung electronics co., ltd., Daewon Ha of Hwaseong-si KR for samsung electronics co., ltd., Jason Martineau of Milpitas CA US for samsung electronics co., ltd.
IPC Code(s): H01L29/40, H01L21/8238, H01L27/092, H01L29/49
CPC Code(s): H10D64/111
Abstract: presented are structures and methods for forming such structures that allow for electrical or diffusion breaks between transistors of one level of a stacked transistor device, without necessarily requiring that a like electrical or diffusion break exists in another level of the stacked transistor device. also presented, an electrical break between transistor devices may be formed by providing a channel of a first polarity with a false gate comprising a work-function metal of an opposite polarity.
Inventor(s): Changhyun KIM of Seoul KR for samsung electronics co., ltd., Seunggeol NAM of Suwon-si KR for samsung electronics co., ltd., Keunwook SHIN of Yongin-si KR for samsung electronics co., ltd., Dohyun LEE of Seoul KR for samsung electronics co., ltd.
IPC Code(s): H01L29/45, H01L29/06, H01L29/417, H01L29/423, H01L29/78, H01L29/786
CPC Code(s): H10D64/62
Abstract: a semiconductor device includes a first source/drain structure including a first semiconductor region and a first electrode in electrical contact with the first semiconductor region; a second source/drain structure including a second semiconductor region and a second electrode in electrical contact with the second semiconductor region; a channel between the first semiconductor region and the second semiconductor region; and a gate structure including a gate insulating film covering the channel and a gate electrode covering the gate insulating film. the first source/drain structure further includes a silicide film between the first semiconductor region and the first electrode and a conductive barrier between the silicide film and the first electrode. the conductive barrier includes a conductive two-dimensional material.
Inventor(s): Keumseok Park of Slingerlands NY US for samsung electronics co., ltd., Kang-III Seo of Springfield VA US for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L27/092, H01L29/06, H01L29/08, H01L29/66, H01L29/786
CPC Code(s): H10D89/811
Abstract: a method of forming an integrated circuit device includes providing a stacked transistor structure on a substrate. the stacked transistor structure includes a first channel pattern of a first transistor and a second channel pattern of a second transistor stacked on the first channel pattern. second source/drain regions of the second transistor are formed at opposing ends of the second channel pattern, and an oxidation process is performed to oxidize upper and lower surfaces of the second source/drain regions and side surfaces of the first channel. first source/drain regions of the first transistor are then formed at opposing ends of the first channel pattern. related devices and fabrication methods are also discussed.
20250107255. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungduck LEE of Suwon-si KR for samsung electronics co., ltd., Taesub JUNG of Suwon-si KR for samsung electronics co., ltd., Masato FUJITA of Suwon-si KR for samsung electronics co., ltd., Yunha NA of Suwon-si KR for samsung electronics co., ltd., Seungki BAEK of Suwon-si KR for samsung electronics co., ltd., Doosik SEOL of Suwon-si KR for samsung electronics co., ltd., Sungmin AN of Suwon-si KR for samsung electronics co., ltd., Seungki JUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/8023
Abstract: an image sensor includes pixels, each including two photodiodes arranged side-by-side in a first direction, a deep trench isolation structure, a floating diffusion region, and transfer gates. the deep trench isolation structure includes an inner structure that extends in a second direction perpendicular to the first direction and that separates the two pds of pixel from each other in the first direction, and an outer structure that extends in the first and second directions and that separates the pixels from each other in the first and second directions. the floating diffusion region is arranged between a center portion of the outer structure extending in the first direction and an edge of the inner structure. the transfer gates are disposed adjacent to the floating diffusion region such that one or more transfer gates are disposed on each photodiode. for each pixel, the two photodiodes share the floating diffusion region.
20250107256. PIXEL OF IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jihun KIM of Suwon-si KR for samsung electronics co., ltd., Seungwon Cha of Suwon-si KR for samsung electronics co., ltd., Seunghan Hong of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H10F39/8027
Abstract: a pixel including: a first sub-pixel including a plurality of first photodiodes and a first reset transistor; and a second sub-pixel including a plurality of second photodiodes and a second reset transistor, wherein the first sub-pixel shares a floating diffusion node with the second sub-pixel, and wherein a length in a first direction of a metal line for sharing the floating diffusion node is shorter than a length in the first direction of a line connecting a center point of the first sub-pixel to a center point of the second sub-pixel.
Inventor(s): Jonghoon PARK of Seoul KR for samsung electronics co., ltd., Bumsuk KIM of Hwaseong-si KR for samsung electronics co., ltd., Yunki LEE of Hwaseong-si KR for samsung electronics co., ltd., Bomi KIM of Yeongju-si KR for samsung electronics co., ltd., Kwanhee LEE of Hwaseong-si KR for samsung electronics co., ltd., Yoongi JOUNG of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/71, H04N25/75, H04N25/77
CPC Code(s): H10F39/807
Abstract: a pixel array including: a plurality of pixel groups, each pixel group including: a plurality of unit pixels respectively including photoelectric conversion elements disposed in a semiconductor substrate; trench structures disposed in the semiconductor substrate and extending in a vertical direction from a first surface of the semiconductor substrate to a second surface of the semiconductor substrate to electrically and optically separate the photoelectric conversion elements from each other; and a microlens disposed above or below the semiconductor substrate, the microlens covering all of the photoelectric conversion elements in the plurality of unit pixels to focus an incident light to the photoelectric conversion elements.
Inventor(s): Taeyoung KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L31/173
CPC Code(s): H10F55/255
Abstract: disclosed are a light emitting diode unit for harvesting energy and a display module. the light emitting diode unit comprises: a substrate; a light emitting diode arranged on the substrate; and an energy harvesting member comprising a semiconductor layer surrounding the light emitting diode and configured to absorb light energy emitted by the light emitting diode, to generate electric energy, wherein an inner surface of the energy harvesting member is spaced apart from the light emitting diode.
Inventor(s): Nakhyun Kim of Suwon-si KR for samsung electronics co., ltd., Junhee Choi of Suwon-si KR for samsung electronics co., ltd., Joohun Han of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L33/20, H01L25/16, H01L33/00, H01L33/32, H01L33/50
CPC Code(s): H10H20/819
Abstract: a nanorod light-emitting device includes an n-type semiconductor layer, an active layer on the n-type semiconductor layer, and a p-type semiconductor layer on the active layer, and the n-type semiconductor layer includes a core rod, a plurality of nano pores opened in an outward direction from the core rod, and a plurality of quantum dots dispersed in the plurality of nano pores.
Inventor(s): Joohun HAN of Hwaseong-si KR for samsung electronics co., ltd., Junhee CHOI of Hwaseong-si KR for samsung electronics co., ltd., Nakhyun KIM of Hwaseong-si KR for samsung electronics co., ltd., Joosung KIM of Suwon-si KR for samsung electronics co., ltd., Taegon KIM of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H01L33/46, H01L25/075, H01L25/16, H01L33/02, H01L33/06
CPC Code(s): H10H20/841
Abstract: a light emitting device includes a semiconductor light emitting structure including, a first semiconductor layer including a plurality of pores, a light emitting layer provided on the first semiconductor layer, and a second semiconductor layer provided on the light emitting layer, a plurality of quantum dots provided in the plurality of pores, and an external passivation layer at least partially surrounding a sidewall of the semiconductor light emitting structure, where the plurality of quantum dots are provided between the plurality of pores and the external passivation layer.
Inventor(s): Changyup PARK of Suwon-si KR for samsung electronics co., ltd., Young Jae Kang of Suwon-si KR for samsung electronics co., ltd., DongGeon Gu of Suwon-si KR for samsung electronics co., ltd., Bonwon Koo of Suwon-si KR for samsung electronics co., ltd., Segab Kwon of Suwon-si KR for samsung electronics co., ltd., Dongho Ahn of Suwon-si KR for samsung electronics co., ltd., Changseung Lee of Suwon-si KR for samsung electronics co., ltd., Yongnam Ham of Suwon-si KR for samsung electronics co., ltd.
IPC Code(s): H10N70/00, C22C30/00, H10B63/00
CPC Code(s): H10N70/8828
Abstract: provided are variable resistance materials and a variable resistance memory devices including the same. the variable resistance memory device includes: a first electrode; a first variable resistance material on the first electrode; and a second electrode on the first variable resistance material. the first variable resistance material includes germanium, antimony, tellurium, carbon, and sulfur and is expressed by csgesbte, where p is an atomic concentration of carbon, q is an atomic concentration of sulfur, x is an atomic concentration of germanium, y is an atomic concentration of antimony, and z is an atomic concentration of tellurium, wherein a sum of p, q, x, y, and z equals 1, wherein each of p, q, x, y, and z is greater than zero, and wherein q is greater than 0.01 and is less than or equal to about 0.2.
SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- A47L15/42
- CPC A47L15/4217
- Samsung electronics co., ltd.
- A61B5/1455
- A61B5/00
- CPC A61B5/1455
- A61B5/0205
- A61B5/024
- A61B5/08
- A61B5/11
- CPC A61B5/4812
- A61B5/28
- A61M21/02
- A61M21/00
- CPC A61M21/02
- B24B37/26
- CPC B24B37/26
- C07F15/00
- C09K11/02
- C09K11/06
- H10K85/30
- H10K85/40
- H10K85/60
- CPC C07F15/0033
- C08F8/32
- C08F293/00
- H01L21/027
- H01L21/308
- CPC C08F8/32
- C23C16/44
- CPC C23C16/4409
- F04B39/10
- F04B39/00
- F04B39/08
- CPC F04B39/1066
- F04C2/02
- CPC F04C2/025
- F16M11/16
- F16M11/24
- CPC F16M11/16
- F24F1/56
- CPC F24F1/56
- F25B21/02
- CPC F25B21/02
- F25B21/04
- F25D17/04
- F25D23/02
- CPC F25B21/04
- F25D11/02
- F25D17/06
- F25D21/14
- F25D23/00
- CPC F25D11/025
- F25D23/12
- CPC F25D23/126
- F25D29/00
- G10L17/02
- G10L17/22
- G10L25/51
- CPC F25D29/003
- G01S7/00
- G01S7/41
- G01S13/52
- H04W24/02
- H04W84/12
- CPC G01S7/006
- G01S13/76
- H04L5/00
- CPC G01S13/765
- G02B6/42
- G02B6/43
- CPC G02B6/4283
- G02B13/00
- G02B3/14
- G02B15/00
- CPC G02B13/0075
- G02B27/01
- B82Y20/00
- G02B1/00
- G02B27/00
- CPC G02B27/0172
- F21V8/00
- G02B5/18
- G02B5/26
- G02B27/09
- G02B27/28
- G02B27/42
- G02F1/13357
- CPC G02F1/133605
- G03F7/004
- C07F7/22
- CPC G03F7/0042
- G03F7/039
- C08F212/14
- C08F220/38
- C08F228/02
- G03F7/038
- CPC G03F7/039
- G03F7/00
- CPC G03F7/70833
- G06F1/08
- G06F1/10
- CPC G06F1/08
- G06F1/16
- G06F3/041
- CPC G06F1/163
- G06F3/0354
- G06F3/04883
- CPC G06F3/03545
- G06F3/0487
- G06F3/0362
- G06F3/0482
- CPC G06F3/0487
- G06F3/0488
- G06F3/046
- G06F3/0484
- CPC G06F3/0488
- G06F3/06
- CPC G06F3/0611
- CPC G06F3/0619
- G11C11/406
- CPC G06F3/0647
- CPC G06F3/0655
- CPC G06F3/0658
- G06F3/14
- G06T3/60
- CPC G06F3/14
- G06F3/16
- H04L43/028
- CPC G06F3/16
- CPC G06F3/165
- G06F7/485
- G06F5/01
- G06F7/22
- CPC G06F7/485
- G06F8/41
- CPC G06F8/41
- G06F8/65
- CPC G06F8/65
- G06F9/30
- CPC G06F9/30038
- G06F9/50
- CPC G06F9/5027
- G06F11/36
- G06F11/07
- CPC G06F11/3644
- G06F12/02
- G06N5/022
- CPC G06F12/0246
- G06F12/14
- CPC G06F12/1408
- G06F13/40
- G06F13/16
- G06F13/42
- CPC G06F13/4022
- G06F16/17
- G06F16/16
- CPC G06F16/1724
- G06F16/334
- G06F40/30
- CPC G06F16/3344
- G06F16/906
- G06F16/908
- G16Y20/10
- CPC G06F16/906
- G06F30/3953
- CPC G06F30/3953
- G06T7/00
- G06V10/44
- G06V10/75
- G06V10/762
- CPC G06T7/0008
- G06T7/50
- G06T5/20
- G06T7/12
- CPC G06T7/50
- G06T7/70
- G06T7/55
- CPC G06T7/70
- G06T11/00
- G06T5/77
- G06T7/11
- G06T7/194
- G06T7/90
- G06V10/56
- G06V10/60
- G06V20/20
- CPC G06T11/00
- G06T13/20
- G06T13/40
- G10L15/02
- G10L15/06
- G10L21/028
- G10L25/63
- CPC G06T13/205
- G06T17/00
- G01C21/36
- CPC G06T17/00
- G06T17/20
- CPC G06T17/20
- G06T19/20
- G06F3/01
- G06F40/295
- G06F40/40
- G06V10/40
- G06V40/20
- CPC G06T19/20
- G06V40/13
- H05K1/18
- CPC G06V40/1318
- G09G3/00
- G09G3/20
- G09G3/3233
- G09G3/3275
- CPC G09G3/006
- G09G3/32
- CPC G09G3/32
- H10H29/32
- G09G3/3208
- CPC G09G3/3208
- G10K11/178
- H04R1/10
- H04R1/22
- H04R3/04
- H04R29/00
- CPC G10K11/17821
- G11C7/20
- G11C7/06
- G11C7/10
- G11C7/12
- CPC G11C7/20
- G11C7/22
- CPC G11C7/22
- G11C29/50
- CPC G11C7/222
- G11C11/4099
- G11C11/408
- G11C11/4097
- CPC G11C11/4099
- G11C16/34
- G11C16/26
- G11C29/52
- CPC G11C16/349
- G11C29/18
- CPC G11C29/18
- H01J37/32
- H01L21/3065
- CPC H01J37/32082
- CPC H01J37/32146
- CPC H01J37/32669
- H01L21/67
- CPC H01L21/67017
- CPC H01L21/67075
- H01L23/367
- H01L23/00
- H01L23/498
- CPC H01L23/3675
- H01L23/373
- H01L23/48
- H01L25/065
- CPC H01L23/3677
- H01L23/427
- CPC H01L23/427
- H01L23/28
- CPC H01L23/481
- H01L23/49
- H01L23/31
- H01L25/18
- CPC H01L23/49
- H01L23/538
- H01L25/10
- CPC H01L23/49816
- CPC H01L23/49822
- H01L23/528
- H01L23/544
- CPC H01L23/49838
- H01L25/03
- CPC H01L23/49894
- H01L23/522
- H10B12/00
- H10B80/00
- CPC H01L23/5283
- H01L29/06
- H01L29/417
- H01L29/423
- H01L29/775
- H01L29/786
- H01L21/56
- H01L27/092
- CPC H01L23/5286
- H01L23/532
- H01L21/768
- CPC H01L23/53295
- H01L23/535
- H10B41/27
- H10B41/41
- H10B43/27
- H10B43/40
- CPC H01L23/535
- H01L23/36
- H01L25/00
- CPC H01L23/5385
- H01L23/16
- CPC H01L24/05
- CPC H01L24/06
- CPC H01L24/08
- CPC H01L24/14
- H01L21/762
- CPC H01L24/16
- CPC H01L24/48
- B23K1/005
- B23K3/08
- B23K101/42
- CPC H01L24/75
- CPC H01L25/0657
- H03F3/24
- CPC H01L25/105
- H01L25/16
- CPC H01L25/167
- G02B6/125
- CPC H01L25/18
- H01Q1/24
- H01Q9/04
- H01Q9/16
- CPC H01Q1/243
- H01Q25/00
- H01Q1/38
- H01Q13/02
- H01Q21/06
- H01Q5/50
- H01Q1/50
- CPC H01Q5/50
- H02J7/00
- H02M1/00
- H02M3/158
- CPC H02J7/00712
- H02K7/116
- H05K5/00
- H05K5/02
- CPC H02K7/116
- H03F3/45
- H03F1/02
- CPC H03F3/45677
- H03L7/08
- H03L7/091
- H03L7/099
- CPC H03L7/0807
- H03L7/18
- H03L7/093
- H04B1/40
- CPC H03L7/18
- H04B1/04
- CPC H04B1/0475
- H04B1/713
- H04W72/0453
- H04W72/21
- CPC H04B1/713
- H04B7/0456
- CPC H04B7/0456
- H04B7/06
- H04W64/00
- CPC H04B7/0617
- H04W24/10
- CPC H04B7/0626
- H04W72/231
- H04W72/563
- H04W88/06
- CPC H04L5/0035
- H04L41/16
- CPC H04L5/0051
- H04W24/08
- H04W72/25
- CPC H04L5/0057
- H04L7/00
- H03K3/037
- CPC H04L7/0016
- H04L9/06
- H04L9/00
- CPC H04L9/0631
- H04L27/26
- H04W4/40
- H04W72/20
- H04W92/10
- CPC H04L27/2613
- H04L47/2416
- H04L47/12
- CPC H04L47/2416
- H04L47/32
- CPC H04L47/32
- H04L65/1073
- CPC H04L65/1073
- H04L65/75
- H04L1/00
- H04L27/18
- H04W4/80
- CPC H04L65/75
- H04L67/51
- H04L41/083
- H04L67/60
- H04W4/50
- CPC H04L67/51
- H04L69/164
- H04L65/80
- CPC H04L69/164
- H04M1/02
- CPC H04M1/0262
- H04M1/72403
- H04N23/63
- H05K1/02
- CPC H04M1/72403
- H04N19/169
- H04N19/82
- CPC H04N19/188
- H04N19/42
- H04N9/64
- H04N19/172
- H04N19/184
- CPC H04N19/42
- H04N19/625
- H04N19/12
- H04N19/176
- H04N19/61
- CPC H04N19/625
- H04N23/88
- CPC H04N23/88
- H04N25/77
- H04N25/11
- CPC H04N25/77
- H04R1/02
- H04R1/32
- CPC H04R1/028
- H04W4/02
- CPC H04W4/027
- H04W8/18
- CPC H04W8/183
- H04W8/20
- H04M15/00
- H04W4/38
- CPC H04W8/20
- H04W12/06
- H04W60/00
- CPC H04W12/06
- H04W56/00
- CPC H04W24/02
- CPC H04W24/10
- H04W76/20
- H04W28/02
- H04W88/04
- CPC H04W28/0231
- H04W28/06
- H04W76/15
- CPC H04W28/065
- H04W36/00
- H04W36/08
- CPC H04W36/0055
- CPC H04W36/0058
- CPC H04W36/0072
- H04W36/04
- CPC H04W36/04
- H04W80/02
- H04W36/06
- CPC H04W36/06
- H04B7/185
- H04W60/06
- H04W84/06
- CPC H04W36/083
- H04W40/12
- CPC H04W40/12
- H04W48/14
- H04W60/04
- H04W76/12
- CPC H04W48/14
- H04W52/02
- CPC H04W52/0206
- H04W60/02
- H04L67/55
- H04W8/00
- CPC H04W60/02
- CPC H04W60/04
- H04W68/02
- CPC H04W68/02
- H04W72/1268
- H04W72/232
- CPC H04W72/1268
- H04W72/1273
- H04L1/1812
- H04L5/14
- H04W72/0446
- CPC H04W72/1273
- H04W72/566
- CPC H04W72/25
- H04W76/14
- G01S13/74
- G06Q20/32
- CPC H04W76/14
- H04W72/56
- CPC H04W76/15
- CPC H04W76/20
- H04W76/28
- H04W72/23
- CPC H04W76/28
- H05H1/24
- G01K7/00
- CPC H05H1/24
- A61B5/01
- H01F7/02
- CPC H05K5/0086
- CPC H05K5/0217
- H05K7/20
- CPC H05K7/2019
- CPC H10B12/315
- G11C5/06
- H01L29/66
- H01L29/78
- CPC H10B12/482
- CPC H10B12/485
- CPC H10B12/488
- H10B41/35
- H10B43/35
- CPC H10B43/27
- H10B41/10
- H10B43/10
- H10B43/30
- CPC H10B43/30
- CPC H10B43/40
- H10B51/20
- H10B53/20
- CPC H10B51/20
- H10B61/00
- G01R33/09
- H10N50/10
- CPC H10B61/22
- CPC H10D30/6215
- H01L21/285
- H01L29/08
- H01L29/40
- H01L29/45
- CPC H10D30/6729
- H01L21/02
- CPC H10D30/6757
- H01L29/76
- CPC H10D48/362
- CPC H10D62/118
- H01L27/088
- CPC H10D62/121
- H01L29/49
- H01L21/822
- H01L21/8238
- H01L27/06
- CPC H10D62/151
- H01L29/04
- CPC H10D62/405
- H01L29/24
- H01L29/10
- CPC H10D62/80
- CPC H10D64/111
- CPC H10D64/62
- H01L27/02
- CPC H10D89/811
- H01L27/146
- CPC H10F39/8023
- CPC H10F39/8027
- H04N25/71
- H04N25/75
- CPC H10F39/807
- H01L31/173
- CPC H10F55/255
- H01L33/20
- H01L33/00
- H01L33/32
- H01L33/50
- CPC H10H20/819
- H01L33/46
- H01L25/075
- H01L33/02
- H01L33/06
- CPC H10H20/841
- H10N70/00
- C22C30/00
- H10B63/00
- CPC H10N70/8828